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LB11697V-TLM-E

Onsemi

LB11697V-TLM-E by Onsemi

LB11697V-TLM-E by Onsemi is a Motion Control IC with 30 terminals, operating at -20 to 100 °C. It has a supply voltage range of 8-17 V and output current of 0.03 A. Ideal for Brushless DC Motor Controllers, this IC is compact (9.75x5.6 mm) and surface-mountable, making it suitable for various motion control applications.

Median Price

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Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

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Vyrian

USA . 6,593 parts In-Stock

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Digiode

USA . 1,481 parts In-Stock

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Ashlea Components Ltd

UK . 885 parts In-Stock

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AZTECH Wire

Italy . 818 parts In-Stock

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$11.790

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Advanced Electronics

New Zealand . 200 parts In-Stock

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$12.331

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$11.221

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$10.111

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Component Stockers USA

USA . 411 parts In-Stock

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$99.990

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Problanco Electronics

Mexico . 6,695 parts In-Stock

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SupplyDigital Components

Austria . 6,653 parts In-Stock

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Microchip USA

USA . 5,731 parts In-Stock

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TANS Electronics

Latvia . 5,550 parts In-Stock

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Kulean Microsystems

USA . 4,080 parts In-Stock

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Kepictronics

USA . 2,000 parts In-Stock

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Corphita

USA . 1,608 parts In-Stock

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UHIMA Technologies

Türkiye . 789 parts In-Stock

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Corohmni

South Africa . 227 parts In-Stock

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Overview

Experience the seamless and efficient motion control capabilities of the LB11697V-TLM-E by Onsemi. Crafted with precision and quality, this Brushless DC Motor Controller offers unparalleled performance in a compact package. Perfect for a wide range of applications, this innovative IC provides customers with reliable and precise control over their motor systems. Say goodbye to inefficiencies and hello to optimized performance with the LB11697V-TLM-E. Elevate your projects with Onsemi's cutting-edge technology today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the package lightweight and durable, ensuring the product can withstand various operating conditions.

Nominal Supply Voltage (Vsup): 12 V

Operating at a nominal supply voltage of 12V ensures compatibility with standard power sources, making it easy to integrate into existing systems.

Maximum Operating Temperature: 100 °C

With a maximum operating temperature of 100 °C, this product is suitable for use in high-temperature environments without the risk of overheating.

Width (mm): 5.6 mm

The compact width of 5.6mm allows for space-saving installation in tight spaces or densely packed electronic assemblies.

Technology: BIPOLAR

Utilizing bipolar technology ensures precise control and efficient operation of the motion control ICs, making them ideal for applications requiring accurate motor control.

Technical Specifications

Motion Control ICs LB11697V-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Additional Features:

ALSO OPEARSTES WITH 4.5V TO 5.5V

JESD-30 Code:

R-PDSO-G30

JESD-609 Code:

e6

Length:

9.75 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

30

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-20 Cel

Maximum Output Current:

.03 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP30,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, LOW PROFILE, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

12

Qualification:

Not Qualified

Maximum Seated Height:

1.5 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

16 mA

Maximum Supply Voltage (Vsup):

17 V

Minimum Supply Voltage (Vsup):

8 V

Nominal Supply Voltage (Vsup):

12 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width (mm):

5.6 mm

Trade Compliance

LB11697V-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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