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FGH80N60FD2

Onsemi

FGH80N60FD2 by Onsemi

FGH80N60FD2 by Onsemi is an N-CHANNEL IGBT with a max VCEsat of 2.4V and IC of 80A. Ideal for POWER CONTROL applications, it has a package style of FLANGE MOUNT and can operate at temperatures ranging from -55 to 150 °C.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

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Vyrian

USA . 812 parts In-Stock

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Digiode

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Nova Conductors

Japan . 21 parts In-Stock

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Ampacity Inc.

Singapore . 803 parts In-Stock

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$62.050

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A-Z Elektronik GmbH

Germany . 7,605 parts In-Stock

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SupplyDigital Components

Austria . 6,143 parts In-Stock

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Kulean Microsystems

USA . 5,358 parts In-Stock

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Continental Prestige Electronics

USA . 4,427 parts In-Stock

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Argo Parts USA

USA . 4,096 parts In-Stock

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TANS Electronics

Latvia . 2,946 parts In-Stock

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Corphita

USA . 1,263 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,170 parts In-Stock

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Problanco Electronics

Mexico . 494 parts In-Stock

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UHIMA Technologies

Türkiye . 396 parts In-Stock

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Corohmni

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Aranea Global

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Overview

Unleash the power of innovation with the FGH80N60FD2 by Onsemi! This top-of-the-line Insulated Gate Bipolar Transistor (IGBT) offers unmatched quality and reliability, thanks to its cutting-edge design and superior manufacturing process. Ideal for power control applications, this N-CHANNEL transistor with a built-in diode ensures optimal performance and efficiency. Experience seamless operation and maximum power dissipation with this high-performance component, designed to meet all your needs. Trust Onsemi for exceptional value and unparalleled benefits in every application.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good protection for the internal components and ensures durability.

Polarity or Channel Type: N-CHANNEL

N-channel IGBTs typically have lower on-state voltage drop and higher efficiency compared to P-channel types.

Configuration: SINGLE WITH BUILT-IN DIODE

Built-in diode simplifies circuit design and can improve the overall efficiency of the power control system.

Transistor Application: POWER CONTROL

Specifically designed for power control applications, ensuring reliable and efficient performance.

Maximum VCEsat: 2.4 V

Low VCEsat helps in reducing power losses and improving overall efficiency of the device.

Nominal Turn Off Time (toff): 201 ns

Fast turn off time enables quick switching, which is essential for power control applications.

Maximum Power Dissipation (Abs): 290 W

High power dissipation capability allows for handling of larger power loads without overheating.

Maximum Collector-Emitter Voltage: 600 V

High VCE rating allows for operation in high voltage applications.

Maximum Gate-Emitter Voltage: 20 V

Sufficient gate-emitter voltage rating for reliable and stable operation.

Maximum Collector Current (IC): 80 A

High collector current rating allows for handling of larger current loads.

Technical Specifications

Insulated Gate Bipolar Transistors (IGBT) FGH80N60FD2 attributes and parameters. Explore more Insulated Gate Bipolar Transistors (IGBT) devices from Onsemi

Specs

Additional Features:

LOW CONDUCTION LOSS

Case Connection:

COLLECTOR

Maximum Collector Current (IC):

Maximum Collector-Emitter Voltage:

600 V

Maximum Gate-Emitter Threshold Voltage:

7 V

Maximum Gate-Emitter Voltage:

20 V

JEDEC-95 Code:

TO-247AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

POWER CONTROL

Transistor Element Material:

SILICON

Nominal Turn Off Time (toff):

201 ns

Nominal Turn On Time (ton):

74 ns

Maximum VCEsat:

2.4 V

Trade Compliance

FGH80N60FD2 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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