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FDC642P-F085P

Onsemi

FDC642P-F085P by Onsemi

The Onsemi FDC642P-F085P is a P-CHANNEL Power FET with 20V DS Breakdown Voltage and 4A Drain Current. Ideal for SWITCHING applications, it features a built-in DIODE, GULL WING terminals, and operates in ENHANCEMENT MODE. With a compact SMALL OUTLINE package and high temp rating of 150°C, it meets AEC-Q101 standards.

Median Price

$0.255

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 98 parts In-Stock

1+ parts

$1.300

100+ parts

$0.576

1k+ parts

$0.352

10k+ parts

$0.239

98

$1.300

$0.576

$0.352

$0.239

Rochester

USA . 185,251 parts In-Stock

1+ parts

-

100+ parts

$0.255

1k+ parts

$0.211

10k+ parts

$0.188

185,251

-

$0.255

$0.211

$0.188

Verical

USA . 148,642 parts In-Stock

1+ parts

-

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-

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$0.235

148,642

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-

$0.235

Flip Electronics (Authorized)

USA . 1,069 parts In-Stock

1+ parts

-

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-

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1,069

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Distributors (In-Stock)

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Digiode

USA . 174 parts In-Stock

1+ parts

$0.152

100+ parts

-

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174

$0.152

-

-

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Greenchips

USA . 2,958 parts In-Stock

1+ parts

$0.195

100+ parts

$0.185

1k+ parts

$0.176

10k+ parts

$0.159

2,958

$0.195

$0.185

$0.176

$0.159

Nova Conductors

Japan . 50 parts In-Stock

1+ parts

$0.290

100+ parts

-

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50

$0.290

-

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Vyrian

USA . 41,749 parts In-Stock

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41,749

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Chip Stock

USA . 39,000 parts In-Stock

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39,000

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ComSIT Distribution GmbH

Germany . 3,985 parts In-Stock

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3,985

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SIE Connect GmbH - GreenChips

Germany . 2,958 parts In-Stock

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2,958

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Flip Electronics

USA . 1,069 parts In-Stock

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1,069

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Distributors (Availability)

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Corohmni

South Africa . 86 parts In-Stock

1+ parts

$0.133

100+ parts

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86

$0.133

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Ampacity Inc.

Singapore . 51,597 parts In-Stock

1+ parts

$0.136

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51,597

$0.136

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Corphita

USA . 1,374 parts In-Stock

1+ parts

$0.144

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1,374

$0.144

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Netroflash

USA . 1,000 parts In-Stock

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$0.290

100+ parts

$0.284

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1,000

$0.290

$0.284

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Infinite Electronics LLP (Excess)

. 234,009 parts In-Stock

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234,009

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Authorized Procurement Solutions

USA . 8,000 parts In-Stock

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8,000

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Problanco Electronics

Mexico . 6,132 parts In-Stock

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6,132

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Formix International (Excess)

India . 6,000 parts In-Stock

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6,000

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Lixinc

USA . 4,632 parts In-Stock

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4,632

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TANS Electronics

Latvia . 4,616 parts In-Stock

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Kulean Microsystems

USA . 1,987 parts In-Stock

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1,987

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SupplyDigital Components

Austria . 260 parts In-Stock

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260

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UHIMA Technologies

Türkiye . 99 parts In-Stock

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99

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Overview

Enhance your power management solutions with the FDC642P-F085P by Onsemi. This high-quality Power Field Effect Transistor (FET) offers reliable performance in switching applications, making it a valuable asset for your projects. With a single configuration and built-in diode, this P-Channel transistor provides efficiency and convenience. Trust Onsemi's expertise and innovation to deliver cutting-edge technology that meets your needs. Upgrade your designs with the FDC642P-F085P and experience the benefits of enhanced power control and superior performance.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides good protection for the internal components of the power FET, ensuring durability and reliability.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies the circuit design and saves space by eliminating the need for an external diode.

Transistor Application: SWITCHING

The power FET is optimized for switching applications, making it suitable for various electronic devices that require efficient switching functionality.

Maximum Pulsed Drain Current (IDM): 20 A

The high maximum pulsed drain current allows the power FET to handle sudden spikes in current without getting damaged, ensuring reliable operation under fluctuating load conditions.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this power FET can withstand elevated temperatures, making it suitable for applications that require extended operation in high-temperature environments.

Technical Specifications

Power Field Effect Transistors (FET) FDC642P-F085P attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

72 mJ

Minimum DS Breakdown Voltage:

20 V

Maximum Drain Current (Abs) (ID):

4 A

Maximum Drain Current (ID):

4 A

Maximum Drain-Source On Resistance:

.065 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PDSO-G6

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

6

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

260

Polarity or Channel Type:

Maximum Power Dissipation Ambient:

1.2 W

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

20 A

Reference Standard:

AEC-Q101

Surface Mount:

YES

Terminal Form:

GULL WING

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

53 ns

Maximum Turn On Time (ton):

23 ns

Trade Compliance

FDC642P-F085P Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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