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LB11868V-MPB-H

Onsemi

LB11868V-MPB-H by Onsemi

LB11868V-MPB-H by Onsemi is a Motion Control IC with 20 terminals, operating at -30 to 95 °C. It has a supply voltage range of 4-16 V and max output current of 0.03 A. Ideal for Disk Drive Motor Controllers due to its small outline package and low profile design.

Median Price

$1.350

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 291 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$0.996

10k+ parts

$0.888

291

-

$1.200

$0.996

$0.888

DigiKey

USA . 291 parts In-Stock

1+ parts

-

100+ parts

-

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$1.500

10k+ parts

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291

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$1.500

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Distributors (In-Stock)

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Digiode

USA . 959 parts In-Stock

1+ parts

$0.937

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-

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959

$0.937

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Vyrian

USA . 7,499 parts In-Stock

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7,499

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DigiKey Marketplace

USA . 291 parts In-Stock

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291

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Distributors (Availability)

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Corphita

USA . 932 parts In-Stock

1+ parts

$0.887

100+ parts

-

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932

$0.887

-

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Corohmni

South Africa . 119 parts In-Stock

1+ parts

$0.986

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119

$0.986

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QUARKTWIN TECHNOLOGY LTD

USA . 18,942 parts In-Stock

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18,942

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SupplyDigital Components

Austria . 8,050 parts In-Stock

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8,050

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Problanco Electronics

Mexico . 7,681 parts In-Stock

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7,681

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Kulean Microsystems

USA . 7,641 parts In-Stock

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7,641

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TANS Electronics

Latvia . 2,737 parts In-Stock

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2,737

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UHIMA Technologies

Türkiye . 926 parts In-Stock

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926

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Microchip USA

USA . 497 parts In-Stock

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497

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Continental Prestige Electronics

USA . 291 parts In-Stock

1+ parts

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100+ parts

$0.842

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291

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$0.842

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Overview

Upgrade your motion control system with the LB11868V-MPB-H by Onsemi, a top-quality IC designed for precision and reliability. Onsemi's reputation for excellence ensures that this product meets stringent industry standards, providing peace of mind to customers. Ideal for disk drive motor controllers, this IC offers seamless integration and superior performance. Enhance your applications with the value and benefits that only Onsemi can deliver. Trust the LB11868V-MPB-H to take your motion control to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Surface mount technology enables easy and efficient installation onto circuit boards, saving space and simplifying the manufacturing process.

Nominal Supply Voltage (Vsup): 12 V

The nominal supply voltage of 12V ensures compatibility with a wide range of systems and power sources, making it versatile and easy to integrate.

Technology: BIPOLAR

Bipolar technology offers high-speed performance and reliable operation, making it suitable for applications requiring precision and efficiency.

Maximum Output Current: 0.03 A

The high maximum output current of 0.03A allows for driving various loads with ease and efficiency, making it a versatile choice for different applications.

Technical Specifications

Motion Control ICs LB11868V-MPB-H attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G20

JESD-609 Code:

e6

Length:

5.2 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

20

Maximum Operating Temperature:

95 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

.03 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP20,.25,20

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

10.5 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

4 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.5 mm

Terminal Position:

DUAL

Width (mm):

4.4 mm

Trade Compliance

LB11868V-MPB-H Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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