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LB1867M-TLM-E

Onsemi

LB1867M-TLM-E by Onsemi

LB1867M-TLM-E by Onsemi is a Motion Control IC with 12/24V power supplies, 14 terminals, and operating temperatures from -30 to 80 °C. It features a small outline package style for surface mount applications. Ideal for commercial extended temperature grade motion control systems.

Median Price

$0.620

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 93,000 parts In-Stock

1+ parts

$0.620

100+ parts

$0.610

1k+ parts

$0.600

10k+ parts

-

93,000

$0.620

$0.610

$0.600

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 860 parts In-Stock

1+ parts

$0.589

100+ parts

-

1k+ parts

-

10k+ parts

-

860

$0.589

-

-

-

Vyrian

USA . 8,851 parts In-Stock

1+ parts

-

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8,851

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 762 parts In-Stock

1+ parts

$0.558

100+ parts

-

1k+ parts

-

10k+ parts

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762

$0.558

-

-

-

Corohmni

South Africa . 291 parts In-Stock

1+ parts

$0.564

100+ parts

-

1k+ parts

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291

$0.564

-

-

-

AZTECH Wire

Italy . 1,111 parts In-Stock

1+ parts

$19.050

100+ parts

-

1k+ parts

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1,111

$19.050

-

-

-

Continental Prestige Electronics

USA . 23,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$0.546

10k+ parts

-

23,000

-

-

$0.546

-

TANS Electronics

Latvia . 5,791 parts In-Stock

1+ parts

-

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5,791

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SupplyDigital Components

Austria . 5,669 parts In-Stock

1+ parts

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5,669

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Kulean Microsystems

USA . 5,483 parts In-Stock

1+ parts

-

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5,483

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

1+ parts

-

100+ parts

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5,000

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Kepictronics

USA . 1,707 parts In-Stock

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1,707

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Assy Fe

Spain . 1,127 parts In-Stock

1+ parts

-

100+ parts

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1,127

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UHIMA Technologies

Türkiye . 493 parts In-Stock

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493

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Microchip USA

USA . 457 parts In-Stock

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457

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Problanco Electronics

Mexico . 59 parts In-Stock

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59

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Overview

Enhance your motion control applications with the LB1867M-TLM-E by Onsemi. Crafted with precision and quality, this product offers unparalleled performance and reliability in a compact and versatile package. Designed for power supplies of 12/24V, this motion control IC boasts 14 terminals and a temperature range from -30 to 80 °C. Whether you're looking to improve robotics, automation, or motor control systems, this product delivers exceptional value and benefits that will elevate your projects to new heights. Experience the difference with Onsemi's LB1867M-TLM-E and unlock endless possibilities in motion control technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy packaging ensures durability and reliability for the product, making it suitable for long-term use in various environments.

Surface Mount: YES

Being surface mountable allows for easier and more efficient assembly onto circuit boards, saving time and effort during production.

Power Supplies (V): 12/24

Supporting both 12V and 24V power supplies provides flexibility in usage and compatibility with a wide range of systems and applications.

No. of Terminals: 14

Having 14 terminals allows for multiple connections and interfaces, enabling more functionalities and features in the product.

Terminal Pitch: 1 mm

With a terminal pitch of 1mm, the product offers precise and compact connections, making it suitable for applications with limited space or high density requirements.

Maximum Operating Temperature: 80 °C

The high maximum operating temperature of 80 °C ensures that the product can perform reliably even in challenging thermal conditions or environments.

Technology: BIPOLAR

The bipolar technology used in the product offers high performance and stability, making it a reliable choice for motion control applications.

Moisture Sensitivity Level (MSL): 3

With a moisture sensitivity level of 3, the product is less susceptible to moisture damage during storage or use, increasing its longevity and reliability.

Technical Specifications

Motion Control ICs LB1867M-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G14

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

14

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-30 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP14,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12/24

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

50 mA

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Trade Compliance

LB1867M-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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