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FSBF10CH60BT

Onsemi

FSBF10CH60BT by Onsemi

FSBF10CH60BT by Onsemi is a Motion Control IC with 27 terminals and a supply voltage range of 13.5V to 16.5V. It operates in temperatures from -40 °C to 125°C, making it suitable for automotive applications as an AC motor controller with a max output current of 20A.

Median Price

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Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Flip Electronics

USA . 7,800 parts In-Stock

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Digiode

USA . 2,277 parts In-Stock

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2,277

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Vyrian

USA . 1,544 parts In-Stock

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1,544

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ACDS - Activité Composants Distribution Service

France . 8 parts In-Stock

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Cyclops Electronics Ltd

UK . 1 parts In-Stock

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1

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Distributors (Availability)

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Ampacity Inc.

Singapore . 191 parts In-Stock

1+ parts

$2.500

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$2.500

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Native Components

USA . 978 parts In-Stock

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$86.294

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$82.842

978

$86.294

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$82.842

Northwest PG Solutions

USA . 1,401 parts In-Stock

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$94.923

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1,401

$94.923

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SupplyDigital Components

Austria . 4,886 parts In-Stock

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Kulean Microsystems

USA . 2,862 parts In-Stock

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2,862

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Problanco Electronics

Mexico . 2,319 parts In-Stock

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2,319

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Corphita

USA . 2,128 parts In-Stock

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Perfect Parts

USA . 1,422 parts In-Stock

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Authorized Procurement Solutions

USA . 1,020 parts In-Stock

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GreenTree Electronics

Israel . 1,020 parts In-Stock

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Supply Digital

USA . 920 parts In-Stock

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920

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TANS Electronics

Latvia . 582 parts In-Stock

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582

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Corohmni

South Africa . 437 parts In-Stock

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437

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UHIMA Technologies

Türkiye . 76 parts In-Stock

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76

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Overview

Enhance your motion control applications with the FSBF10CH60BT by Onsemi. As a trusted manufacturer in the industry, Onsemi delivers top-quality products that exceed expectations. This AC motor controller offers unparalleled performance and reliability, making it ideal for automotive environments. With a maximum output current of 20A and a wide operating temperature range, this microelectronic assembly provides exceptional value and benefits to customers seeking precise motion control solutions. Upgrade your systems today with the FSBF10CH60BT and experience the difference in efficiency and performance.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular package shape allows for easy integration into various electronic systems and circuit boards.

Nominal Supply Voltage (Vsup): 15 V

Ideal supply voltage for efficient and reliable operation of the motion control ICs.

No. of Terminals: 27

Sufficient number of terminals for connecting to external components and peripherals.

Package Style: MICROELECTRONIC ASSEMBLY

Microelectronic assembly ensures compact size and efficient performance of the motion control ICs.

Maximum Operating Temperature: 125 °C

High maximum operating temperature allows for use in a wide range of environments and applications.

Minimum Operating Temperature: -40 °C

Low minimum operating temperature ensures reliability in extreme cold conditions.

Terminal Finish: TIN

Tin terminal finish provides good conductivity and durability for long-lasting performance.

Terminal Position: DUAL

Dual terminal position for versatility in connection options and ease of installation.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for controlling AC motors, making it a perfect choice for motor control applications.

Minimum Supply Voltage (Vsup): 13.5 V

Low minimum supply voltage allows for flexibility in power supply options and energy efficiency.

Temperature Grade: AUTOMOTIVE

Designed to meet automotive industry standards for temperature tolerance and reliability in vehicle applications.

Maximum Output Current: 20 A

High maximum output current for driving motors and other high current devices.

Terminal Form: THROUGH-HOLE

Through-hole terminal form for easy soldering and secure connections to circuit boards and external components.

Maximum Supply Voltage (Vsup): 16.5 V

Maximim supply voltage provides a safety margin and ensures stable operation under varying voltage conditions.

Technical Specifications

Motion Control ICs FSBF10CH60BT attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T27

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

27

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

20 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

FSBF10CH60BT Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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