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FSL538HPLR2G

Onsemi

FSL538HPLR2G by Onsemi

FSL538HPLR2G by Onsemi is a switching controller with 7 terminals, operating b/w -40 to 125 °C. It has a max output current of 0.93 A and operates at a frequency of 138 kHz. Ideal for automotive applications due to its compact size and pulse width modulation control mode.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,891 parts In-Stock

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Vyrian

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Native Components

USA . 567 parts In-Stock

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$1.858

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Northwest PG Solutions

USA . 2,188 parts In-Stock

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SupplyDigital Components

Austria . 7,117 parts In-Stock

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Kulean Microsystems

USA . 6,855 parts In-Stock

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Problanco Electronics

Mexico . 2,572 parts In-Stock

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Corphita

USA . 625 parts In-Stock

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Corohmni

South Africa . 316 parts In-Stock

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UHIMA Technologies

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TANS Electronics

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Overview

Unlock the power of efficiency and performance with the FSL538HPLR2G by Onsemi. This cutting-edge switching regulator offers unparalleled quality and reliability, backed by a trusted manufacturer in the industry. Ideal for a wide range of applications, this product delivers superior value and benefits to customers looking for high-performance solutions. Experience seamless operation and optimized functionality with the FSL538HPLR2G - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material in the package body makes the product lightweight and durable, ideal for automotive applications.

Surface Mount: YES

Being surface mountable allows for easy and convenient installation on circuit boards, saving space and simplifying manufacturing processes.

Nominal Supply Voltage (Vsup): 14 V

The 14V nominal supply voltage provides compatibility with a wide range of automotive and industrial power systems.

No. of Terminals: 7

Having 7 terminals offers flexibility in connecting the regulator to different components, enabling versatile applications.

Control Mode: CURRENT-MODE

The current-mode control allows for stable and precise regulation of the output current, ensuring reliable performance in various operating conditions.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125 °C, the product can withstand harsh environmental conditions and maintain efficient operation.

Width (mm): 7.62 mm

The compact width of 7.62mm enables the regulator to fit into tight spaces and densely populated circuit boards.

Control Technique: PULSE WIDTH MODULATION

Pulse width modulation control technique allows for efficient and precise regulation of the output voltage, enhancing overall performance.

Technical Specifications

Switching Regulators & Controllers FSL538HPLR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

9 V

Nominal Input Voltage:

14 V

JESD-30 Code:

R-PDIP-G7

Length:

9.55 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.93 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

GWDIP7/8,.4

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3.7 mm

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Maximum Switching Frequency:

138 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

FSL538HPLR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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