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FS7140-01G-XTP

Onsemi

FS7140-01G-XTP by Onsemi

FS7140-01G-XTP Clock Generator by Onsemi operates at a max output clock frequency of 300 MHz with a supply voltage range of 3V to 3.6V. This small outline package is ideal for processor-specific applications, featuring CMOS technology and a terminal pitch of 1.27mm. With commercial temperature grade and gull wing terminals, it suits various electronic designs.

Median Price

$4.780

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 777 parts In-Stock

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Farnell

UK . 777 parts In-Stock

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$4.675

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Verical

USA . 671 parts In-Stock

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$5.450

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Digiode

USA . 179 parts In-Stock

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$4.370

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Vyrian

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Flip Electronics

USA . 656 parts In-Stock

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Prism Electronics

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Ampacity Inc.

Singapore . 631 parts In-Stock

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$3.910

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Corphita

USA . 78 parts In-Stock

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$4.140

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Corohmni

South Africa . 457 parts In-Stock

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$4.600

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Component Stockers USA

USA . 961 parts In-Stock

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$4.640

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$4.370

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GreenTree Electronics

Israel . 12,000 parts In-Stock

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Kepictronics

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Kulean Microsystems

USA . 6,732 parts In-Stock

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TANS Electronics

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Problanco Electronics

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Glotronic Ltd.

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Northwest PG Solutions

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SupplyDigital Components

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Microchip USA

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Continental Prestige Electronics

USA . 853 parts In-Stock

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UHIMA Technologies

Türkiye . 606 parts In-Stock

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Native Components

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Overview

Unlock the power of precision timing with the FS7140-01G-XTP clock generator by Onsemi. Crafted with top-quality materials and cutting-edge technology, this device ensures reliable performance in a variety of applications. From data centers to communication networks, this clock generator delivers unparalleled accuracy and efficiency. Trust Onsemi's reputation for excellence and experience seamless synchronization with the FS7140-01G-XTP. Elevate your projects to new heights with this innovative solution.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic/Epoxy material is durable and lightweight, making the product suitable for various applications.

Surface Mount: YES

Surface mount feature allows for easy installation and space-saving in circuit designs.

Maximum Supply Voltage: 3.6 V

A higher maximum supply voltage allows for flexibility in power supply options.

Package Shape: RECTANGULAR

Rectangular shape is standard and easy to integrate into existing PCB designs.

Maximum Output Clock Frequency: 300 MHz

High maximum output clock frequency enables high-performance clock generation for demanding applications.

Power Supplies (V): 3.3

Stable power supply at 3.3V ensures reliable operation of the clock generator.

No. of Terminals: 16

Sufficient number of terminals for connecting to other components in the circuit.

Package Style (Meter): SMALL OUTLINE

Small outline package style saves space on the PCB and allows for compact systems.

Minimum Supply Voltage: 3 V

Low minimum supply voltage helps in power efficiency and compatibility with different power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature range ensures reliable performance in various environments.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature allows for usage in cold conditions without impacting performance.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and connectivity options.

Maximum Seated Height: 1.7272 mm

Low maximum seated height saves space and allows for slim designs.

Width: 3.937 mm

Narrow width facilitates integration into compact electronic assemblies.

Length: 9.9314 mm

Standard length for easy placement on the PCB and compatibility with existing designs.

Temperature Grade: COMMERCIAL

Commercial temperature grade suitable for typical operating environments.

Peripheral IC Type: CLOCK GENERATOR, PROCESSOR SPECIFIC

Specifically designed for clock generation in processor applications, ensuring optimal performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for reliable clock generation.

Terminal Form: GULL WING

Gull wing terminal form for easy soldering and reliable connections in the circuit.

Nominal Supply Voltage: 3.3 V

Stable nominal supply voltage of 3.3V for consistent and reliable clock generation.

Terminal Pitch: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts and soldering techniques.

Nominal Primary Clock/Crystal Frequency: 35 MHz

Nominal primary clock/crystal frequency of 35 MHz for accurate timekeeping and synchronization in the system.

Technical Specifications

Clock Generators FS7140-01G-XTP attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

9.9314 mm

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

300 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

SOP

Package Equivalence Code:

SOP16,.25

Package Shape:

Package Style (Meter):

SMALL OUTLINE

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

35 MHz

Qualification:

Not Qualified

Maximum Seated Height:

1.7272 mm

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

1.27 mm

Terminal Position:

DUAL

Width:

3.937 mm

Trade Compliance

FS7140-01G-XTP Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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