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FQD7N30TM

Onsemi

FQD7N30TM by Onsemi

FQD7N30TM by Onsemi is a N-CHANNEL Power FET with 300V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 22A and EAS of 380mJ, suitable for high-power operations. With 0.7 ohm RDS(on) and 50W Pdiss, it ensures efficient performance in ENHANCEMENT MODE operation.

Median Price

$0.546

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

EBV Elektronik

Germany . 5,000 parts In-Stock

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5,000

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DigiKey

USA . 2,500 parts In-Stock

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$0.451

2,500

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$0.451

Rochester

USA . 180 parts In-Stock

1+ parts

-

100+ parts

$0.641

1k+ parts

$0.532

10k+ parts

$0.474

180

-

$0.641

$0.532

$0.474

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 1,564 parts In-Stock

1+ parts

$0.451

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$0.451

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Digiode

USA . 1,069 parts In-Stock

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$0.500

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1,069

$0.500

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ACDS - Activité Composants Distribution Service

France . 5,000 parts In-Stock

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Dan-Mar Components

USA . 4,100 parts In-Stock

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Bristol Electronics

USA . 1,250 parts In-Stock

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-

100+ parts

$0.507

1k+ parts

$0.378

10k+ parts

$0.351

1,250

-

$0.507

$0.378

$0.351

EZ Electronic Parts

Israel . 411 parts In-Stock

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411

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Speed Components Ltd

Israel . 150 parts In-Stock

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150

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Semtec, LLC

USA . 10 parts In-Stock

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10

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Distributors (Availability)

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Corohmni

South Africa . 125 parts In-Stock

1+ parts

$0.451

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125

$0.451

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Corphita

USA . 457 parts In-Stock

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$0.473

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457

$0.473

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Native Components

USA . 306 parts In-Stock

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$0.980

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306

$0.980

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Northwest PG Solutions

USA . 2,375 parts In-Stock

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$1.078

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$1.078

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Microchip USA

USA . 377 parts In-Stock

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$3.280

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$3.280

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Perfect Parts

USA . 8,698 parts In-Stock

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8,698

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A-Z Elektronik GmbH

Germany . 6,417 parts In-Stock

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iodParts Technologies Inc.

India . 5,000 parts In-Stock

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SupplyDigital Components

Austria . 4,858 parts In-Stock

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4,858

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TANS Electronics

Latvia . 4,825 parts In-Stock

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Kepictronics

USA . 4,500 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,278 parts In-Stock

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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Problanco Electronics

Mexico . 2,552 parts In-Stock

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Supply Digital

USA . 1,700 parts In-Stock

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Assy Fe

Spain . 1,270 parts In-Stock

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Kulean Microsystems

USA . 1,012 parts In-Stock

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UHIMA Technologies

Türkiye . 213 parts In-Stock

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Overview

Experience unprecedented power and reliability with the FQD7N30TM by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) with exceptional performance in switching applications. The FQD7N30TM features a single configuration with a built-in diode, offering customers unparalleled efficiency and versatility. Whether you're looking to enhance your electronic devices or improve power management, this N-CHANNEL transistor is the perfect solution. Trust Onsemi to provide cutting-edge technology that exceeds expectations and unlocks endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is durable and provides protection for the internal components of the FET, making it a reliable choice for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and higher efficiency compared to P-channel FETs, making them a good choice for applications requiring high performance.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can provide protection against reverse voltage polarity, enhancing the overall efficiency and reliability of the FET.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET is optimized for fast switching speeds and high efficiency, making it suitable for power management and control applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can withstand elevated temperatures without compromising its performance, making it suitable for various industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) FQD7N30TM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

380 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

300 V

Maximum Drain Current (Abs) (ID):

5.5 A

Maximum Drain Current (ID):

5.5 A

Maximum Drain-Source On Resistance:

.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

22 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQD7N30TM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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