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FDD8445-F085

Onsemi

FDD8445-F085 by Onsemi

FDD8445-F085 by Onsemi is a N-CHANNEL Power FET with 40V DS Breakdown Voltage and 50A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, operates in ENHANCEMENT MODE, and has a max power dissipation of 79W.

Median Price

$1.140

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

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DigiKey

USA . 590 parts In-Stock

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Vyrian

USA . 5,042 parts In-Stock

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Digiode

USA . 1,744 parts In-Stock

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DigiKey Marketplace

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Nova Conductors

Japan . 380 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 1,479 parts In-Stock

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$0.920

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Ampacity Inc.

Singapore . 1,136 parts In-Stock

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$0.970

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Semicontronic

India . 401 parts In-Stock

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$0.970

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$0.946

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$0.941

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401

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Corohmni

South Africa . 186 parts In-Stock

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$1.140

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Andel Nordic

Denmark . 4,097 parts In-Stock

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$8.433

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$8.095

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$8.095

Component Stockers USA

USA . 393 parts In-Stock

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$99.990

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Futuretech Components

Singapore . 50,000 parts In-Stock

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Perfect Parts

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SupplyDigital Components

Austria . 6,477 parts In-Stock

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Argo Parts USA

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A-Z Elektronik GmbH

Germany . 5,250 parts In-Stock

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Kulean Microsystems

USA . 5,127 parts In-Stock

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Problanco Electronics

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Continental Prestige Electronics

USA . 3,153 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 2,108 parts In-Stock

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Supply Digital

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UHIMA Technologies

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Bastille Electronics

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Overview

Discover the power and efficiency of the FDD8445-F085 by Onsemi, a top-tier manufacturer known for high-quality components. This Power Field Effect Transistor (FET) offers unparalleled performance in switching applications, with a built-in diode for added convenience. With a high maximum drain current of 50A and low on-resistance of 0.0087 ohm, this transistor delivers reliable operation and optimal power dissipation. Whether you're designing automotive systems or industrial equipment, the FDD8445-F085 provides the value and reliability you need to excel in your projects. Experience the difference with Onsemi's innovative technology and elevate your designs with the FDD8445-F085.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material offers good protection and durability for the transistor, ensuring a longer lifespan.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance and efficiency compared to P-channel transistors, making this a good choice for power applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for easy and efficient switching and protection in the circuit.

Transistor Application: SWITCHING

This transistor is specifically designed for switching applications, ensuring reliable performance in such scenarios.

Maximum Drain Current (Abs) (ID): 50 A

With a high maximum drain current, this transistor can handle heavy loads and high power requirements effectively.

Maximum Power Dissipation (Abs): 79 W

The high power dissipation rating allows this transistor to handle significant power without overheating, ensuring stable operation.

Maximum Operating Temperature: 175 °C

The high operating temperature range allows for the transistor to be used in a wide variety of environments without risking damage.

Maximum Turn On Time (ton): 138 ns

The fast turn-on time of the transistor ensures quick response and efficient switching in the circuit.

Maximum Turn Off Time (toff): 53 ns

The fast turn-off time prevents any delays in switching operations, improving overall efficiency.

Technical Specifications

Power Field Effect Transistors (FET) FDD8445-F085 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

144 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

40 V

Maximum Drain Current (Abs) (ID):

50 A

Maximum Drain-Source On Resistance:

.0087 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

270 pF

JEDEC-95 Code:

TO-252AA

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

175 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

79 W

Maximum Power Dissipation (Abs):

Qualification:

Not Qualified

Reference Standard:

AEC-Q101

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

53 ns

Maximum Turn On Time (ton):

138 ns

Trade Compliance

FDD8445-F085 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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