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FOD3182TSV

Onsemi

FOD3182TSV by Onsemi

FOD3182TSV by Onsemi is a single optocoupler with a max forward current of 0.016A and isolation voltage of 5000V. It operates b/w -40°C to 100°C, making it suitable for logic IC output applications requiring high voltage protection in surface mount configurations.

Median Price

$2.385

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 125 parts In-Stock

1+ parts

$1.470

100+ parts

$1.440

1k+ parts

$1.410

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125

$1.470

$1.440

$1.410

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DigiKey

USA . 100 parts In-Stock

1+ parts

$3.300

100+ parts

$1.885

1k+ parts

$1.578

10k+ parts

$1.445

100

$3.300

$1.885

$1.578

$1.445

EBV Elektronik

Germany . 1,000 parts In-Stock

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1,000

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Digiode

USA . 2,599 parts In-Stock

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$1.396

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2,599

$1.396

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Nova Conductors

Japan . 76 parts In-Stock

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$1.458

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76

$1.458

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NAC Semi

USA . 1,000 parts In-Stock

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$1.690

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$1.690

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TME

Poland . 1,000 parts In-Stock

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$0.680

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$0.680

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Vyrian

USA . 408 parts In-Stock

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Semtec, LLC

USA . 5 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,499 parts In-Stock

1+ parts

$0.578

100+ parts

-

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3,499

$0.578

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Ampacity Inc.

Singapore . 274 parts In-Stock

1+ parts

$1.250

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274

$1.250

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Semicontronic

India . 236 parts In-Stock

1+ parts

$1.250

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$1.219

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$1.212

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236

$1.250

$1.219

$1.212

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Corphita

USA . 3,034 parts In-Stock

1+ parts

$1.323

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3,034

$1.323

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Corohmni

South Africa . 354 parts In-Stock

1+ parts

$1.429

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354

$1.429

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Continental Prestige Electronics

USA . 5,295 parts In-Stock

1+ parts

$1.458

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$1.429

5,295

$1.458

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$1.429

Argo Parts USA

USA . 4,191 parts In-Stock

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$1.458

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$1.458

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Netroflash

USA . 1,000 parts In-Stock

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$1.458

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1,000

$1.458

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Advanced Electronics

New Zealand . 350 parts In-Stock

1+ parts

$1.487

100+ parts

$1.487

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$1.487

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350

$1.487

$1.487

$1.487

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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TANS Electronics

Latvia . 6,687 parts In-Stock

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6,687

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SupplyDigital Components

Austria . 5,926 parts In-Stock

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Problanco Electronics

Mexico . 5,366 parts In-Stock

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iodParts Technologies Inc.

India . 4,200 parts In-Stock

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Kulean Microsystems

USA . 2,533 parts In-Stock

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Supply Digital

USA . 1,726 parts In-Stock

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Perfect Parts

USA . 1,098 parts In-Stock

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UHIMA Technologies

Türkiye . 471 parts In-Stock

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Kepictronics

USA . 123 parts In-Stock

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Overview

Experience the superior quality and precision engineering of Onsemi with the FOD3182TSV optocoupler circuit output. Ideal for a wide range of applications, this single configuration logic IC output optocoupler offers a high level of isolation and reliability. With a maximum isolation voltage of 5000 V and a maximum forward current of 0.016 A, this product ensures optimal performance even in challenging environments. Trust Onsemi to deliver exceptional value, benefits, and advantages with the FOD3182TSV, setting a new standard in optoelectronics.

Feature Benefit Bullets

Configuration: SINGLE

SINGLE configuration simplifies the design and implementation of the optocoupler circuit outputs, making it easy to use in various applications.

Maximum Forward Current: 0.016 A

The maximum forward current of 0.016 A ensures efficient operation and reliability of the optocoupler circuit outputs under normal conditions.

Optoelectronic Type: LOGIC IC OUTPUT OPTOCOUPLER

The optoelectronic type of LOGIC IC OUTPUT OPTOCOUPLER indicates that this product is specifically designed for logic IC output applications, providing reliable signal isolation.

Minimum Supply Voltage: 10 V

The minimum supply voltage of 10 V ensures stable operation of the optocoupler circuit outputs, even under varying input voltage conditions.

Maximum Operating Temperature: 100 °C

The high maximum operating temperature of 100°C allows the optocoupler circuit outputs to operate in a wide range of environmental conditions without any issues.

Minimum Operating Temperature: -40 °C

The low minimum operating temperature of -40°C ensures the optocoupler circuit outputs can function even in extreme cold conditions without any degradation in performance.

Terminal Finish: MATTE TIN

The matte tin terminal finish provides good solderability and reliability, ensuring secure connections in the circuit design.

Maximum Power Dissipation: 0.295 W

The maximum power dissipation of 0.295 W indicates the ability of the optocoupler circuit outputs to handle power efficiently and prevent overheating during operation.

Maximum Isolation Voltage: 5000 V

The high maximum isolation voltage of 5000 V ensures reliable signal isolation and protection in the optocoupler circuit outputs, making it suitable for high-voltage applications.

Mounting Feature: SURFACE MOUNT

The surface mounting feature offers easy and secure installation of the optocoupler circuit outputs on PCBs, optimizing space and reducing assembly time.

Maximum Forward Voltage: 1.8 V

The low maximum forward voltage of 1.8 V helps in minimizing power consumption and improving the efficiency of the optocoupler circuit outputs in various electronic systems.

Technical Specifications

Optocoupler Circuit Outputs FOD3182TSV attributes and parameters. Explore more Optocoupler Circuit Outputs devices from Onsemi

Specs

Additional Features:

UL RECOGNIZED, VDE APPROVED

Configuration:

SINGLE

Maximum Forward Current:

.016 A

Maximum Forward Voltage:

1.8 V

Maximum Isolation Voltage:

5000 V

JESD-609 Code:

e3

Mounting Feature:

No. of Elements:

1

No. of Functions:

1

Maximum Operating Temperature:

100 Cel

Minimum Operating Temperature:

-40 Cel

Optoelectronic Type:

Maximum Power Dissipation:

.295 W

Sub-Category:

Optocoupler - Transistor Outputs

Minimum Supply Voltage:

10 V

Terminal Finish:

Trade Compliance

FOD3182TSV Optoelectronics trade compliance attributes, and parameters.

HTS

8541.40.80.00

SB

8541.40.80.00

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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