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FQD2N60C

Onsemi

FQD2N60C by Onsemi

FQD2N60C by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 7.6A and RDS(ON) of 4.7 ohm, operating in ENHANCEMENT MODE at up to 150°C. This PLASTIC/EPOXY transistor in GULL WING package is designed for high-performance power management systems.

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4

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1k+

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Nova Conductors

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AZTECH Wire

Italy . 596 parts In-Stock

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Ampacity Inc.

Singapore . 1,288 parts In-Stock

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$27.050

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Authorized Procurement Solutions

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Kepictronics

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Lixinc

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SupplyDigital Components

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Continental Prestige Electronics

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TANS Electronics

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Overview

Enhance your electronic devices with the FQD2N60C by Onsemi, a top-quality Power Field Effect Transistor that offers exceptional performance and reliability. Manufactured by Onsemi, a trusted leader in semiconductor technology, this N-CHANNEL transistor is ideal for various switching applications. With a minimum DS breakdown voltage of 600V and a maximum pulsed drain current of 7.6A, this transistor ensures efficient operation while maximizing energy savings. Upgrade your projects with the FQD2N60C and experience the unparalleled value it brings to your designs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the components inside the package, ensuring reliability and durability.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have better performance, lower resistance, and higher efficiency compared to P-channel FETs.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode helps in protecting against reverse voltage polarity, making the product safer and more versatile.

Transistor Application: SWITCHING

Ideal for applications where rapid on/off switching is required, ensuring efficient performance in various electronic circuits.

Surface Mount: YES

Allows for easier and more convenient installation on circuit boards, saving space and reducing assembly time.

Minimum DS Breakdown Voltage: 600 V

Suitable for high voltage applications where a level of insulation and breakdown voltage is critical for safety and performance.

Package Shape: RECTANGULAR

Helps in efficient packaging and mounting on circuit boards, optimizing space and layout in electronic systems.

Terminal Form: GULL WING

Enables easy surface mounting on PCBs, providing mechanical strength and stability during operation.

Operating Mode: ENHANCEMENT MODE

Allows for precise control of the transistor's conductivity, enhancing performance and efficiency in switching applications.

Maximum Pulsed Drain Current (IDM): 7.6 A

Capable of handling high peak currents during pulses, making it suitable for applications with varying loads and transient conditions.

Avalanche Energy Rating (EAS): 120 mJ

Withstands high energy spikes and transient events, ensuring reliability and protection against voltage surges or spikes.

No. of Terminals: 2

Simple and straightforward design with fewer terminals, making it easy to integrate into electronic circuits.

Package Style (Meter): SMALL OUTLINE

Compact and space-saving package design, suitable for applications where size and weight constraints are critical.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Offers high switching speeds, low power consumption, and good thermal stability, ensuring reliable performance in various operating conditions.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, making it suitable for demanding environments and extended use.

Transistor Element Material: SILICON

Silicon-based FETs offer high performance, reliability, and temperature tolerance, ensuring long-term functionality and stability.

Terminal Finish: MATTE TIN

Provides good solderability and connectivity, ensuring secure and stable connections for reliable operation.

Maximum Drain Current (ID): 1.9 A

Can handle moderate continuous currents, suitable for various low to medium power applications requiring efficient switching.

Maximum Drain-Source On Resistance: 4.7 ohm

Low on-resistance results in minimal power loss and heat generation, enhancing efficiency and performance in switching applications.

Terminal Position: SINGLE

Simplified terminal configuration for easy and straightforward connection, reducing errors during installation and maintenance.

Case Connection: DRAIN

Drain terminal connection simplifies circuit design and layout, ensuring efficient current flow and performance in various applications.

Technical Specifications

Power Field Effect Transistors (FET) FQD2N60C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

120 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

1.9 A

Maximum Drain-Source On Resistance:

4.7 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

7.6 A

Qualification:

Not Qualified

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQD2N60C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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