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LB1846M-TLM-E

Onsemi

LB1846M-TLM-E by Onsemi

LB1846M-TLM-E by Onsemi is a Motion Control IC with 10 terminals, operating at -20 to 70 °C. It has a supply voltage of 5V and max current of 40mA. Ideal for applications requiring small outline, shrink pitch packages in commercial temperature grades.

Median Price

$1.375

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 475 parts In-Stock

1+ parts

-

100+ parts

$1.220

1k+ parts

$1.010

10k+ parts

$0.903

475

-

$1.220

$1.010

$0.903

DigiKey

USA . 475 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.530

10k+ parts

-

475

-

-

$1.530

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,475 parts In-Stock

1+ parts

$0.947

100+ parts

-

1k+ parts

-

10k+ parts

-

2,475

$0.947

-

-

-

Vyrian

USA . 10,289 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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10k+ parts

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10,289

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-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 366 parts In-Stock

1+ parts

$0.897

100+ parts

-

1k+ parts

-

10k+ parts

-

366

$0.897

-

-

-

Corohmni

South Africa . 451 parts In-Stock

1+ parts

$0.997

100+ parts

-

1k+ parts

-

10k+ parts

-

451

$0.997

-

-

-

Component Stockers USA

USA . 1,172 parts In-Stock

1+ parts

$1.030

100+ parts

$0.970

1k+ parts

-

10k+ parts

-

1,172

$1.030

$0.970

-

-

SupplyDigital Components

Austria . 5,502 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

5,502

-

-

-

-

Authorized Procurement Solutions

USA . 4,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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4,000

-

-

-

-

Problanco Electronics

Mexico . 3,071 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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3,071

-

-

-

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TANS Electronics

Latvia . 2,524 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

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2,524

-

-

-

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Kepictronics

USA . 1,339 parts In-Stock

1+ parts

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1,339

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Kulean Microsystems

USA . 781 parts In-Stock

1+ parts

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100+ parts

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1k+ parts

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781

-

-

-

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UHIMA Technologies

Türkiye . 269 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

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10k+ parts

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269

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-

Overview

Enhance your motion control systems with the LB1846M-TLM-E by Onsemi, a top-quality solution designed to deliver precise and efficient performance. Onsemi, known for their superior products, brings you a reliable motion control IC that is ideal for a wide range of applications. From robotics to industrial automation, this product offers exceptional value by providing seamless control and enhancing overall system functionality. Trust Onsemi to deliver cutting-edge technology that ensures optimal results for your projects. Upgrade to the LB1846M-TLM-E today and experience the difference in performance and reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the motion control IC.

Surface Mount: YES

Easily mountable on circuit boards, making integration and assembly processes simpler.

Nominal Supply Voltage (Vsup): 5 V

Operates efficiently and effectively at a standard voltage level of 5V.

Maximum Operating Temperature: 70 °C

Capable of operating in a wide range of temperatures, providing flexibility for various applications.

Terminal Finish: Tin/Bismuth (Sn/Bi)

Tin/Bismuth finish offers good electrical conductivity and corrosion resistance for reliable performance.

Maximum Supply Current (Isup): 40 mA

Low power consumption at a maximum supply current of 40mA, enhancing energy efficiency.

Technical Specifications

Motion Control ICs LB1846M-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G10

JESD-609 Code:

e6

Moisture Sensitivity Level (MSL):

3

No. of Terminals:

10

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

-20 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP10,.25,40

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

40 mA

Nominal Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

Tin/Bismuth (Sn/Bi)

Terminal Form:

GULL WING

Terminal Pitch:

1 mm

Terminal Position:

DUAL

Trade Compliance

LB1846M-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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