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FQB19N20CTM

Onsemi

FQB19N20CTM by Onsemi

FQB19N20CTM by Onsemi is a N-CHANNEL Power FET with 200V DS Breakdown Voltage, 76A IDM, and 0.17 ohm RDS(on). Ideal for SWITCHING applications in ENHANCEMENT MODE operation. Features include built-in diode, small outline package style, and high power dissipation of 139W at max temp of 150°C.

Median Price

$7.228

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 522 parts In-Stock

1+ parts

$0.785

100+ parts

$0.738

1k+ parts

$0.667

10k+ parts

-

522

$0.785

$0.738

$0.667

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Chip1Stop

Japan . 723 parts In-Stock

1+ parts

-

100+ parts

$13.670

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723

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$13.670

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Distributors (In-Stock)

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Digiode

USA . 1,431 parts In-Stock

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$0.746

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-

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1,431

$0.746

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Nova Conductors

Japan . 68 parts In-Stock

1+ parts

$1.037

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68

$1.037

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Cyclops Electronics Ltd

UK . 8,321 parts In-Stock

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8,321

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North Shore Components

USA . 2,385 parts In-Stock

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2,385

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Bristol Electronics

USA . 1,376 parts In-Stock

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1,376

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ComSIT Distribution GmbH

Germany . 700 parts In-Stock

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700

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Vyrian

USA . 190 parts In-Stock

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190

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LWI Electronics Inc

India . 25 parts In-Stock

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25

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Speed Components Ltd

Israel . 11 parts In-Stock

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11

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Distributors (Availability)

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Ampacity Inc.

Singapore . 519 parts In-Stock

1+ parts

$0.670

100+ parts

-

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519

$0.670

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Semicontronic

India . 181 parts In-Stock

1+ parts

$0.670

100+ parts

$0.653

1k+ parts

$0.650

10k+ parts

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181

$0.670

$0.653

$0.650

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Corphita

USA . 599 parts In-Stock

1+ parts

$0.706

100+ parts

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599

$0.706

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Corohmni

South Africa . 278 parts In-Stock

1+ parts

$0.785

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278

$0.785

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Aztec Data Supply Inc.

USA . 2,434 parts In-Stock

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$0.950

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2,434

$0.950

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Argo Parts USA

USA . 2,823 parts In-Stock

1+ parts

$1.037

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2,823

$1.037

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Continental Prestige Electronics

USA . 2,074 parts In-Stock

1+ parts

$1.037

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$1.016

2,074

$1.037

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$1.016

Netroflash

USA . 100 parts In-Stock

1+ parts

$1.037

100+ parts

$1.016

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100

$1.037

$1.016

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Andel Nordic

Denmark . 1,200 parts In-Stock

1+ parts

$2.174

100+ parts

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$2.087

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$2.087

1,200

$2.174

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$2.087

$2.087

Lixinc

USA . 13,273 parts In-Stock

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13,273

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Kulean Microsystems

USA . 7,891 parts In-Stock

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TANS Electronics

Latvia . 7,780 parts In-Stock

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SupplyDigital Components

Austria . 7,619 parts In-Stock

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7,619

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Kepictronics

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 4,480 parts In-Stock

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4,480

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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3,900

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Authorized Procurement Solutions

USA . 2,500 parts In-Stock

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Supply Digital

USA . 2,282 parts In-Stock

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Problanco Electronics

Mexico . 1,720 parts In-Stock

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Assy Fe

Spain . 1,007 parts In-Stock

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1,007

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GreenTree Electronics

Israel . 776 parts In-Stock

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776

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Legend Electronics Inc. (Excess)

USA . 776 parts In-Stock

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776

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Speed Components Ltd (Excess)

Israel . 600 parts In-Stock

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600

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Microchip USA

USA . 300 parts In-Stock

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300

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UHIMA Technologies

Türkiye . 237 parts In-Stock

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237

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Overview

Experience the unparalleled power and reliability of the FQB19N20CTM by Onsemi, a leading manufacturer in the industry. As a high-quality Power Field Effect Transistor (FET), this product is perfect for switching applications with its N-CHANNEL configuration and built-in diode. With a maximum power dissipation of 139W and operating temperature of 150°C, customers can trust in the durability and efficiency of this transistor. Whether you're looking to enhance your electronics or improve performance, the FQB19N20CTM offers unmatched value and benefits that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a long lifespan for the product.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have better performance and efficiency compared to P-channel FETs, making this product a good choice for various applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient switching and protection against reverse currents, enhancing the overall performance of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring reliable performance in various switching circuits.

Maximum Drain-Source On Resistance: 0.17 ohm

Low on-resistance leads to reduced power loss and heat generation, making this FET highly efficient in power management applications.

Technical Specifications

Power Field Effect Transistors (FET) FQB19N20CTM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

433 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

200 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.17 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

76 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQB19N20CTM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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