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FQT4N20L

Onsemi

FQT4N20L by Onsemi

FQT4N20L by Onsemi is a N-CHANNEL Power FET with 200V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a Max Pulsed Drain Current of 3.4A and Avalanche Energy Rating of 52mJ. This SINGLE transistor in PLASTIC/EPOXY package has GULL WING terminals and operates in ENHANCEMENT MODE.

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Digiode

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Bristol Electronics

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Nova Conductors

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Prism Electronics

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Ampacity Inc.

Singapore . 1,360 parts In-Stock

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Metaverse IC Inc.

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Problanco Electronics

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Kulean Microsystems

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TANS Electronics

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Overview

Discover the power of the FQT4N20L by Onsemi, a high-quality Power Field Effect Transistor with N-Channel polarity and a built-in diode for efficient switching applications. With a robust design and reliable performance, this transistor offers customers the value of enhanced power management and control. Ideal for a wide range of applications, from industrial to automotive, the FQT4N20L guarantees optimal functionality and durability. Trust Onsemi's expertise in semiconductor technology to deliver innovative solutions that meet your needs. Experience the benefits of superior efficiency and performance with the FQT4N20L.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Durable material ensuring longevity and reliability of the product.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs offer lower ON resistance and higher efficiency compared to P-Channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode provides reverse current protection, enhancing the overall safety of the circuit.

Transistor Application: SWITCHING

Ideal for applications where fast switching speed is required.

Surface Mount: YES

Easy to mount on PCBs, making the manufacturing process more efficient.

Minimum DS Breakdown Voltage: 200 V

Higher breakdown voltage allows the FET to handle higher voltages safely.

Maximum Power Dissipation (Abs): 2.2 W

Can handle relatively high power dissipation, making it suitable for demanding applications.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Common and reliable technology for FETs, ensuring stable performance.

Maximum Turn On Time (ton): 175 ns

Fast turn-on time is crucial for efficient switching operations.

Technical Specifications

Power Field Effect Transistors (FET) FQT4N20L attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

52 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

.85 A

Maximum Drain Current (ID):

.85 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

8 pF

JESD-30 Code:

R-PDSO-G4

No. of Elements:

1

No. of Terminals:

4

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

3.4 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

130 ns

Maximum Turn On Time (ton):

175 ns

Trade Compliance

FQT4N20L Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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