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FQD7N20

Onsemi

FQD7N20 by Onsemi

FQD7N20 by Onsemi is a N-CHANNEL Power FET with 200V DS Breakdown Voltage, ideal for SWITCHING applications. Featuring a Max IDM of 21A and EAS of 73mJ, it operates in ENHANCEMENT MODE with 0.69 ohm RDS(on). This PLASTIC/EPOXY transistor has GULL WING terminals and can handle up to 45W power dissipation.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 1,443 parts In-Stock

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Vyrian

USA . 340 parts In-Stock

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Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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Kepictronics

USA . 27,860 parts In-Stock

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Problanco Electronics

Mexico . 8,309 parts In-Stock

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TANS Electronics

Latvia . 7,177 parts In-Stock

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A-Z Elektronik GmbH

Germany . 6,851 parts In-Stock

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Authorized Procurement Solutions

USA . 5,000 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,567 parts In-Stock

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SupplyDigital Components

Austria . 3,971 parts In-Stock

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Kulean Microsystems

USA . 2,172 parts In-Stock

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Northwest PG Solutions

USA . 1,750 parts In-Stock

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Supply Digital

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Corphita

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Native Components

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UHIMA Technologies

Türkiye . 182 parts In-Stock

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Corohmni

South Africa . 52 parts In-Stock

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Overview

Unlock the power of innovation with the FQD7N20 by Onsemi, a top-tier manufacturer known for delivering cutting-edge solutions. As a leading player in the Power Field Effect Transistor category, this N-CHANNEL transistor boasts unparalleled quality and reliability. Ideal for switching applications, this single configuration transistor offers a built-in diode for enhanced performance. With a high DS Breakdown Voltage of 200V and a maximum Drain Current of 5.3A, this transistor is designed to meet your power needs efficiently. Experience seamless operation and superior functionality with the FQD7N20 - the perfect choice for your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, ensuring a longer lifespan for the product.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode allows for efficient energy management and protection against reverse currents, enhancing overall performance.

Transistor Application: SWITCHING

Designed specifically for switching applications, making it suitable for a variety of electronic devices and systems.

Minimum DS Breakdown Voltage: 200 V

High breakdown voltage allows for reliable operation in high voltage applications, ensuring safety and stability.

Surface Mount: YES

Surface mount design enables easy integration into circuit boards, saving space and simplifying assembly processes.

Maximum Drain-Source On Resistance: 0.69 ohm

Low on-resistance leads to minimal power loss and heat generation, improving overall efficiency and performance.

Technical Specifications

Power Field Effect Transistors (FET) FQD7N20 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

73 mJ

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

5.3 A

Maximum Drain Current (ID):

5.3 A

Maximum Drain-Source On Resistance:

.69 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

12 pF

JESD-30 Code:

R-PSSO-G2

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

21 A

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

120 ns

Maximum Turn On Time (ton):

165 ns

Trade Compliance

FQD7N20 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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