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FDP2710

Onsemi

FDP2710 by Onsemi

The Onsemi FDP2710 is a N-CHANNEL Power FET with 250V DS Breakdown Voltage and 50A Drain Current. Ideal for SWITCHING applications, it features a SINGLE configuration with BUILT-IN DIODE. With an EAS of 145mJ and operating temperature up to 150°C, it offers reliable performance in various power management systems.

Median Price

$4.162

Lifecycle Status

Suppliers In-Stock

16

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 258 parts In-Stock

1+ parts

$2.830

100+ parts

$1.968

1k+ parts

$1.940

10k+ parts

-

258

$2.830

$1.968

$1.940

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Arrow

USA . 8 parts In-Stock

1+ parts

$3.525

100+ parts

$2.227

1k+ parts

$1.859

10k+ parts

-

8

$3.525

$2.227

$1.859

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Mouser Electronics

USA . 3,906 parts In-Stock

1+ parts

$4.800

100+ parts

$2.540

1k+ parts

$2.250

10k+ parts

$2.240

3,906

$4.800

$2.540

$2.250

$2.240

Newark

USA . 597 parts In-Stock

1+ parts

$5.100

100+ parts

$3.470

1k+ parts

$2.980

10k+ parts

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597

$5.100

$3.470

$2.980

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DigiKey

USA . 798 parts In-Stock

1+ parts

$5.220

100+ parts

$2.482

1k+ parts

$1.941

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798

$5.220

$2.482

$1.941

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Verical

USA . 8 parts In-Stock

1+ parts

-

100+ parts

$2.227

1k+ parts

$1.859

10k+ parts

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8

-

$2.227

$1.859

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Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Nova Conductors

Japan . 54 parts In-Stock

1+ parts

$2.329

100+ parts

-

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-

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54

$2.329

-

-

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Digiode

USA . 2,957 parts In-Stock

1+ parts

$2.688

100+ parts

-

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-

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2,957

$2.688

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-

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Chip Stock

USA . 16,342 parts In-Stock

1+ parts

-

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16,342

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Flip Electronics

USA . 12,800 parts In-Stock

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12,800

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ComSIT Distribution GmbH

Germany . 5,648 parts In-Stock

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5,648

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ComSIT USA

USA . 5,648 parts In-Stock

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5,648

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NAC Semi

USA . 600 parts In-Stock

1+ parts

-

100+ parts

$3.260

1k+ parts

$3.010

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600

-

$3.260

$3.010

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Bristol Electronics

USA . 370 parts In-Stock

1+ parts

-

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370

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Vyrian

USA . 124 parts In-Stock

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124

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LWI Electronics Inc

India . 8 parts In-Stock

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8

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Aztec Data Supply Inc.

USA . 1,858 parts In-Stock

1+ parts

$0.496

100+ parts

-

1k+ parts

-

10k+ parts

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1,858

$0.496

-

-

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Corohmni

South Africa . 85 parts In-Stock

1+ parts

$2.237

100+ parts

-

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85

$2.237

-

-

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Aranea Global

USA . 1,000 parts In-Stock

1+ parts

$2.282

100+ parts

-

1k+ parts

$2.191

10k+ parts

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1,000

$2.282

-

$2.191

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Argo Parts USA

USA . 3,043 parts In-Stock

1+ parts

$2.329

100+ parts

-

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3,043

$2.329

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Continental Prestige Electronics

USA . 2,110 parts In-Stock

1+ parts

$2.329

100+ parts

-

1k+ parts

-

10k+ parts

$2.282

2,110

$2.329

-

-

$2.282

Semicontronic

India . 288 parts In-Stock

1+ parts

$2.350

100+ parts

$2.291

1k+ parts

$2.280

10k+ parts

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288

$2.350

$2.291

$2.280

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Ampacity Inc.

Singapore . 81 parts In-Stock

1+ parts

$2.350

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81

$2.350

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Corphita

USA . 773 parts In-Stock

1+ parts

$2.547

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773

$2.547

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Component Stockers USA

USA . 2,639 parts In-Stock

1+ parts

$4.000

100+ parts

$2.720

1k+ parts

$1.950

10k+ parts

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2,639

$4.000

$2.720

$1.950

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Andel Nordic

Denmark . 4,626 parts In-Stock

1+ parts

$10.926

100+ parts

-

1k+ parts

$10.489

10k+ parts

$10.489

4,626

$10.926

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$10.489

$10.489

Microchip USA

USA . 4,114 parts In-Stock

1+ parts

$28.340

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4,114

$28.340

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RC Electronics

USA . 43,047 parts In-Stock

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$2.440

1k+ parts

$2.230

10k+ parts

$2.160

43,047

-

$2.440

$2.230

$2.160

Perfect Parts

USA . 24,427 parts In-Stock

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Lixinc

USA . 11,614 parts In-Stock

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11,614

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SupplyDigital Components

Austria . 7,206 parts In-Stock

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7,206

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Kulean Microsystems

USA . 7,198 parts In-Stock

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TANS Electronics

Latvia . 3,399 parts In-Stock

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3,399

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Authorized Procurement Solutions

USA . 3,000 parts In-Stock

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3,000

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Supply Digital

USA . 2,782 parts In-Stock

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2,782

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Problanco Electronics

Mexico . 2,598 parts In-Stock

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2,598

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Assy Fe

Spain . 1,000 parts In-Stock

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1,000

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Eastek

USA . 750 parts In-Stock

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750

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ChipTracer

USA . 370 parts In-Stock

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370

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UHIMA Technologies

Türkiye . 140 parts In-Stock

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140

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Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Upgrade your power management with the FDP2710 by Onsemi, a top-quality Power Field Effect Transistor designed for switching applications. With a maximum drain current of 50A and a low drain-source on resistance of 0.0425 ohm, this N-channel transistor offers exceptional performance and reliability. The built-in diode and enhancement mode operation make it versatile for various power management needs. Trust Onsemi's reputation for excellence and experience the value and benefits of the FDP2710 in your next project.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the transistor, making it suitable for various applications and environments.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower ON-resistance and higher electron mobility, making them efficient for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for protection against reverse polarity and is convenient for certain circuit designs.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring efficient operation and performance.

Minimum DS Breakdown Voltage: 250 V

With a high breakdown voltage, this transistor can handle high voltage applications with ease.

Package Shape: RECTANGULAR

The rectangular shape allows for easy mounting and integration into circuit designs.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide sturdy connections, making installation and soldering easier.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors can be turned on and off easily, providing precise control over switching applications.

Avalanche Energy Rating (EAS): 145 mJ

The high avalanche energy rating indicates the transistor's ability to withstand high energy spikes.

Maximum Drain Current (Abs) (ID): 50 A

With a high drain current rating, this transistor can handle high current loads without overheating.

No. of Terminals: 3

The 3 terminals provide necessary connections for power and control signals in the circuit.

Maximum Power Dissipation (Abs): 260 W

The high power dissipation rating allows the transistor to handle high power levels efficiently.

Package Style (Meter): FLANGE MOUNT

The flange mount package style allows for secure and reliable mounting in various applications.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high performance and reliability for power applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor can operate in harsh environments without performance degradation.

Transistor Element Material: SILICON

Silicon is a common and reliable semiconductor material known for its performance and durability.

Terminal Finish: MATTE TIN

Matte tin finish provides good conductivity and solderability for reliable connections.

Maximum Drain-Source On Resistance: 0.0425 ohm

The low ON resistance ensures minimal power loss and high efficiency in power applications.

Terminal Position: SINGLE

The single terminal position simplifies installation and connection in circuit designs.

Technical Specifications

Power Field Effect Transistors (FET) FDP2710 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

145 mJ

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain Current (ID):

50 A

Maximum Drain-Source On Resistance:

.0425 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDP2710 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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