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FQD1N60CTM

Onsemi

FQD1N60CTM by Onsemi

FQD1N60CTM by Onsemi is a N-CHANNEL power field effect transistor (FET) with a min DS breakdown voltage of 600V. It is used for switching applications and has a max pulsed drain current of 4A.

Median Price

$0.315

Lifecycle Status

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14

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1k+

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Adafruit Industries

USA . 50 parts In-Stock

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$0.315

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$0.315

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$0.315

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$0.315

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Rochester

USA . 2,413 parts In-Stock

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$0.317

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$0.263

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$0.235

2,413

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$0.317

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Verical

USA . 1,340 parts In-Stock

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$0.293

1,340

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Digiode

USA . 1,232 parts In-Stock

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$0.247

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Nova Conductors

Japan . 10 parts In-Stock

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$0.317

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Chip Stock

USA . 34,000 parts In-Stock

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Pegasus Components GmbH

Germany . 5,000 parts In-Stock

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Semtec, LLC

USA . 2,296 parts In-Stock

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Cyclops Electronics Ltd

UK . 1,747 parts In-Stock

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Freddi Giovanni

Italy . 1,650 parts In-Stock

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Vyrian

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DigiKey Marketplace

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Elcom Components

USA . 951 parts In-Stock

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SPM Sales

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Ampacity Inc.

Singapore . 1,630 parts In-Stock

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$0.221

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1,630

$0.221

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Semicontronic

India . 1,626 parts In-Stock

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$0.221

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$0.215

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Corphita

USA . 2,181 parts In-Stock

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$0.234

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Corohmni

South Africa . 86 parts In-Stock

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$0.260

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Advanced Electronics

New Zealand . 50 parts In-Stock

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$0.315

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Netroflash

USA . 2,000 parts In-Stock

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$0.317

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$0.311

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Argo Parts USA

USA . 398 parts In-Stock

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$0.317

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$0.307

398

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Continental Prestige Electronics

USA . 3,388 parts In-Stock

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$0.634

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$0.374

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$0.237

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Aztec Data Supply Inc.

USA . 4,027 parts In-Stock

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$1.463

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Andel Nordic

Denmark . 31 parts In-Stock

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$3.453

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$3.315

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$3.315

RC Electronics

USA . 65,038 parts In-Stock

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$0.330

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Perfect Parts

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Kepictronics

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SupplyDigital Components

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Authorized Procurement Solutions

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Futuretech Components

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Lixinc

USA . 4,958 parts In-Stock

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Supply Digital

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Problanco Electronics

Mexico . 1,635 parts In-Stock

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Kulean Microsystems

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UHIMA Technologies

Türkiye . 415 parts In-Stock

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TANS Electronics

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Overview

Looking for a reliable power Field Effect Transistor (FET)? Look no further than the FQD1N60CTM by Onsemi! With its high-quality construction and impressive specifications, this N-CHANNEL FET is perfect for switching applications. Its single configuration with a built-in diode ensures efficient performance, while the 600V minimum DS breakdown voltage provides optimal protection. The FQD1N60CTM offers customers unrivaled value, benefits, and advantages in their projects. Trust Onsemi's expertise and choose the FQD1N60CTM for all your power FET needs!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material ensures durability and resistance to external factors. This makes the product suitable for various operating conditions, making it a reliable choice.

Polarity or Channel Type: N-CHANNEL

The N-channel configuration allows for efficient flow of current, making the transistor suitable for switching applications. This feature enhances the performance and reliability of the product.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current flow, making it convenient and cost-effective for switching applications. This configuration ensures easy integration and operation.

Transistor Application: SWITCHING

The switching application of this transistor allows for fast and efficient control of electrical circuits. It enables smooth switching between different states, making it an ideal component for various electronic devices.

Surface Mount: YES

The surface mount capability allows for easy and space-saving installation on PCBs. This feature enhances the versatility and compatibility of the product, making it suitable for compact electronic designs.

Minimum DS Breakdown Voltage: 600 V

The high DS (drain-source) breakdown voltage ensures reliable operation and protection against voltage spikes. This characteristic makes the product suitable for applications that require high voltage handling.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient space utilization and easy integration into electronic circuits. This form factor enhances the flexibility and adaptability of the product.

Terminal Form: GULL WING

The gull wing terminal form provides strong mechanical connections and reliable electrical contacts. This feature ensures secure and stable connections, making it a dependable choice for various applications.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for low power consumption and improved control over the transistor. This mode enhances the efficiency and performance of the product, making it a desirable choice.

No. of Elements: 1

The single element design simplifies circuit designs and reduces complexity. This characteristic enhances ease of use and integration, making it a practical choice for various electronic applications.

Maximum Pulsed Drain Current (IDM): 4 A

The high maximum pulsed drain current rating allows for handling of transient high currents without risk of damage. This capability ensures reliable operation in demanding conditions, making it a valuable choice.

Avalanche Energy Rating (EAS): 33 mJ

The high avalanche energy rating indicates the product's capability to handle energy spikes without failure. This feature provides additional protection and reliability, making it suitable for rugged applications.

No. of Terminals: 2

The two-terminal configuration simplifies circuit connections, reducing complexity and increasing ease of use. This characteristic enhances the convenience and flexibility of the product, making it suitable for various applications.

Maximum Power Dissipation (Abs): 28 W

The high maximum power dissipation rating ensures efficient heat dissipation and reliable operation in high-power applications. This capability makes the product a suitable choice for power-demanding scenarios.

Package Style (Meter): SMALL OUTLINE

The small outline package style allows for compact integration into electronic circuits, saving space and enabling efficient board layouts. This feature enhances compatibility with modern electronic designs.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

The metal-oxide semiconductor technology ensures high performance and reliability. This technological advancement makes the product suitable for various applications requiring robust field effect transistors.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature rating allows the product to operate reliably in extreme conditions. This capability ensures consistent performance and durability, making it a dependable choice.

Transistor Element Material: SILICON

The use of silicon as the transistor element material provides high performance and reliability. Silicon offers superior electronic properties, making the product a suitable choice for demanding applications.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides excellent solderability and corrosion resistance. This terminal finish ensures reliable connections and durable performance, making it a desirable choice.

Maximum Drain-Source On Resistance: 11.5 ohm

The low drain-source on resistance minimizes power loss and improves efficiency. This characteristic makes the product suitable for applications requiring low resistance and high performance.

Terminal Position: SINGLE

The single terminal position simplifies circuit connections and reduces complexity during installation. This feature enhances convenience and ease of use, making it a practical choice for various applications.

Moisture Sensitivity Level (MSL): 1

The moisture sensitivity level 1 indicates the product's resistance to moisture, ensuring long-term reliable operation. This feature provides durability and reliability, making it suitable for diverse environments.

Case Connection: DRAIN

The drain case connection provides a robust and secure attachment for the transistor. This feature ensures stability and reliable performance, making it a preferred choice in demanding applications.

Maximum Time At Peak Reflow Temperature (s): 30

The maximum time at peak reflow temperature indicates the product's ability to withstand high-temperature soldering processes. This characteristic ensures reliable solder joints, making it suitable for manufacturing processes.

Peak Reflow Temperature °C: 260

The high peak reflow temperature rating allows for compatibility with industry-standard manufacturing processes. This capability ensures reliable and efficient soldering, making it a convenient choice for production environments.

Technical Specifications

Power Field Effect Transistors (FET) FQD1N60CTM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Additional Features:

AVALANCHE RATED

Avalanche Energy Rating (EAS):

33 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

1 A

Maximum Drain Current (ID):

1 A

Maximum Drain-Source On Resistance:

11.5 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQD1N60CTM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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