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FQB11P06TM

Onsemi

FQB11P06TM by Onsemi

The Onsemi FQB11P06TM is a P-CHANNEL Power FET with 60V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 45.6A and EAS of 160mJ, operating in ENHANCEMENT MODE with 0.175 ohm RDS(on). The PLASTIC/EPOXY package has GULL WING terminals and can handle up to 53W power dissipation at 150°C.

Median Price

$0.703

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Nova Conductors

Japan . 27 parts In-Stock

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$0.703

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Chip Stock

USA . 26,500 parts In-Stock

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Digiode

USA . 1,063 parts In-Stock

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Vyrian

USA . 143 parts In-Stock

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ECAB

Sweden . 138 parts In-Stock

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PC Components Company LLC

USA . 10 parts In-Stock

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Bristol Electronics

USA . 10 parts In-Stock

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Distributors (Availability)

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Corohmni

South Africa . 257 parts In-Stock

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$0.675

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257

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Continental Prestige Electronics

USA . 3,623 parts In-Stock

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$0.703

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$0.688

3,623

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$0.688

Argo Parts USA

USA . 820 parts In-Stock

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$0.703

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$0.681

820

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$0.681

Aztec Data Supply Inc.

USA . 1,806 parts In-Stock

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$1.410

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Microchip USA

USA . 367 parts In-Stock

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$4.355

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367

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AZTECH Wire

Italy . 337 parts In-Stock

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$7.731

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337

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Semicontronic

India . 1,464 parts In-Stock

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$20.050

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$19.549

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$19.448

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Ampacity Inc.

Singapore . 1,416 parts In-Stock

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$57.050

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Lixinc

USA . 10,060 parts In-Stock

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Problanco Electronics

Mexico . 7,465 parts In-Stock

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SupplyDigital Components

Austria . 6,389 parts In-Stock

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Authorized Procurement Solutions

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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TANS Electronics

Latvia . 3,144 parts In-Stock

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Kulean Microsystems

USA . 1,756 parts In-Stock

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Assy Fe

Spain . 1,500 parts In-Stock

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Corphita

USA . 1,372 parts In-Stock

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Supply Digital

USA . 834 parts In-Stock

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UHIMA Technologies

Türkiye . 802 parts In-Stock

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Bastille Electronics

Australia . 10 parts In-Stock

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Overview

Experience the power of innovation with the FQB11P06TM by Onsemi. Crafted with precision and expertise, this P-Channel Power Field Effect Transistor (FET) offers unmatched quality and performance for a wide range of switching applications. With its single configuration and built-in diode, this transistor ensures seamless operation and enhanced efficiency. Unlock new possibilities and elevate your projects with the reliability and value that the FQB11P06TM brings to the table. Trust in Onsemi to deliver cutting-edge solutions that exceed expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes this FET lightweight and durable, suitable for various applications.

Polarity or Channel Type: P-CHANNEL

The P-channel type allows for efficient current flow and power management, making this FET a reliable choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and protects against reverse current, making this FET ideal for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET ensures high performance and reliable operation in various power management scenarios.

Surface Mount: YES

Being surface-mountable, this FET allows for easy and convenient PCB integration, saving space and simplifying the assembly process.

Minimum DS Breakdown Voltage: 60 V

With a minimum breakdown voltage of 60V, this FET provides a safe and stable operation in high-voltage environments.

Package Shape: RECTANGULAR

The rectangular package shape offers a compact and efficient design, making this FET suitable for space-constrained applications.

Terminal Form: GULL WING

The gull wing terminal form ensures secure connections and easy soldering, enhancing the overall reliability of the FET.

Operating Mode: ENHANCEMENT MODE

The enhancement mode operation allows for precise control over the FET's conductivity, ensuring efficient power management and performance.

Maximum Pulsed Drain Current (IDM): 45.6 A

With a high maximum pulsed drain current, this FET can handle sudden surges in power, making it suitable for demanding applications.

Technical Specifications

Power Field Effect Transistors (FET) FQB11P06TM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

160 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

60 V

Maximum Drain Current (Abs) (ID):

11.4 A

Maximum Drain Current (ID):

11.4 A

Maximum Drain-Source On Resistance:

.175 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45.6 A

Qualification:

Not Qualified

Sub-Category:

Other Transistors

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FQB11P06TM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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