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FDP5N60NZ

Onsemi

FDP5N60NZ by Onsemi

FDP5N60NZ by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it has a Max Pulsed Drain Current of 18A and Max Power Dissipation of 100W. This ENHANCEMENT MODE transistor features a METAL-OXIDE SEMICONDUCTOR technology and operates at up to 150°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

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DigiKey

USA . 2,400 parts In-Stock

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USA . 2,400 parts In-Stock

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Flip Electronics

USA . 2,400 parts In-Stock

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DigiKey Marketplace

USA . 2,400 parts In-Stock

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Vyrian

USA . 2,201 parts In-Stock

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Digiode

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Elcom Components

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Nova Conductors

Japan . 10 parts In-Stock

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Aztec Data Supply Inc.

USA . 2,237 parts In-Stock

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$1.363

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Microchip USA

USA . 6,770 parts In-Stock

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$3.445

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Semicontronic

India . 2,185 parts In-Stock

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$26.050

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$25.399

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$25.268

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Ampacity Inc.

Singapore . 2,369 parts In-Stock

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$48.050

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Kulean Microsystems

USA . 8,252 parts In-Stock

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SupplyDigital Components

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A-Z Elektronik GmbH

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Problanco Electronics

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Authorized Procurement Solutions

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Corphita

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Supply Digital

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Component Stockers USA

USA . 1,896 parts In-Stock

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Perfect Parts

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TANS Electronics

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Argo Parts USA

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UHIMA Technologies

Türkiye . 364 parts In-Stock

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Bastille Electronics

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Corohmni

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Continental Prestige Electronics

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Overview

Unleash the power of innovation with the FDP5N60NZ by Onsemi! As a leading manufacturer in the industry, Onsemi delivers unparalleled quality and reliability in their Power Field Effect Transistors. Ideal for switching applications, this N-channel transistor offers a single configuration with a built-in diode, providing maximum efficiency and performance. With a 600V minimum breakdown voltage and 18A maximum pulsed drain current, the FDP5N60NZ is designed to meet the demands of high-power applications. Experience the value and benefits of this product today and elevate your projects to new heights of success.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection to the internal components, making the product long-lasting and reliable.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have higher mobility and conductivity, leading to better performance in switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling in inductive loads, reducing the need for external components.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring high efficiency and fast switching speeds.

Minimum DS Breakdown Voltage: 600 V

Can handle high voltage applications, providing a wide range of usage scenarios.

Maximum Power Dissipation (Abs): 100 W

With a high power dissipation rating, the FET can handle large loads without overheating.

Maximum Operating Temperature: 150 °C

Able to operate in high-temperature environments without performance degradation, ensuring reliability in various conditions.

Technical Specifications

Power Field Effect Transistors (FET) FDP5N60NZ attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

175 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

2 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

18 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP5N60NZ Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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