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FSL518HPLR2G

Onsemi

FSL518HPLR2G by Onsemi

FSL518HPLR2G by Onsemi is a switching controller with 7 terminals, operating b/w -40 to 125 °C. It has a max output current of 0.93 A and operates at a frequency of 138 kHz. Ideal for automotive applications due to its compact size and pulse width modulation control technique.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 2,162 parts In-Stock

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Native Components

USA . 94 parts In-Stock

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$18.040

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Northwest PG Solutions

USA . 866 parts In-Stock

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$17.860

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SupplyDigital Components

Austria . 5,863 parts In-Stock

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Problanco Electronics

Mexico . 5,665 parts In-Stock

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TANS Electronics

Latvia . 5,074 parts In-Stock

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Corphita

USA . 1,723 parts In-Stock

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Kulean Microsystems

USA . 1,426 parts In-Stock

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UHIMA Technologies

Türkiye . 969 parts In-Stock

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Authorized Procurement Solutions

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Corohmni

South Africa . 461 parts In-Stock

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Overview

Experience the power of efficiency with the FSL518HPLR2G by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality switching regulators & controllers that provide reliable performance and durability. Ideal for automotive applications, this product offers a wide range of benefits including precise control and high efficiency operation. Elevate your projects with the FSL518HPLR2G and enjoy the value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good durability and protection for the internal components of the regulator.

Surface Mount: YES

Allows for easy and efficient installation on a circuit board.

Nominal Supply Voltage (Vsup): 14 V

Suitable for applications that require a stable 14V power supply.

No. of Terminals: 7

Offers flexibility in connecting various components in the circuit.

Control Mode: CURRENT-MODE

Provides precise control of the output current, resulting in stable voltage regulation.

Maximum Operating Temperature: 125 °C

Ensures reliable performance even in high-temperature environments.

Minimum Operating Temperature: -40 °C

Suitable for use in extreme cold conditions.

Maximum Output Current: 0.93 A

Capable of delivering a maximum output current of 0.93A, suitable for various applications.

Technical Specifications

Switching Regulators & Controllers FSL518HPLR2G attributes and parameters. Explore more Switching Regulators & Controllers devices from Onsemi

Specs

Other IC type:

Control Mode:

CURRENT-MODE

Control Technique:

PULSE WIDTH MODULATION

Minimum Input Voltage:

9 V

Nominal Input Voltage:

14 V

JESD-30 Code:

R-PDIP-G7

Length:

9.55 mm

No. of Functions:

1

No. of Terminals:

7

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

.93 A

Package Body Material:

PLASTIC/EPOXY

Package Code:

DIP

Package Equivalence Code:

GWDIP7/8,.4

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Maximum Seated Height:

3.7 mm

Nominal Supply Voltage (Vsup):

14 V

Surface Mount:

YES

Maximum Switching Frequency:

138 kHz

Temperature Grade:

Terminal Form:

GULL WING

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width (mm):

7.62 mm

Trade Compliance

FSL518HPLR2G Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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