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FS7140-01G-XTD(16SSOP)

Onsemi

FS7140-01G-XTD(16SSOP) by Onsemi

FS7140-01G-XTD(16SSOP) by Onsemi is a Clock Generator with 300 MHz output frequency, 3.3 V supply, and CMOS technology. It is used in processors for commercial applications due to its small outline package and dual terminal position.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Digiode

USA . 1,824 parts In-Stock

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Vyrian

USA . 448 parts In-Stock

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Native Components

USA . 918 parts In-Stock

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$1.820

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Northwest PG Solutions

USA . 405 parts In-Stock

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$2.002

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TANS Electronics

Latvia . 5,910 parts In-Stock

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SupplyDigital Components

Austria . 2,056 parts In-Stock

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Corphita

USA . 1,669 parts In-Stock

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Problanco Electronics

Mexico . 1,338 parts In-Stock

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UHIMA Technologies

Türkiye . 766 parts In-Stock

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Corohmni

South Africa . 377 parts In-Stock

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Kulean Microsystems

USA . 6 parts In-Stock

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Overview

Unlock the power of precise clock generation with the FS7140-01G-XTD(16SSOP) by Onsemi. Crafted with high-quality materials and cutting-edge technology, this clock generator offers unparalleled performance for a wide range of applications. From processors to communication systems, this versatile device ensures optimal timing accuracy and reliability. Experience seamless integration, superior functionality, and exceptional value with the FS7140-01G-XTD(16SSOP) - the perfect solution for your electronic projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable, lightweight, and cost-effective, making the product suitable for various applications.

Surface Mount: YES

Surface mounting allows for easy and efficient installation, saving space on the PCB and simplifying manufacturing processes.

Maximum Supply Voltage: 3.6 V

Offers a higher supply voltage tolerance, providing flexibility and reliability in different operating conditions.

Package Shape: RECTANGULAR

Rectangular shape enables easy integration into existing circuit layouts and facilitates efficient PCB design.

Maximum Output Clock Frequency: 300 MHz

High frequency output allows for precise and stable clock generation, suitable for demanding applications.

Power Supplies (V): 3.3

Standard power supply voltage ensures compatibility with common voltage levels, simplifying system design.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components and peripherals, offering versatility in system integration.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package style with reduced pitch enhances PCB density and facilitates miniaturization of electronic devices.

Minimum Supply Voltage: 3 V

Low minimum supply voltage allows for operation in power-constrained environments without compromising performance.

Maximum Operating Temperature: 70 °C

Wide operating temperature range enables reliable operation in various environmental conditions, enhancing product durability.

Minimum Operating Temperature: 0 °C

Operates efficiently in low-temperature environments, ensuring consistent performance in a wide range of operating conditions.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and facilitates easy connection to other components.

Width: 2.79 mm

Narrow width saves space on the PCB, allowing for compact and streamlined system designs.

Length: 6.2 mm

Optimal length for improved handling and installation convenience, making the product user-friendly.

Temperature Grade: COMMERCIAL

Commercial temperature grade ensures reliable performance in standard operating conditions, suitable for commercial applications.

Peripheral IC Type: CLOCK GENERATOR, PROCESSOR SPECIFIC

Specifically designed for clock generation in processor applications, offering precise timing control and synchronization.

Technology: CMOS

CMOS technology provides low power consumption, high noise immunity, and compatibility with a wide range of digital systems.

Terminal Form: GULL WING

Gull wing terminal form enables easy soldering and secure connection, enhancing product reliability and performance.

Nominal Supply Voltage: 3.3 V

Nominal supply voltage matches standard voltage levels, ensuring compatibility and reliable operation in typical applications.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for precise connections, reducing the risk of short circuits and ensuring signal integrity.

Nominal Primary Clock/Crystal Frequency: 35 MHz

Primary clock frequency of 35 MHz provides a reference signal for clock generation, supporting accurate timing and synchronization.

Technical Specifications

Clock Generators FS7140-01G-XTD(16SSOP) attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

6.2 mm

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

300 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

35 MHz

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

2.79 mm

Trade Compliance

FS7140-01G-XTD(16SSOP) Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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