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FDMS3006SDC

Onsemi

FDMS3006SDC by Onsemi

FDMS3006SDC by Onsemi is a N-CHANNEL Power FET with 30V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max IDM of 200A, EAS of 144mJ, and ID of 49A. With 0.0019 ohm RDS(on), this MOSFET operates in ENHANCEMENT MODE at up to 150°C, making it suitable for high-power circuits.

Median Price

$1.245

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Adafruit Industries

USA . 270 parts In-Stock

1+ parts

$0.565

100+ parts

$0.514

1k+ parts

$0.463

10k+ parts

-

270

$0.565

$0.514

$0.463

-

Rochester

USA . 4,624 parts In-Stock

1+ parts

-

100+ parts

$1.240

1k+ parts

$1.110

10k+ parts

$1.040

4,624

-

$1.240

$1.110

$1.040

Verical

USA . 2,624 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

$1.387

10k+ parts

$1.300

2,624

-

-

$1.387

$1.300

Mouser Electronics

USA . 55 parts In-Stock

1+ parts

-

100+ parts

-

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$1.250

55

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$1.250

Distributors (In-Stock)

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Digiode

USA . 1,116 parts In-Stock

1+ parts

$0.537

100+ parts

-

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1,116

$0.537

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-

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Vyrian

USA . 1,487 parts In-Stock

1+ parts

$0.565

100+ parts

-

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1,487

$0.565

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Chip Stock

USA . 51,000 parts In-Stock

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51,000

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DigiKey Marketplace

USA . 3,000 parts In-Stock

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3,000

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Distributors (Availability)

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Corphita

USA . 2,397 parts In-Stock

1+ parts

$0.508

100+ parts

-

1k+ parts

-

10k+ parts

-

2,397

$0.508

-

-

-

Advanced Electronics

New Zealand . 270 parts In-Stock

1+ parts

$0.565

100+ parts

$0.514

1k+ parts

$0.463

10k+ parts

-

270

$0.565

$0.514

$0.463

-

Corohmni

South Africa . 496 parts In-Stock

1+ parts

$0.822

100+ parts

-

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496

$0.822

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Component Stockers USA

USA . 2,435 parts In-Stock

1+ parts

$1.390

100+ parts

$1.310

1k+ parts

$1.180

10k+ parts

$1.180

2,435

$1.390

$1.310

$1.180

$1.180

Native Components

USA . 844 parts In-Stock

1+ parts

$65.211

100+ parts

-

1k+ parts

-

10k+ parts

$62.603

844

$65.211

-

-

$62.603

Northwest PG Solutions

USA . 1,437 parts In-Stock

1+ parts

$71.732

100+ parts

-

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1,437

$71.732

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Metaverse IC Inc.

Canada . 50,000 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 25,760 parts In-Stock

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25,760

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Continental Prestige Electronics

USA . 14,624 parts In-Stock

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$1.000

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14,624

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$1.000

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Perfect Parts

USA . 9,783 parts In-Stock

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9,783

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Problanco Electronics

Mexico . 7,760 parts In-Stock

1+ parts

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7,760

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TANS Electronics

Latvia . 6,567 parts In-Stock

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6,567

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Microchip USA

USA . 4,064 parts In-Stock

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4,064

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SupplyDigital Components

Austria . 2,959 parts In-Stock

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2,959

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Supply Digital

USA . 2,332 parts In-Stock

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2,332

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Kulean Microsystems

USA . 1,215 parts In-Stock

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1,215

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UHIMA Technologies

Türkiye . 416 parts In-Stock

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416

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Kepictronics

USA . 50 parts In-Stock

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50

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Overview

Experience the next level of power management with the FDMS3006SDC by Onsemi. As a leading manufacturer in power field effect transistors, Onsemi delivers top-notch quality and reliability in every product. With applications in switching and an N-channel configuration, this transistor offers unmatched performance and efficiency. Its built-in diode and enhancement mode operation make it a versatile choice for a variety of projects. Trust Onsemi to provide the value and benefits you need in a high-quality power FET.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the FET, ensuring reliable operation.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them suitable for high-performance applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, allowing for efficient control of power flow and voltage regulation.

Minimum DS Breakdown Voltage: 30 V

With a minimum breakdown voltage of 30 V, this FET can handle moderate voltage levels in various circuit designs.

Maximum Drain Current (ID): 49 A

Capable of handling high current loads, making it suitable for power-hungry applications.

Technical Specifications

Power Field Effect Transistors (FET) FDMS3006SDC attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

144 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

30 V

Maximum Drain Current (Abs) (ID):

49 A

Maximum Drain Current (ID):

34 A

Maximum Drain-Source On Resistance:

.0019 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

MO-240AA

JESD-30 Code:

R-PDSO-F5

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

5

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

200 A

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

TIN

Terminal Form:

FLAT

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDMS3006SDC Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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