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FSL518ALR2G

Onsemi

FSL518ALR2G by Onsemi

FSL518ALR2G by Onsemi is a switching controller with 7 terminals, operating at -40 to 125 °C. It has a max output current of 0.93 A and operates at a max frequency of 138 kHz. Ideal for automotive applications due to its compact size and pulse width modulation control mode.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 822 parts In-Stock

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Digiode

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Native Components

USA . 776 parts In-Stock

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$4.970

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Kulean Microsystems

USA . 3,917 parts In-Stock

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TANS Electronics

Latvia . 3,437 parts In-Stock

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Problanco Electronics

Mexico . 2,837 parts In-Stock

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Corphita

USA . 2,086 parts In-Stock

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SupplyDigital Components

Austria . 1,907 parts In-Stock

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Northwest PG Solutions

USA . 980 parts In-Stock

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UHIMA Technologies

Türkiye . 932 parts In-Stock

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Corohmni

South Africa . 89 parts In-Stock

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Overview

Experience unmatched quality and reliability with the FSL518ALR2G by Onsemi, a leading manufacturer in the industry of Switching Regulators & Controllers. This innovative product offers a wide range of applications with its cutting-edge technology and superior performance. Customers can trust in the value and benefits that this product brings, from its compact design to its high efficiency operation. Upgrade your electronics with the FSL518ALR2G and enjoy the advantages it provides for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for applications where weight and durability are important factors.

Surface Mount: YES

Being surface mountable makes the product suitable for compact and high-density PCB designs, saving space and allowing for more efficient layouts.

Nominal Supply Voltage (Vsup): 14 V

With a nominal supply voltage of 14 V, the product is designed to handle common voltage levels found in many applications, providing compatibility and ease of integration.

No. of Terminals: 7

Having 7 terminals allows for versatile connectivity options and potential for customization in various circuit configurations, offering flexibility in design.

Control Mode: CURRENT-MODE

The current-mode control mode ensures stable and efficient operation by regulating the output based on the current, providing better performance and response to changes in load.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125 °C ensures reliability and performance even under harsh operating conditions, making it suitable for a wide range of applications.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40 °C allows the product to operate in cold environments without compromising performance, increasing its versatility.

Maximum Seated Height: 3.7 mm

The low maximum seated height of 3.7 mm enhances space efficiency and allows for compact designs, making it suitable for applications with size constraints.

Maximum Switching Frequency: 138 kHz

The high maximum switching frequency of 138 kHz enables fast response and fine control over the output, providing precision and efficiency in regulating voltage.

Maximum Output Current: 0.93 A

With a maximum output current of 0.93 A, the product can deliver sufficient power for various loads, making it versatile and capable of handling different applications.

Technical Specifications

Switching Regulators & Controllers FSL518ALR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

9 V

Nominal Input Voltage:

14 V

JESD-30 Code:

R-PDIP-G7

Length:

9.55 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.93 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

GWDIP7/8,.4

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3.7 mm

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Maximum Switching Frequency:

138 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

FSL518ALR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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