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FDPF8N50NZU

Onsemi

FDPF8N50NZU by Onsemi

FDPF8N50NZU by Onsemi is a N-CHANNEL Power FET with 500V DS Breakdown Voltage. Ideal for SWITCHING applications, it features 26A Max Pulsed Drain Current and 1.2ohm Max RDS(on). Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 40W and can withstand temperatures up to 150°C.

Median Price

$1.275

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 26,900 parts In-Stock

1+ parts

-

100+ parts

$1.230

1k+ parts

$1.020

10k+ parts

$0.910

26,900

-

$1.230

$1.020

$0.910

Verical

USA . 16,700 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$1.275

10k+ parts

$1.138

16,700

-

-

$1.275

$1.138

Flip Electronics (Authorized)

USA . 12,624 parts In-Stock

1+ parts

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12,624

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DigiKey

USA . 3,685 parts In-Stock

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$1.540

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3,685

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$1.540

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Distributors (In-Stock)

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Digiode

USA . 1,535 parts In-Stock

1+ parts

$0.960

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1,535

$0.960

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Nova Conductors

Japan . 150 parts In-Stock

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$1.043

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150

$1.043

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Vyrian

USA . 14,571 parts In-Stock

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14,571

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Flip Electronics

USA . 12,624 parts In-Stock

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12,624

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DigiKey Marketplace

USA . 3,821 parts In-Stock

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3,821

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ACDS - Activité Composants Distribution Service

France . 899 parts In-Stock

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899

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Semicontronic

India . 14,606 parts In-Stock

1+ parts

$0.860

100+ parts

$0.838

1k+ parts

$0.834

10k+ parts

-

14,606

$0.860

$0.838

$0.834

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Ampacity Inc.

Singapore . 14,476 parts In-Stock

1+ parts

$0.860

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14,476

$0.860

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Corphita

USA . 451 parts In-Stock

1+ parts

$0.909

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451

$0.909

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Corohmni

South Africa . 347 parts In-Stock

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$1.002

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347

$1.002

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Argo Parts USA

USA . 4,421 parts In-Stock

1+ parts

$1.043

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4,421

$1.043

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Continental Prestige Electronics

USA . 4,235 parts In-Stock

1+ parts

$1.043

100+ parts

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$1.022

4,235

$1.043

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$1.022

Metaverse IC Inc.

Canada . 56,986 parts In-Stock

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56,986

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Lixinc

USA . 15,050 parts In-Stock

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15,050

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Kepictronics

USA . 10,020 parts In-Stock

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Perfect Parts

USA . 8,334 parts In-Stock

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8,334

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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TANS Electronics

Latvia . 6,911 parts In-Stock

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Microchip USA

USA . 4,463 parts In-Stock

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4,463

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SupplyDigital Components

Austria . 3,153 parts In-Stock

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3,153

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Supply Digital

USA . 2,776 parts In-Stock

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2,776

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Kulean Microsystems

USA . 2,714 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 2,714 parts In-Stock

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2,714

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Problanco Electronics

Mexico . 2,625 parts In-Stock

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2,625

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Netroflash

USA . 2,000 parts In-Stock

1+ parts

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$1.022

1k+ parts

$0.991

10k+ parts

$0.970

2,000

-

$1.022

$0.991

$0.970

Cyclops Electronics Ltd (Excess)

UK . 899 parts In-Stock

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899

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UHIMA Technologies

Türkiye . 445 parts In-Stock

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445

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Overview

Unleash the power of innovation with the FDPF8N50NZU by Onsemi. As a leading manufacturer in the industry, Onsemi delivers top-quality Power Field Effect Transistors (FET) that are perfect for a variety of switching applications. With a minimum DS Breakdown Voltage of 500V and a maximum Drain-Source On Resistance of 1.2 ohm, this N-channel transistor offers unparalleled performance and reliability. Whether you're looking to enhance your electronic devices or boost efficiency in your systems, the FDPF8N50NZU is the perfect solution. Experience the value and benefits that Onsemi brings to the table with this cutting-edge product.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, making it suitable for various environments.

Polarity or Channel Type: N-CHANNEL

N-Channel FETs typically have lower on-state resistance and higher switching speeds compared to P-Channel FETs, making them ideal for high-performance applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient switching and protects against reverse voltage spikes, enhancing the reliability of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this FET offers fast turn-on and turn-off times, making it ideal for power control and regulation.

Minimum DS Breakdown Voltage: 500 V

The high breakdown voltage enables the transistor to handle high voltages, providing robust protection against voltage spikes and surges.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and placement on PCBs, saving space and facilitating efficient circuit design.

Operating Mode: ENHANCEMENT MODE

Enhancement-mode FETs provide better control over the switching operation, offering stable performance and high efficiency in various applications.

Maximum Pulsed Drain Current (IDM): 26 A

The high pulsed drain current rating ensures the transistor can handle short-duration high-current pulses without risk of damage, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 80 mJ

The high avalanche energy rating indicates the ability of the transistor to withstand large energy pulses, ensuring reliable operation in high-stress conditions.

Maximum Drain Current (Abs) (ID): 6.5 A

The maximum drain current rating of 6.5 A allows the transistor to handle moderate current loads, making it versatile for a wide range of applications.

Maximum Power Dissipation (Abs): 40 W

With a maximum power dissipation of 40 W, this FET can efficiently dissipate heat generated during operation, ensuring reliable performance under high power loads.

Package Style (Meter): FLANGE MOUNT

The flange mount package style provides secure mounting and heat dissipation capabilities, ensuring stable operation even in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high-speed operation, low power consumption, and high efficiency, making it ideal for power switching applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature of 150°C allows the transistor to operate reliably in elevated temperatures, expanding its applicability in various industrial settings.

Transistor Element Material: SILICON

Silicon is a common semiconductor material known for its reliability and efficiency, ensuring stable and consistent performance of the transistor over its operational lifespan.

Terminal Finish: MATTE TIN

The matte tin finish provides corrosion resistance and ensures good electrical contact, enhancing the overall reliability and longevity of the transistor.

Maximum Drain-Source On Resistance: 1.2 ohm

The low drain-source on resistance of 1.2 ohm minimizes power losses and allows for efficient current conduction, making the transistor suitable for high-performance applications.

Package Style: RECTANGULAR

The rectangular package style allows for easy integration and placement on PCBs, facilitating streamlined circuit design and assembly.

Case Connection: ISOLATED

The isolated case connection provides electrical insulation and prevents short circuits, ensuring safe and reliable operation of the transistor in diverse environments.

Technical Specifications

Power Field Effect Transistors (FET) FDPF8N50NZU attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

80 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

500 V

Maximum Drain Current (Abs) (ID):

6.5 A

Maximum Drain Current (ID):

6.5 A

Maximum Drain-Source On Resistance:

1.2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

26 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDPF8N50NZU Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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