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FQPF9N90CT

Onsemi

FQPF9N90CT by Onsemi

FQPF9N90CT by Onsemi is a N-CHANNEL Power FET with 900V DS Breakdown Voltage, ideal for SWITCHING applications. It features 32A Max Pulsed Drain Current and 1.4ohm Max RDS(on), operating in ENHANCEMENT MODE at up to 150 °C.

Median Price

$1.892

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 2,093 parts In-Stock

1+ parts

$5.020

100+ parts

$2.300

1k+ parts

$2.170

10k+ parts

-

2,093

$5.020

$2.300

$2.170

-

DigiKey

USA . 1,176 parts In-Stock

1+ parts

$5.130

100+ parts

$2.435

1k+ parts

$1.897

10k+ parts

-

1,176

$5.130

$2.435

$1.897

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Arrow

USA . 67,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.883

10k+ parts

-

67,000

-

-

$1.883

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Verical

USA . 67,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.883

10k+ parts

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67,000

-

-

$1.883

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Master Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$1.740

1k+ parts

$1.660

10k+ parts

$1.630

3,000

-

$1.740

$1.660

$1.630

Rochester

USA . 20 parts In-Stock

1+ parts

-

100+ parts

$1.900

1k+ parts

$1.700

10k+ parts

$1.600

20

-

$1.900

$1.700

$1.600

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 1,593 parts In-Stock

1+ parts

$1.687

100+ parts

-

1k+ parts

-

10k+ parts

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1,593

$1.687

-

-

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Vyrian

USA . 2,991 parts In-Stock

1+ parts

$1.776

100+ parts

-

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-

10k+ parts

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2,991

$1.776

-

-

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TME

Poland . 1,000 parts In-Stock

1+ parts

$5.120

100+ parts

$3.050

1k+ parts

-

10k+ parts

-

1,000

$5.120

$3.050

-

-

IBS Electronics

USA . 3,000 parts In-Stock

1+ parts

-

100+ parts

$2.440

1k+ parts

$2.328

10k+ parts

$2.286

3,000

-

$2.440

$2.328

$2.286

NAC Semi

USA . 2,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$3.020

10k+ parts

$2.780

2,000

-

-

$3.020

$2.780

LWI Electronics Inc

India . 19 parts In-Stock

1+ parts

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19

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EPE Components Inc.

USA . 10 parts In-Stock

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10

-

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Bristol Electronics

USA . 10 parts In-Stock

1+ parts

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10

-

-

-

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 2,362 parts In-Stock

1+ parts

$1.598

100+ parts

-

1k+ parts

-

10k+ parts

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2,362

$1.598

-

-

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Corohmni

South Africa . 78 parts In-Stock

1+ parts

$1.776

100+ parts

-

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10k+ parts

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78

$1.776

-

-

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Andel Nordic

Denmark . 50 parts In-Stock

1+ parts

$7.911

100+ parts

-

1k+ parts

$7.594

10k+ parts

$7.594

50

$7.911

-

$7.594

$7.594

Microchip USA

USA . 7,246 parts In-Stock

1+ parts

$22.945

100+ parts

-

1k+ parts

-

10k+ parts

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7,246

$22.945

-

-

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Native Components

USA . 913 parts In-Stock

1+ parts

$23.643

100+ parts

-

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10k+ parts

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913

$23.643

-

-

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Northwest PG Solutions

USA . 250 parts In-Stock

1+ parts

$26.007

100+ parts

$23.407

1k+ parts

-

10k+ parts

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250

$26.007

$23.407

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Metaverse IC Inc.

Canada . 80,000 parts In-Stock

1+ parts

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80,000

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Kepictronics

USA . 62,000 parts In-Stock

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62,000

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RC Electronics

USA . 40,000 parts In-Stock

1+ parts

-

100+ parts

$1.980

1k+ parts

$1.810

10k+ parts

$1.750

40,000

-

$1.980

$1.810

$1.750

Futuretech Components

Singapore . 9,900 parts In-Stock

1+ parts

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9,900

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QUARKTWIN TECHNOLOGY LTD

USA . 7,929 parts In-Stock

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7,929

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Perfect Parts

USA . 7,078 parts In-Stock

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7,078

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SupplyDigital Components

Austria . 5,159 parts In-Stock

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5,159

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TANS Electronics

Latvia . 4,783 parts In-Stock

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4,783

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Kulean Microsystems

USA . 1,975 parts In-Stock

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1,975

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Problanco Electronics

Mexico . 1,915 parts In-Stock

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1,915

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Authorized Procurement Solutions

USA . 800 parts In-Stock

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800

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Supply Digital

USA . 693 parts In-Stock

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693

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GreenTree Electronics

Israel . 580 parts In-Stock

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580

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UHIMA Technologies

Türkiye . 250 parts In-Stock

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250

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iodParts Technologies Inc.

India . 105 parts In-Stock

1+ parts

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105

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Overview

Experience superior performance and reliability with the FQPF9N90CT by Onsemi, a top-tier manufacturer known for their cutting-edge technology. As a power field effect transistor (FET) in the N-channel category, this product is designed for high efficiency switching applications. With a built-in diode and an impressive 900V minimum breakdown voltage, this transistor offers exceptional value and benefits to customers. Trust in the quality and innovation of Onsemi for all your power semiconductor needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good insulation and protection, making the transistor durable and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher mobility, leading to better efficiency.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easier circuit design and protection against reverse current flow.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET provides fast response and low power consumption.

Minimum DS Breakdown Voltage: 900 V

With a high breakdown voltage, this FET can withstand high voltage applications without breakdown.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and efficient use of space in circuit design.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, ensuring reliability in various applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs are easier to control and have lower ON resistance, improving efficiency.

Maximum Pulsed Drain Current (IDM): 32 A

The high pulsed drain current capability allows for handling of sudden spikes in current without damage.

Avalanche Energy Rating (EAS): 900 mJ

High avalanche energy rating ensures the FET can handle transient events without failure.

Maximum Drain Current (Abs) (ID): 8 A

With a maximum drain current of 8A, this FET is suitable for moderate power applications.

Maximum Power Dissipation (Abs): 68 W

The high power dissipation rating allows for reliable operation under high load conditions.

Package Style (Meter): FLANGE MOUNT

Flange mount package offers easy mounting and heat dissipation for better performance.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

MOSFET technology enables high switching speed and low ON resistance, ideal for efficient operation.

Maximum Operating Temperature: 150 °C

With a high operating temperature rating, this FET can withstand elevated temperatures in industrial applications.

Transistor Element Material: SILICON

Silicon-based transistors offer high performance and reliability, making this FET a quality choice.

Terminal Finish: Matte Tin (Sn) - annealed

Matte tin finish provides good conductivity and corrosion resistance, ensuring stable connections.

Maximum Drain-Source On Resistance: 1.4 ohm

Low drain-source ON resistance minimizes power losses and improves efficiency in the circuit.

Terminal Position: SINGLE

Single terminal position simplifies installation and connection in circuit designs.

Case Connection: ISOLATED

Isolated case connection enhances safety and prevents electrical interference in the circuit.

Technical Specifications

Power Field Effect Transistors (FET) FQPF9N90CT attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

900 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

900 V

Maximum Drain Current (Abs) (ID):

8 A

Maximum Drain Current (ID):

8 A

Maximum Drain-Source On Resistance:

1.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

32 A

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQPF9N90CT Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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