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FS7140-01G-XTP(16SSOP)

Onsemi

FS7140-01G-XTP(16SSOP) by Onsemi

The FS7140-01G-XTP clock generator by Onsemi is a 16SSOP package with a max output frequency of 300 MHz. Operating at temperatures from 0 to 70 °C, it has a supply voltage range of 3-3.6 V. Ideal for processor-specific applications requiring precise timing and clock signals in commercial-grade environments.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 2,070 parts In-Stock

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Vyrian

USA . 1,367 parts In-Stock

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TANS Electronics

Latvia . 6,039 parts In-Stock

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SupplyDigital Components

Austria . 4,674 parts In-Stock

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Kulean Microsystems

USA . 4,342 parts In-Stock

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Problanco Electronics

Mexico . 2,086 parts In-Stock

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Northwest PG Solutions

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Corphita

USA . 1,157 parts In-Stock

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Corohmni

South Africa . 471 parts In-Stock

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UHIMA Technologies

Türkiye . 348 parts In-Stock

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Native Components

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Overview

Enhance your electronic devices with the FS7140-01G-XTP(16SSOP) clock generator from Onsemi. With a maximum output clock frequency of 300 MHz and a small outline package style, this high-quality product is perfect for a wide range of applications. Onsemi's reputation for excellence ensures that you are getting a reliable and efficient solution for your timing needs. Upgrade your designs with this versatile clock generator and experience the benefits of precision timing and enhanced performance. Trust Onsemi to deliver top-notch products that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Plastic material provides durability and helps keep the overall weight of the product low.

Surface Mount: YES

Allows for easy and secure mounting on PCBs, saving space and reducing assembly time.

Maximum Supply Voltage: 3.6 V

Can handle high supply voltage levels, reducing the risk of damage due to voltage spikes.

Package Shape: RECTANGULAR

Rectangular shape is commonly used and easy to handle during manufacturing and assembly processes.

Maximum Output Clock Frequency: 300 MHz

High output clock frequency allows for precise timing in advanced electronic systems.

Power Supplies (V): 3.3

Ideal power supply voltage for compatibility with various electronic devices and systems.

No. of Terminals: 16

Sufficient number of terminals for connections and interfacing with other components in the circuit.

Package Style (Meter): SMALL OUTLINE, SHRINK PITCH

Compact package style saves space on the PCB and reduces signal interference.

Minimum Supply Voltage: 3 V

Low minimum supply voltage ensures compatibility with a wide range of power sources.

Maximum Operating Temperature: 70 °C

High maximum operating temperature allows for reliable performance in various environmental conditions.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures the product can function in cold environments without issues.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout and connection options.

Width: 2.79 mm

Narrow width saves space on the PCB and allows for compact designs.

Length: 6.2 mm

Short length makes the product suitable for applications with limited space constraints.

Temperature Grade: COMMERCIAL

Commercial grade temperature range suitable for most standard electronic applications.

Peripheral IC Type: CLOCK GENERATOR, PROCESSOR SPECIFIC

Designed specifically for clock generation in processors, ensuring compatibility and reliable performance.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity for efficient operation.

Terminal Form: GULL WING

Gull wing terminal form is commonly used and facilitates easy soldering during assembly.

Nominal Supply Voltage: 3.3 V

Optimal nominal supply voltage for stable and efficient operation of the product.

Terminal Pitch: 0.635 mm

Fine terminal pitch allows for precise connections and compact design layouts.

Nominal Primary Clock/Crystal Frequency: 35 MHz

Suitable primary clock frequency for clock generation and timing requirements in various electronic systems.

Technical Specifications

Clock Generators FS7140-01G-XTP(16SSOP) attributes and parameters. Explore more Clock Generators devices from Onsemi

Specs

JESD-30 Code:

R-PDSO-G16

Length:

6.2 mm

No. of Terminals:

16

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Maximum Output Clock Frequency:

300 MHz

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

SSOP16,.3

Package Shape:

Package Style (Meter):

SMALL OUTLINE, SHRINK PITCH

Power Supplies (V):

3.3

Nominal Primary Clock/Crystal Frequency:

35 MHz

Qualification:

Not Qualified

Sub-Category:

Clock Generators

Maximum Supply Voltage:

3.6 V

Minimum Supply Voltage:

3 V

Nominal Supply Voltage:

3.3 V

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Form:

Terminal Pitch:

.635 mm

Terminal Position:

DUAL

Width:

2.79 mm

Trade Compliance

FS7140-01G-XTP(16SSOP) Peripheral ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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