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LA4425PV-TLM-H

Onsemi

LA4425PV-TLM-H by Onsemi

LA4425PV-TLM-H by Onsemi is an audio amplifier IC with 44 terminals. It offers 6W nominal output power, 0.1% harmonic distortion, and operates b/w -40 to 85 °C. Ideal for audio and video applications requiring a compact design and high-quality sound amplification.

Median Price

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Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

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Flip Electronics (Authorized)

USA . 102,000 parts In-Stock

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Flip Electronics

USA . 208,000 parts In-Stock

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Cyclops Electronics Ltd

UK . 172,000 parts In-Stock

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Chip Stock

USA . 5,370 parts In-Stock

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Vyrian

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Digiode

USA . 1,961 parts In-Stock

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AZTECH Wire

Italy . 515 parts In-Stock

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$18.570

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Component Stockers USA

USA . 365 parts In-Stock

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$99.990

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GreenTree Electronics

Israel . 36,000 parts In-Stock

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Kulean Microsystems

USA . 4,244 parts In-Stock

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Authorized Procurement Solutions

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Problanco Electronics

Mexico . 1,229 parts In-Stock

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TANS Electronics

Latvia . 1,134 parts In-Stock

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SupplyDigital Components

Austria . 991 parts In-Stock

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UHIMA Technologies

Türkiye . 526 parts In-Stock

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Corohmni

South Africa . 425 parts In-Stock

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Microchip USA

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Overview

The LA4425PV-TLM-H by Onsemi is a game-changer in the audio amplifier category, offering unparalleled quality and performance. With a nominal output power of 6W and harmonic distortion of just 0.1%, this small outline package delivers crystal-clear sound for a wide range of applications. Designed with a focus on reliability and efficiency, this product ensures that your audio needs are met with ease. Trust Onsemi to provide you with cutting-edge technology that enhances your audio experience like never before. Elevate your sound with the LA4425PV-TLM-H!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the internal components of the amplifier, ensuring a longer lifespan.

Harmonic Distortion: 0.1 %

Low harmonic distortion ensures high-quality audio output with minimal signal interference or distortion.

Nominal Output Power: 6 W

A high nominal output power of 6W enables the amplifier to drive speakers effectively, providing clear and powerful sound.

Maximum Operating Temperature: 85 °C

With a maximum operating temperature of 85 °C, the amplifier can perform reliably even in high-temperature environments.

Minimum Supply Voltage (Vsup): 5 V

The low minimum supply voltage of 5V allows for flexible power input options, making it suitable for a variety of applications.

Technical Specifications

Audio & Video Amplifiers LA4425PV-TLM-H attributes and parameters. Explore more Audio & Video Amplifiers devices from Onsemi

Specs

General IC Type:

Harmonic Distortion:

.1 %

JESD-30 Code:

R-PDSO-G44

JESD-609 Code:

e6

Length:

15 mm

Moisture Sensitivity Level (MSL):

3

No. of Channels:

1

No. of Functions:

1

No. of Terminals:

44

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Nominal Output Power:

6 W

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP44,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, HEAT SINK/SLUG, SHRINK PITCH

Peak Reflow Temperature (C):

260

Power Supplies (V):

13.2

Qualification:

Not Qualified

Maximum Seated Height:

1.7 mm

Sub-Category:

Audio/Video Amplifiers

Maximum Supply Current:

130 mA

Maximum Supply Voltage (Vsup):

16 V

Minimum Supply Voltage (Vsup):

5 V

Surface Mount:

YES

Temperature Grade:

Terminal Finish:

TIN BISMUTH

Terminal Form:

Terminal Pitch:

.65 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Width:

5.6 mm

Trade Compliance

LA4425PV-TLM-H General Purpose ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.33.00.01

SB

8542.33.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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