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FDP8D5N10C

Onsemi

FDP8D5N10C by Onsemi

FDP8D5N10C by Onsemi is a N-CHANNEL Power FET with 100V DS Breakdown Voltage, ideal for SWITCHING applications. It features a max IDM of 304A and EAS of 181mJ, making it suitable for high-power operations. With an operating temperature range from -55 to 175 °C, this transistor offers reliable performance in various environments.

Median Price

$2.510

Lifecycle Status

Suppliers In-Stock

13

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 4 parts In-Stock

1+ parts

$1.682

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4

$1.682

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Farnell

UK . 832 parts In-Stock

1+ parts

$2.100

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$1.290

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$1.240

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832

$2.100

$1.290

$1.240

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DigiKey

USA . 1,000 parts In-Stock

1+ parts

$2.370

100+ parts

$1.037

1k+ parts

$0.763

10k+ parts

$0.662

1,000

$2.370

$1.037

$0.763

$0.662

Chip1Stop

Japan . 7 parts In-Stock

1+ parts

$2.650

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$2.650

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Element14

Singapore . 851 parts In-Stock

1+ parts

$2.847

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$2.258

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$2.020

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851

$2.847

$2.258

$2.020

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Mouser Electronics

USA . 1,537 parts In-Stock

1+ parts

$3.010

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$1.640

1k+ parts

$1.400

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1,537

$3.010

$1.640

$1.400

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Newark

USA . 838 parts In-Stock

1+ parts

$3.900

100+ parts

$2.600

1k+ parts

$2.390

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838

$3.900

$2.600

$2.390

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Flip Electronics (Authorized)

USA . 3,567 parts In-Stock

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3,567

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Rochester

USA . 130 parts In-Stock

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$1.280

1k+ parts

$1.150

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$1.080

130

-

$1.280

$1.150

$1.080

Verical

USA . 4 parts In-Stock

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Digiode

USA . 1,462 parts In-Stock

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$1.358

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1,462

$1.358

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Vyrian

USA . 1,221 parts In-Stock

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$1.430

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Flip Electronics

USA . 3,567 parts In-Stock

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Native Components

USA . 813 parts In-Stock

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$0.105

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$0.100

813

$0.105

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$0.100

Northwest PG Solutions

USA . 526 parts In-Stock

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$0.115

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$0.101

526

$0.115

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$0.101

Corphita

USA . 437 parts In-Stock

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$1.287

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437

$1.287

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Corohmni

South Africa . 90 parts In-Stock

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$1.430

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90

$1.430

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Continental Prestige Electronics

USA . 868 parts In-Stock

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$1.450

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868

$1.450

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Microchip USA

USA . 5,278 parts In-Stock

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$18.785

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$18.785

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SupplyDigital Components

Austria . 8,390 parts In-Stock

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TANS Electronics

Latvia . 5,011 parts In-Stock

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Perfect Parts

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Problanco Electronics

Mexico . 1,364 parts In-Stock

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Kulean Microsystems

USA . 1,240 parts In-Stock

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UHIMA Technologies

Türkiye . 352 parts In-Stock

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Overview

Discover the FDP8D5N10C by Onsemi, a top-quality Power Field Effect Transistor designed for switching applications. With a robust design and built-in diode, this N-Channel transistor offers unmatched reliability and performance. Ideal for various electronic projects, this FET provides a maximum power dissipation of 107W and a minimum DS breakdown voltage of 100V, ensuring efficient operation even in demanding conditions. Upgrade your electronics with the FDP8D5N10C and experience the superior quality and value that Onsemi products deliver.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package provides durability and protection for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON resistance and higher current carrying capability, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and provides reverse polarity protection, enhancing the overall reliability of the product.

Minimum DS Breakdown Voltage: 100 V

The high breakdown voltage allows for reliable operation in high voltage applications, increasing the versatility of the transistor.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and low ON resistance, ideal for efficient power control.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs offer ease of control and high input impedance, facilitating efficient switching operation in various circuit designs.

Maximum Pulsed Drain Current (IDM): 304 A

With a high pulsed drain current rating, this transistor is capable of handling short-duration high current surges, making it suitable for demanding applications.

Avalanche Energy Rating (EAS): 181 mJ

The high avalanche energy rating means that the transistor can withstand energy spikes without failing, ensuring reliable operation in rugged environments.

Maximum Power Dissipation (Abs): 107 W

The high power dissipation capability allows the transistor to handle high power levels without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 175 °C

With a high maximum operating temperature, this transistor can operate reliably in high-temperature environments, ensuring consistent performance under stress.

Technical Specifications

Power Field Effect Transistors (FET) FDP8D5N10C attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

181 mJ

Minimum DS Breakdown Voltage:

100 V

Maximum Drain Current (Abs) (ID):

76 A

Maximum Drain Current (ID):

76 A

Maximum Drain-Source On Resistance:

.0085 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

25 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

2.4 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

304 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

38 ns

Maximum Turn On Time (ton):

42 ns

Trade Compliance

FDP8D5N10C Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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