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LA4450

Onsemi

LA4450 by Onsemi

LA4450 by Onsemi is a 14-terminal audio amplifier IC with max supply current of 140mA. Operating temp range from -35 °C to 80°C, suitable for commercial extended applications. Utilizes bipolar technology in plastic/epoxy package for audio & video amplification needs.

Median Price

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Lifecycle Status

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Vyrian

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Digiode

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Fibra_Brandt Electronic GMBH

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R&J Components

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Cyclops Electronics Ltd

UK . 20 parts In-Stock

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Elcom Components

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LittleDiode

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Prism Electronics

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MRC Electronics

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ACDS - Activité Composants Distribution Service

France . 2 parts In-Stock

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Donberg Electronics Ltd

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GES GmbH

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MISTER SPROCKETS

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ECAB

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Kulean Microsystems

USA . 6,261 parts In-Stock

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Problanco Electronics

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TANS Electronics

Latvia . 2,757 parts In-Stock

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SupplyDigital Components

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Kepictronics

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UHIMA Technologies

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Corphita

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Corohmni

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Perfect Parts

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Assy Fe

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Overview

Enhance your audio and video experience with the LA4450 from Onsemi. With a reputation for quality and reliability, Onsemi delivers cutting-edge technology in the audio amplifier category. This versatile product offers customers unmatched value, providing crystal-clear sound and seamless integration into a variety of applications. Whether you're looking to upgrade your home entertainment system or enhance your professional audio setup, the LA4450 is the perfect choice for those seeking top-notch performance and exceptional results. Elevate your audio experience today with Onsemi's LA4450.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material is durable and lightweight, making the amplifier easy to handle and install.

No. of Functions: 2

Having 2 functions allows for more versatility and flexibility in audio amplification, making this product suitable for a variety of applications.

General IC Type: AUDIO AMPLIFIER

Being specifically designed for audio amplification ensures high-quality sound output and performance.

No. of Terminals: 14

With 14 terminals, this amplifier can accommodate a wide range of connections and configurations, enhancing compatibility with different systems.

Maximum Operating Temperature: 80 °C

The high maximum operating temperature ensures stable performance even in demanding conditions, making this amplifier reliable for prolonged use.

Minimum Operating Temperature: -35 °C

The low minimum operating temperature allows the amplifier to function effectively in colder environments, increasing its versatility.

Terminal Position: SINGLE

SINGLE terminal position simplifies installation and wiring, making the amplifier user-friendly and convenient to set up.

Temperature Grade: COMMERCIAL EXTENDED

COMMERCIAL EXTENDED temperature grade indicates that this amplifier can withstand higher temperatures than standard models, ensuring durability and reliability in various environments.

Technology: BIPOLAR

BIPOLAR technology offers better amplification characteristics, delivering high-quality audio output with low distortion, making this amplifier an excellent choice for audio enthusiasts.

Maximum Supply Current: 140 mA

With a maximum supply current of 140 mA, this amplifier consumes power efficiently while still providing ample power for audio amplification.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm allows for easy connections and compatibility with standard wire sizes, simplifying installation and maintenance.

Technical Specifications

Audio & Video Amplifiers LA4450 attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

No. of Functions:

2

No. of Terminals:

14

Maximum Operating Temperature:

80 Cel

Minimum Operating Temperature:

-35 Cel

Package Body Material:

PLASTIC/EPOXY

Package Equivalence Code:

SIP14,.08TB

Qualification:

Not Qualified

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

140 mA

Surface Mount:

NO

Technology:

BIPOLAR

Temperature Grade:

Terminal Pitch:

2.54 mm

Terminal Position:

SINGLE

Trade Compliance

LA4450 General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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