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FSBF10CH60B

Onsemi

FSBF10CH60B by Onsemi

FSBF10CH60B by Onsemi is a Motion Control IC with 27 terminals, operating temperature range of -40 to 125 °C. It features a max output current of 20A and nominal voltage of 15V. Ideal for automotive applications as an AC motor controller due to its robust design and high-temperature grade suitability.

Median Price

$13.290

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5 parts In-Stock

1+ parts

-

100+ parts

$13.290

1k+ parts

$11.890

10k+ parts

$11.190

5

-

$13.290

$11.890

$11.190

Distributors (In-Stock)

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Digiode

USA . 1,864 parts In-Stock

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$14.060

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$14.060

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Vyrian

USA . 3,591 parts In-Stock

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3,591

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Sensible Micro Corp

USA . 151 parts In-Stock

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Vectronix, Inc

USA . 24 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 10 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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Dan-Mar Components

USA . 10 parts In-Stock

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ComSIT Distribution GmbH

Germany . 6 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,403 parts In-Stock

1+ parts

$13.320

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2,403

$13.320

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Corohmni

South Africa . 382 parts In-Stock

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$14.800

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382

$14.800

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Native Components

USA . 144 parts In-Stock

1+ parts

$409.987

100+ parts

$401.787

1k+ parts

$397.687

10k+ parts

$393.588

144

$409.987

$401.787

$397.687

$393.588

Northwest PG Solutions

USA . 1,120 parts In-Stock

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$450.986

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$450.986

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QUARKTWIN TECHNOLOGY LTD

USA . 15,087 parts In-Stock

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SupplyDigital Components

Austria . 7,955 parts In-Stock

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Kulean Microsystems

USA . 7,923 parts In-Stock

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TANS Electronics

Latvia . 5,458 parts In-Stock

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Problanco Electronics

Mexico . 3,955 parts In-Stock

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Supply Digital

USA . 1,002 parts In-Stock

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UHIMA Technologies

Türkiye . 267 parts In-Stock

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267

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Perfect Parts

USA . 125 parts In-Stock

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Overview

Enhance your motion control applications with the FSBF10CH60B by Onsemi. Crafted with precision and quality, this AC motor controller offers seamless operation and maximum output current of 20A. With a temperature grade suitable for automotive use, this rectangular package style microelectronic assembly ensures optimal performance even in extreme conditions. Trust in Onsemi's expertise in motion control ICs to bring value and efficiency to your projects. Elevate your designs with the FSBF10CH60B and experience the difference today.

Feature Benefit Bullets

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and organization in a circuit board layout.

Nominal Supply Voltage (Vsup): 15 V

Suitable supply voltage for optimal performance without risking damage to the IC.

No. of Terminals: 27

Sufficient number of terminals for connecting to external components and peripherals.

Maximum Operating Temperature: 125 °C

Capable of operating in high temperature environments, making it suitable for a variety of applications.

Minimum Operating Temperature: -40 °C

Wide range of operating temperatures allows for use in both cold and hot environments.

Terminal Finish: TIN

Tin finish ensures good conductivity and solderability for reliable connections.

Terminal Position: DUAL

Dual terminal position offers flexibility in circuit board design and layout.

Other IC type: AC MOTOR CONTROLLER

Specifically designed for controlling AC motors, making it a specialized and reliable choice for motor control applications.

Minimum Supply Voltage (Vsup): 13.5 V

Lowest acceptable supply voltage to ensure proper operation of the IC.

Temperature Grade: AUTOMOTIVE

Automotive grade ensures reliability and durability in automotive applications where temperature fluctuations are common.

Maximum Output Current: 20 A

Capable of handling high output currents, making it suitable for driving motors and other high-power devices.

Terminal Form: THROUGH-HOLE

Through-hole terminals offer mechanical strength and easy soldering for secure connections.

Maximum Supply Voltage (Vsup): 16.5 V

Highest acceptable supply voltage to prevent damage to the IC and ensure safe operation.

Technical Specifications

Motion Control ICs FSBF10CH60B attributes and parameters. Explore more Motion Control ICs devices from Onsemi

Specs

Other IC type:

JESD-30 Code:

R-XDMA-T27

JESD-609 Code:

e3

No. of Functions:

1

No. of Terminals:

27

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-40 Cel

Maximum Output Current:

20 A

Package Body Material:

UNSPECIFIED

Package Shape:

Package Style (Meter):

MICROELECTRONIC ASSEMBLY

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

16.5 V

Minimum Supply Voltage (Vsup):

13.5 V

Nominal Supply Voltage (Vsup):

15 V

Surface Mount:

NO

Temperature Grade:

Terminal Finish:

TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

DUAL

Trade Compliance

FSBF10CH60B Other Function Semiconductors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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