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FDP8870

Onsemi

FDP8870 by Onsemi

FDP8870 by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage and 19A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, 0.0046 ohm On Resistance, and 160W Power Dissipation in a RECTANGULAR package.

Median Price

$0.944

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Farnell

UK . 54 parts In-Stock

1+ parts

$0.503

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-

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54

$0.503

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Newark

USA . 1 parts In-Stock

1+ parts

$1.940

100+ parts

$1.340

1k+ parts

$0.991

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-

1

$1.940

$1.340

$0.991

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RS (Exports)

UK . 815 parts In-Stock

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$0.838

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815

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$0.838

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Rochester

USA . 106 parts In-Stock

1+ parts

-

100+ parts

$1.050

1k+ parts

$0.872

10k+ parts

$0.777

106

-

$1.050

$0.872

$0.777

Distributors (In-Stock)

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Digiode

USA . 1,818 parts In-Stock

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$0.821

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1,818

$0.821

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Vyrian

USA . 3,105 parts In-Stock

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$0.864

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3,105

$0.864

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Component Electronics Inc.

Canada . 10 parts In-Stock

1+ parts

$1.540

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$1.150

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$1.000

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10

$1.540

$1.150

$1.000

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LWI Electronics Inc

India . 1,299 parts In-Stock

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1,299

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ComSIT Distribution GmbH

Germany . 800 parts In-Stock

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800

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ComSIT USA

USA . 800 parts In-Stock

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800

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Nova Conductors

Japan . 500 parts In-Stock

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500

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ACDS - Activité Composants Distribution Service

France . 360 parts In-Stock

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360

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Bristol Electronics

USA . 360 parts In-Stock

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100+ parts

$0.703

1k+ parts

$0.525

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360

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$0.703

$0.525

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Dan-Mar Components

USA . 360 parts In-Stock

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360

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Connector Distribution Corp

USA . 300 parts In-Stock

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300

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Right Parts Inc.

USA . 300 parts In-Stock

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300

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Prism Electronics

USA . 250 parts In-Stock

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250

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Distributors (Availability)

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Ampacity Inc.

Singapore . 103 parts In-Stock

1+ parts

$0.730

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103

$0.730

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Corphita

USA . 995 parts In-Stock

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$0.778

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995

$0.778

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Corohmni

South Africa . 265 parts In-Stock

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$0.864

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265

$0.864

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Component Stockers USA

USA . 514 parts In-Stock

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$99.990

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514

$99.990

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RC Electronics

USA . 63,799 parts In-Stock

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$0.820

1k+ parts

$0.740

10k+ parts

$0.720

63,799

-

$0.820

$0.740

$0.720

Perfect Parts

USA . 8,960 parts In-Stock

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TANS Electronics

Latvia . 5,187 parts In-Stock

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Problanco Electronics

Mexico . 5,127 parts In-Stock

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Kulean Microsystems

USA . 2,907 parts In-Stock

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Supply Digital

USA . 1,645 parts In-Stock

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Assy Fe

Spain . 1,000 parts In-Stock

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Kepictronics

USA . 800 parts In-Stock

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800

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UHIMA Technologies

Türkiye . 521 parts In-Stock

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521

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Netroflash

USA . 500 parts In-Stock

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500

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iodParts Technologies Inc.

India . 250 parts In-Stock

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SupplyDigital Components

Austria . 83 parts In-Stock

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83

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Overview

Elevate your power management solutions with the FDP8870 from Onsemi. Crafted with precision and expertise, this N-channel Power Field Effect Transistor offers unparalleled performance in switching applications. With a robust design and high energy efficiency, this transistor provides reliable power control while ensuring optimal functionality. Trust Onsemi's reputation for quality and innovation - experience the difference with the FDP8870 today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Allows for efficient current flow in one direction, making the transistor suitable for various switching applications.

Minimum DS Breakdown Voltage: 30 V

With a high breakdown voltage, this transistor can handle higher voltages without damage, ensuring reliable performance in various circuits.

Maximum Drain Current (Abs) (ID): 19 A

Capable of handling high current loads, making it suitable for power applications that require efficient switching capabilities.

Maximum Power Dissipation (Abs): 160 W

With a high power dissipation rating, this transistor can handle heat generated during operation, ensuring reliable performance under high-power conditions.

Maximum Operating Temperature: 175 °C

Operates efficiently at high temperatures, making it suitable for applications where heat dissipation is crucial.

Technical Specifications

Power Field Effect Transistors (FET) FDP8870 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

300 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

19 A

Maximum Drain Current (ID):

19 A

Maximum Drain-Source On Resistance:

.0046 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP8870 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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