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FSL518APLR2G

Onsemi

FSL518APLR2G by Onsemi

FSL518APLR2G by Onsemi is a switching controller with 7 terminals, operating temperature range of -40 to 125 °C. It features a max output current of 0.93 A, control mode in current-mode, and pulse width modulation technique. Ideal for automotive applications due to its compact rectangular package style and surface mount capability.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,321 parts In-Stock

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Vyrian

USA . 1,389 parts In-Stock

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Northwest PG Solutions

USA . 2,270 parts In-Stock

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$2.519

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Problanco Electronics

Mexico . 6,468 parts In-Stock

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TANS Electronics

Latvia . 5,129 parts In-Stock

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Corphita

USA . 2,361 parts In-Stock

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SupplyDigital Components

Austria . 1,049 parts In-Stock

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Native Components

USA . 989 parts In-Stock

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Kulean Microsystems

USA . 504 parts In-Stock

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UHIMA Technologies

Türkiye . 450 parts In-Stock

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Corohmni

South Africa . 124 parts In-Stock

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Overview

Unleash the power of efficient and reliable performance with the FSL518APLR2G by Onsemi. As a leading manufacturer in the industry, Onsemi ensures top-notch quality and durability in their products, making this switching regulator a standout choice. Ideal for a wide range of applications, this product offers unparalleled value to customers with its cutting-edge technology and innovative design. Experience the benefits of seamless operation and enhanced functionality with the FSL518APLR2G, setting new standards in the field of switching regulators and controllers. Choose Onsemi for superior performance and unmatched reliability.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy body material makes the product durable and can withstand potential impacts during operation.

Surface Mount: YES

The surface mount capability allows for easy and efficient integration into circuit boards.

No. of Terminals: 7

Having 7 terminals provides flexibility in connecting the regulator/controller to other components in the circuit.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliable performance even in demanding environments.

Control Mode: CURRENT-MODE

The current-mode control mode offers precise current regulation and stability.

Nominal Input Voltage: 14 V

The 14V nominal input voltage allows the regulator/controller to work effectively with various power sources.

Maximum Switching Frequency: 138 kHz

The high maximum switching frequency enables efficient power conversion and regulation.

Maximum Output Current: 0.93 A

The 0.93A maximum output current is suitable for powering a variety of electronic devices and components.

Control Technique: PULSE WIDTH MODULATION

The pulse width modulation control technique allows for precise and efficient control of the output voltage.

Minimum Input Voltage: 9 V

The 9V minimum input voltage ensures compatibility with a wide range of power sources.

Technical Specifications

Switching Regulators & Controllers FSL518APLR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

9 V

Nominal Input Voltage:

14 V

JESD-30 Code:

R-PDIP-G7

Length:

9.55 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.93 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

GWDIP7/8,.4

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3.7 mm

Surface Mount:

YES

Maximum Switching Frequency:

138 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

FSL518APLR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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