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LB11693H-TLM-E

Onsemi

LB11693H-TLM-E by Onsemi

LB11693H-TLM-E by Onsemi is a Motion Control IC with 24V supply, 1.8A output current, and -30 to 100 °C operating temperature range. Ideal for Brushless DC Motor Controllers in applications requiring small outline packages with gull wing terminals.

Median Price

$2.625

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 390 parts In-Stock

1+ parts

-

100+ parts

$2.430

1k+ parts

$2.180

10k+ parts

$2.050

390

-

$2.430

$2.180

$2.050

DigiKey

USA . 390 parts In-Stock

1+ parts

-

100+ parts

-

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$2.820

10k+ parts

$2.820

390

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-

$2.820

$2.820

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,093 parts In-Stock

1+ parts

$2.574

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1,093

$2.574

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Vyrian

USA . 11,470 parts In-Stock

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11,470

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Distributors (Availability)

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Corphita

USA . 2,158 parts In-Stock

1+ parts

$2.439

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2,158

$2.439

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Corohmni

South Africa . 288 parts In-Stock

1+ parts

$2.710

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-

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288

$2.710

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QUARKTWIN TECHNOLOGY LTD

USA . 28,529 parts In-Stock

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28,529

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Microchip USA

USA . 5,036 parts In-Stock

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5,036

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Problanco Electronics

Mexico . 3,763 parts In-Stock

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3,763

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TANS Electronics

Latvia . 3,246 parts In-Stock

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3,246

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Kulean Microsystems

USA . 2,828 parts In-Stock

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2,828

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SupplyDigital Components

Austria . 1,394 parts In-Stock

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1,394

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UHIMA Technologies

Türkiye . 587 parts In-Stock

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587

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Overview

Experience the power of seamless motion control with the LB11693H-TLM-E by Onsemi. As a leading manufacturer in the industry, Onsemi has crafted this innovative Motion Control IC to deliver unparalleled precision and reliability. Ideal for applications in brushless DC motor controllers, this compact and versatile IC offers a wide supply voltage range and high output current, making it the perfect choice for a variety of projects. Trust Onsemi to provide you with top-quality products that prioritize performance and efficiency, ensuring your success every step of the way. Elevate your motion control experience with the LB11693H-TLM-E today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the IC, making it suitable for various environments and applications.

Nominal Supply Voltage (Vsup): 24 V

Operating at a common supply voltage of 24V allows for compatibility with many systems and power sources.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature ensures reliable performance even in challenging thermal conditions.

Technology: BIPOLAR

Bipolar technology offers fast switching speeds and precise control, ideal for motion control applications.

Maximum Output Current: 1.8 A

This high output current capability allows for driving power-hungry loads, making it versatile for different motor control requirements.

Technical Specifications

Motion Control ICs LB11693H-TLM-E attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G36

JESD-609 Code:

e6

Length:

17.8 mm

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

36

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-30 Cel

Maximum Output Current:

1.8 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SOP36/44,.4,32

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Power Supplies (V):

24

Qualification:

Not Qualified

Maximum Seated Height:

2.45 mm

Sub-Category:

Motion Control Electronics

Maximum Supply Current (Isup):

13.5 mA

Maximum Supply Voltage (Vsup):

28 V

Minimum Supply Voltage (Vsup):

9.5 V

Nominal Supply Voltage (Vsup):

24 V

Surface Mount:

YES

Technology:

BIPOLAR

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

DUAL

Width (mm):

7.9 mm

Trade Compliance

LB11693H-TLM-E Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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