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FCU340080Z

Onsemi

FCU340080Z by Onsemi

FCU340080Z by Onsemi is a N-CHANNEL Power FET with 800V DS Breakdown Voltage. Ideal for SWITCHING applications, it features a 4A Max Pulsed Drain Current and 12.8mJ Avalanche Energy Rating. Operating in ENHANCEMENT MODE, this transistor has a max power dissipation of 32W and can withstand temperatures from -55 to 150 °C.

Median Price

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Lifecycle Status

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2

In-Stock Inventory

1k+

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Digiode

USA . 2,343 parts In-Stock

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Vyrian

USA . 1,234 parts In-Stock

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TANS Electronics

Latvia . 7,641 parts In-Stock

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Problanco Electronics

Mexico . 3,483 parts In-Stock

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Corphita

USA . 1,780 parts In-Stock

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SupplyDigital Components

Austria . 1,218 parts In-Stock

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Kulean Microsystems

USA . 602 parts In-Stock

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Corohmni

South Africa . 468 parts In-Stock

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Native Components

USA . 373 parts In-Stock

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Northwest PG Solutions

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UHIMA Technologies

Türkiye . 54 parts In-Stock

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Overview

Unleash the power of innovation with the FCU340080Z by Onsemi, a high-quality Power FET that sets the standard for excellence in switching applications. With a robust design and unmatched performance, this N-CHANNEL transistor offers customers unparalleled reliability and efficiency. From its single configuration with built-in diode to its impressive 800V DS breakdown voltage, this FET is a game-changer in the industry. Whether you're looking to enhance your electronics projects or boost your device's capabilities, the FCU340080Z is the ultimate solution. Elevate your technology today with Onsemi's cutting-edge FET technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the FET, ensuring reliability and longevity.

Minimum DS Breakdown Voltage: 800 V

High breakdown voltage allows for safe and efficient operation in high voltage applications.

Maximum Drain-Source On Resistance: 3.4 ohm

Low on-resistance results in less power loss and higher efficiency during switching operations.

Maximum Power Dissipation (Abs): 32 W

High power dissipation capability allows the FET to handle high power loads without overheating.

Maximum Operating Temperature: 150 °C

Wide operating temperature range makes the FET suitable for a variety of environmental conditions.

Technical Specifications

Power Field Effect Transistors (FET) FCU340080Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

12.8 mJ

Minimum DS Breakdown Voltage:

800 V

Maximum Drain Current (Abs) (ID):

2 A

Maximum Drain Current (ID):

2 A

Maximum Drain-Source On Resistance:

3.4 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

.36 pF

JEDEC-95 Code:

TO-251AA

JESD-30 Code:

R-PSIP-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

4 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

93 ns

Maximum Turn On Time (ton):

53 ns

Trade Compliance

FCU340080Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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