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FS7145-01-XTP

Onsemi

FS7145-01-XTP by Onsemi

FS7145-01-XTP by Onsemi is a Clock Generator with 300 MHz output frequency, 16 terminals, and 3.3V supply voltage. Ideal for processors, it operates b/w 0-70 °C in commercial-grade applications. Package: PLASTIC/EPOXY, Surface Mount: YES, Technology: CMOS.

Median Price

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2

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1k+

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Vyrian

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Native Components

USA . 188 parts In-Stock

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$0.933

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Northwest PG Solutions

USA . 545 parts In-Stock

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AZTECH Wire

Italy . 870 parts In-Stock

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TANS Electronics

Latvia . 6,681 parts In-Stock

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SupplyDigital Components

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Kulean Microsystems

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Corphita

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Problanco Electronics

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UHIMA Technologies

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Overview

Elevate your electronic designs with the FS7145-01-XTP clock generator by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality products that exceed expectations. Clock generators are essential components in various applications, providing precise timing signals for optimal performance. The FS7145-01-XTP offers customers value, reliability, and efficiency, ensuring seamless operation in commercial-grade environments. Upgrade your projects with this small outline package style device and experience superior clock generation with Onsemi's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the clock generator.

Surface Mount: YES

Allows for easy and convenient installation on circuit boards.

Maximum Supply Voltage: 3.6 V

Can handle higher voltage inputs for versatile applications.

Maximum Output Clock Frequency: 300 MHz

Provides high-speed clock signals for efficient operation of electronic devices.

Technology: CMOS

Utilizes CMOS technology for low power consumption and reliable performance.

Nominal Primary Clock/Crystal Frequency: 35 MHz

Offers a stable and accurate frequency for clock generation in various electronic systems.

Technical Specifications

Clock Generators FS7145-01-XTP attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9314 mm

Moisture Sensitivity Level (MSL):

1

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

300 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

35 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.937 mm

Trade Compliance

FS7145-01-XTP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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