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FSL538APLR2G

Onsemi

FSL538APLR2G by Onsemi

FSL538APLR2G by Onsemi is a switching controller with current-mode control technique. It operates in automotive temperature grade range (-40 to 125 °C) and has a max output current of 0.93 A at a max switching frequency of 138 kHz. This IC is suitable for applications requiring efficient power management in compact spaces.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,330 parts In-Stock

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Digiode

USA . 2,263 parts In-Stock

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TANS Electronics

Latvia . 5,409 parts In-Stock

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SupplyDigital Components

Austria . 5,016 parts In-Stock

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Kulean Microsystems

USA . 3,767 parts In-Stock

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Problanco Electronics

Mexico . 2,740 parts In-Stock

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Corphita

USA . 2,048 parts In-Stock

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Northwest PG Solutions

USA . 1,851 parts In-Stock

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UHIMA Technologies

Türkiye . 725 parts In-Stock

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Native Components

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Corohmni

South Africa . 229 parts In-Stock

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Overview

Discover the exceptional quality and reliability of the FSL538APLR2G by Onsemi. As a leader in Switching Regulators & Controllers, Onsemi delivers cutting-edge technology with a focus on customer satisfaction. This versatile product is perfect for a wide range of applications, providing efficient power management and control. With its compact design and high-performance capabilities, the FSL538APLR2G offers unmatched value and benefits to customers looking for a reliable solution. Trust Onsemi for all your power management needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic package body material ensures durability and reliability, making the product suitable for various environments.

Surface Mount: YES

Surface mount capability allows for easy integration onto PCBs, saving space and making assembly more efficient.

Package Shape: RECTANGULAR

Rectangular package shape makes it easier to place and align on the circuit board, promoting ease of installation.

No. of Terminals: 7

Having 7 terminals allows for multiple connections, enabling flexibility in circuit design and functionality.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stable performance even in harsh conditions, making it suitable for automotive applications.

Control Mode: CURRENT-MODE

Current-mode control offers precise regulation and fast transient response, enhancing overall efficiency and performance.

Nominal Input Voltage: 14 V

With a nominal input voltage of 14V, the product is ideal for applications requiring stable power supply within this range.

Maximum Output Current: 0.93 A

High maximum output current allows for powering multiple components or devices, making it versatile for various applications.

Technical Specifications

Switching Regulators & Controllers FSL538APLR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

9 V

Nominal Input Voltage:

14 V

JESD-30 Code:

R-PDIP-G7

Length:

9.55 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.93 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

GWDIP7/8,.4

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3.7 mm

Surface Mount:

YES

Maximum Switching Frequency:

138 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

FSL538APLR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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