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FDA33N25

Onsemi

FDA33N25 by Onsemi

The Onsemi FDA33N25 is a N-CHANNEL FET with 250V DS Breakdown Voltage, ideal for SWITCHING applications. It features 132A IDM, 918mJ EAS, and 0.094 ohm RDS(ON). With a max power dissipation of 245W and operating temperature up to 150 °C, it's suitable for high-power ENHANCEMENT MODE operations.

Median Price

$2.180

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

DigiKey

USA . 51,960 parts In-Stock

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$2.180

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Flip Electronics (Authorized)

USA . 500 parts In-Stock

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500

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Flip Electronics

USA . 52,460 parts In-Stock

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52,460

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Chip Stock

USA . 44,000 parts In-Stock

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Vyrian

USA . 7,148 parts In-Stock

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Digiode

USA . 1,106 parts In-Stock

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Lakeland Logistics Inc

USA . 480 parts In-Stock

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480

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Bristol Electronics

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480

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Native Components

USA . 249 parts In-Stock

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$0.168

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$0.161

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Northwest PG Solutions

USA . 1,471 parts In-Stock

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$0.185

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$0.163

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Microchip USA

USA . 316 parts In-Stock

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$19.695

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Perfect Parts

USA . 17,276 parts In-Stock

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Problanco Electronics

Mexico . 7,324 parts In-Stock

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Kulean Microsystems

USA . 5,735 parts In-Stock

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SupplyDigital Components

Austria . 3,450 parts In-Stock

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Corphita

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TANS Electronics

Latvia . 1,478 parts In-Stock

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Supply Digital

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UHIMA Technologies

Türkiye . 580 parts In-Stock

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Authorized Procurement Solutions

USA . 500 parts In-Stock

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Corohmni

South Africa . 58 parts In-Stock

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Overview

Unleash the power of cutting-edge technology with the FDA33N25 Power Field Effect Transistor by Onsemi. Crafted with precision and expertise, this N-CHANNEL transistor offers unparalleled performance in switching applications. With a minimum DS breakdown voltage of 250V and a maximum pulsing drain current of 132A, this transistor is designed to handle even the most demanding tasks with ease. Experience the benefits of enhanced mode operation and a built-in diode for seamless functionality. Elevate your projects with the FDA33N25 and witness the superior quality and reliability that Onsemi is renowned for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the FET, making it reliable for long-term use.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically offer better performance and efficiency compared to P-channel FETs, making this product a good choice for various applications.

Minimum DS Breakdown Voltage: 250 V

With a high breakdown voltage, this FET can handle high voltages, making it suitable for demanding applications where voltage spikes may occur.

Maximum Pulsed Drain Current (IDM): 132 A

The high pulsed drain current rating allows this FET to handle peak current demands, ensuring reliability in high-power applications.

Maximum Power Dissipation (Abs): 245 W

The high power dissipation rating indicates that this FET can handle significant power levels without overheating, making it a robust choice for power applications.

Maximum Operating Temperature: 150 °C

With a high maximum operating temperature, this FET can operate effectively in high-temperature environments without performance degradation.

Technical Specifications

Power Field Effect Transistors (FET) FDA33N25 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

918 mJ

Minimum DS Breakdown Voltage:

250 V

Maximum Drain Current (Abs) (ID):

33 A

Maximum Drain Current (ID):

33 A

Maximum Drain-Source On Resistance:

.094 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

132 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FDA33N25 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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