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FS7140-01-XTD(16SSOP)

Onsemi

FS7140-01-XTD(16SSOP) by Onsemi

FS7140-01-XTD clock generator by Onsemi in 16SSOP package, CMOS tech, 3.3V supply, temp range 0-70 °C. Ideal for applications requiring precise timing control in commercial-grade electronic devices.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 1,216 parts In-Stock

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Digiode

USA . 809 parts In-Stock

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Distributors (Availability)

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Native Components

USA . 61 parts In-Stock

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$0.488

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$0.469

61

$0.488

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$0.469

Northwest PG Solutions

USA . 1,829 parts In-Stock

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$0.537

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$0.474

1,829

$0.537

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$0.474

SupplyDigital Components

Austria . 6,344 parts In-Stock

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Kulean Microsystems

USA . 6,096 parts In-Stock

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Problanco Electronics

Mexico . 5,313 parts In-Stock

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TANS Electronics

Latvia . 3,676 parts In-Stock

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Corphita

USA . 2,112 parts In-Stock

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Corohmni

South Africa . 453 parts In-Stock

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UHIMA Technologies

Türkiye . 317 parts In-Stock

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Overview

Unlock endless possibilities with the FS7140-01-XTD(16SSOP) clock generator by Onsemi. Crafted with precision and expertise, this small outline, shrink pitch package offers unparalleled quality and reliability. Perfect for a wide range of applications, this CMOS technology marvel delivers seamless performance at a nominal supply voltage of 3.3V. Experience unmatched value and efficiency with Onsemi's clock generators, setting new standards in innovation and excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material helps in reducing the overall weight of the product, making it easier to handle and install.

Surface Mount: YES

The surface mount capability allows for easy and efficient PCB assembly, saving time and effort in the manufacturing process.

Package Shape: RECTANGULAR

The rectangular package shape provides a compact form factor, making it suitable for space-constrained applications.

Power Supplies (V): 3.3

The 3.3V power supply ensures compatibility with a wide range of devices and systems, making it versatile for various applications.

No. of Terminals: 16

With 16 terminals, this clock generator offers flexibility in connections and interface options, catering to different circuit configurations.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

The small outline and shrink pitch package style allows for a high component density on the PCB, enabling more efficient use of board space.

Maximum Operating Temperature: 70 °C

The high maximum operating temperature of 70 °C ensures reliable performance even in demanding environmental conditions.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0 °C ensures that the clock generator can function effectively in a wide range of temperature settings.

Terminal Position: DUAL

The dual terminal position provides redundancy and ensures a secure and stable connection, contributing to the overall reliability of the product.

Temperature Grade: COMMERCIAL

The commercial temperature grade indicates that this clock generator is suitable for standard operating conditions and commercial applications.

Technology: CMOS

The CMOS technology offers low power consumption and high noise immunity, making the clock generator energy-efficient and reliable in noisy environments.

Terminal Form: GULL WING

The gull wing terminal form provides robust mechanical support and ease of soldering during assembly, ensuring a secure connection for long-term performance.

Nominal Supply Voltage: 3.3 V

The 3.3V nominal supply voltage is a standard voltage level that is widely used in modern electronic devices and systems, making this clock generator compatible with a range of applications.

Terminal Pitch: 0.635 mm

The small terminal pitch of 0.635mm allows for high-density mounting of the clock generator on the PCB, optimizing space utilization and enhancing overall design flexibility.

Technical Specifications

Clock Generators FS7140-01-XTD(16SSOP) attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.3

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Trade Compliance

FS7140-01-XTD(16SSOP) Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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