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FQD10N20LTM

Onsemi

FQD10N20LTM by Onsemi

FQD10N20LTM by Onsemi is a N-CHANNEL Power FET with 200V DS Breakdown Voltage, 30.4A IDM, and 0.38 ohm RDS(on). Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE in a PLASTIC/EPOXY package. Operating at up to 150 °C, it offers high power dissipation of 51W in a small outline package style.

Median Price

$0.516

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 304 parts In-Stock

1+ parts

$0.516

100+ parts

$0.485

1k+ parts

$0.439

10k+ parts

-

304

$0.516

$0.485

$0.439

-

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 852 parts In-Stock

1+ parts

$0.490

100+ parts

-

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852

$0.490

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Freelance Electronics

USA . 150 parts In-Stock

1+ parts

$0.560

100+ parts

$0.588

1k+ parts

$0.554

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-

150

$0.560

$0.588

$0.554

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Forefront Electronics and Design

USA . 4 parts In-Stock

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$1.230

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4

$1.230

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Chip Stock

USA . 15,430 parts In-Stock

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Vyrian

USA . 8,447 parts In-Stock

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8,447

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Flip Electronics

USA . 2,800 parts In-Stock

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2,800

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Inventory MP

USA . 641 parts In-Stock

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641

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Bristol Electronics

USA . 382 parts In-Stock

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382

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ComSIT Distribution GmbH

Germany . 243 parts In-Stock

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243

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South Electronics

USA . 21 parts In-Stock

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Prism Electronics

USA . 5 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,504 parts In-Stock

1+ parts

$0.464

100+ parts

-

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2,504

$0.464

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Corohmni

South Africa . 76 parts In-Stock

1+ parts

$0.516

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76

$0.516

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Northwest PG Solutions

USA . 577 parts In-Stock

1+ parts

$3.352

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577

$3.352

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Perfect Parts

USA . 8,333 parts In-Stock

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8,333

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A-Z Elektronik GmbH

Germany . 5,364 parts In-Stock

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5,364

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TANS Electronics

Latvia . 4,916 parts In-Stock

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Kulean Microsystems

USA . 4,841 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,576 parts In-Stock

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3,576

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Problanco Electronics

Mexico . 3,249 parts In-Stock

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SupplyDigital Components

Austria . 3,081 parts In-Stock

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3,081

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Kepictronics

USA . 3,000 parts In-Stock

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3,000

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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GreenTree Electronics

Israel . 2,480 parts In-Stock

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2,480

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Speed Components Ltd (Excess)

Israel . 1,500 parts In-Stock

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Native Components

USA . 195 parts In-Stock

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$2.956

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Supply Digital

USA . 137 parts In-Stock

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UHIMA Technologies

Türkiye . 41 parts In-Stock

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Overview

Unlock the power of innovation with the FQD10N20LTM by Onsemi. Designed with precision and reliability in mind, this N-CHANNEL Power Field Effect Transistor (FET) is a game-changer in the world of switching applications. With a maximum operating temperature of 150 °C and a peak reflow temperature of 260°C, this transistor offers unparalleled performance and efficiency. Whether you're looking to enhance your electronic devices or streamline your operations, the FQD10N20LTM delivers exceptional quality and value that will exceed your expectations. Experience the difference with Onsemi's cutting-edge technology and elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the FET.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplified design with built-in diode, reducing the need for additional components and improving overall efficiency.

Maximum Drain Current (ID): 7.6 A

High maximum drain current allows for handling of higher power loads, making it suitable for a wide range of applications.

Maximum Power Dissipation (Abs): 51 W

High power dissipation capability ensures reliable performance under heavy load conditions.

Maximum Operating Temperature: 150 °C

Can operate efficiently at high temperatures, making it suitable for industrial and automotive applications where heat dissipation is a concern.

Technical Specifications

Power Field Effect Transistors (FET) FQD10N20LTM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

180 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

7.6 A

Maximum Drain Current (ID):

7.6 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-252

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30.4 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQD10N20LTM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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