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FSBF15CH60BT

Onsemi

FSBF15CH60BT by Onsemi

FSBF15CH60BT by Onsemi is a Motion Control IC with 27 terminals, operating voltage range of 13.5V to 16.5V, and max output current of 30A. Ideal for automotive applications due to its temp range -40 °C to 125°C and AC motor controller type for efficient control in various systems.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,409 parts In-Stock

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Digiode

USA . 660 parts In-Stock

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660

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Perfect Parts

USA . 28,582 parts In-Stock

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28,582

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TANS Electronics

Latvia . 7,607 parts In-Stock

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A-Z Elektronik GmbH

Germany . 7,229 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,819 parts In-Stock

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Problanco Electronics

Mexico . 4,556 parts In-Stock

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Kulean Microsystems

USA . 3,908 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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S.R.D Solutions

India . 3,000 parts In-Stock

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Corphita

USA . 2,441 parts In-Stock

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SupplyDigital Components

Austria . 2,390 parts In-Stock

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Supply Digital

USA . 2,273 parts In-Stock

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UHIMA Technologies

Türkiye . 795 parts In-Stock

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Corohmni

South Africa . 385 parts In-Stock

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Northwest PG Solutions

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Native Components

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Overview

Discover the power and precision of the FSBF15CH60BT by Onsemi, a top-of-the-line Motion Control IC that sets the standard for quality and performance. With its innovative design and automotive-grade temperature grade, this AC Motor Controller offers unparalleled reliability and efficiency. Whether you're looking to enhance the functionality of your vehicle or optimize industrial automation processes, this versatile IC will deliver exceptional results. Trust Onsemi to provide cutting-edge solutions that exceed expectations and bring value to every project.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for easy integration into different electronic systems and saves space in the overall design.

Nominal Supply Voltage (Vsup): 15 V

Optimal voltage level ensures efficient operation of the motion control IC, leading to reliable performance.

No. of Terminals: 27

Sufficient number of terminals provide flexibility in connecting various components, enabling custom configurations.

Package Style: MICROELECTRONIC ASSEMBLY

Microelectronic assembly style enhances the durability and longevity of the motion control IC, making it suitable for long-term use.

Maximum Operating Temperature: 125 °C

High maximum operating temperature ensures stability and resilience in harsh environmental conditions, ideal for automotive applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature allows the motion control IC to function effectively in cold weather conditions, ensuring reliability in various climates.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and corrosion resistance, ensuring long-term reliability in electrical connections.

Terminal Position: DUAL

Dual terminal position offers increased flexibility in installation and connection options, suitable for a variety of system configurations.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for AC motor control, ensuring precise and efficient performance in motor control applications.

Minimum Supply Voltage (Vsup): 13.5 V

Low minimum supply voltage allows for operation in systems with limited power sources, enhancing compatibility and versatility.

Temperature Grade: AUTOMOTIVE

Automotive temperature grade indicates reliable performance in high-temperature environments commonly found in automotive applications.

Maximum Output Current: 30 A

High maximum output current capability allows for controlling powerful motors, making it suitable for a wide range of motion control applications.

Terminal Form: THROUGH-HOLE

Through-hole terminal form allows for easy and secure through-board mounting, ensuring stable connections and mechanical strength.

Maximum Supply Voltage (Vsup): 16.5 V

High maximum supply voltage capability provides operational flexibility and compatibility with various power sources, enhancing versatility.

Technical Specifications

Motion Control ICs FSBF15CH60BT attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T27

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

27

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

30 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

FSBF15CH60BT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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