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FCPF260N60E-F154

Onsemi

FCPF260N60E-F154 by Onsemi

FCPF260N60E-F154 by Onsemi is a N-CHANNEL FET with 600V DS Breakdown Voltage. Ideal for SWITCHING applications, it features 45A IDM and 292.5mJ EAS. Operating in ENHANCEMENT MODE, it has 0.26 ohm RDS(on) and can handle up to 36W power dissipation.

Median Price

$1.560

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 533 parts In-Stock

1+ parts

-

100+ parts

$1.560

1k+ parts

$1.390

10k+ parts

$1.310

533

-

$1.560

$1.390

$1.310

Distributors (In-Stock)

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Flip Electronics

USA . 10,000 parts In-Stock

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$1.163

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$1.163

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Digiode

USA . 92 parts In-Stock

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$1.634

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92

$1.634

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Vyrian

USA . 8,026 parts In-Stock

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8,026

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Distributors (Availability)

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Native Components

USA . 186 parts In-Stock

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$1.484

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186

$1.484

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Corphita

USA . 1,359 parts In-Stock

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$1.548

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1,359

$1.548

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Northwest PG Solutions

USA . 867 parts In-Stock

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$1.632

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867

$1.632

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Corohmni

South Africa . 367 parts In-Stock

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$1.720

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$1.720

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Microchip USA

USA . 8,234 parts In-Stock

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$11.964

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AZTECH Wire

Italy . 550 parts In-Stock

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$19.010

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SupplyDigital Components

Austria . 8,289 parts In-Stock

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TANS Electronics

Latvia . 7,272 parts In-Stock

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Kulean Microsystems

USA . 2,652 parts In-Stock

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Problanco Electronics

Mexico . 2,255 parts In-Stock

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UHIMA Technologies

Türkiye . 860 parts In-Stock

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Overview

Looking for a reliable power field effect transistor? Look no further than the FCPF260N60E-F154 by Onsemi. With its high-quality construction and N-channel configuration, this transistor is perfect for switching applications. Its single with built-in diode design offers enhanced performance and efficiency. Whether you're in need of a component for industrial equipment or automotive systems, this transistor delivers on both value and reliability. Trust Onsemi to provide the best in semiconductor technology for your electronic needs.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material provides durability and protection for the transistor, ensuring long-lasting performance.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have better performance in high power applications compared to P-channel transistors, making this a good choice for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for more efficient and reliable switching operations.

Transistor Application: SWITCHING

Designed specifically for switching applications, ensuring optimal performance in this type of operation.

Maximum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this transistor can handle high voltage operations safely and efficiently.

Avalanche Energy Rating (EAS): 292.5 mJ

The high avalanche energy rating means the transistor can handle sudden voltage spikes without damage, making it reliable in harsh conditions.

Maximum Power Dissipation (Abs): 36 W

With a high power dissipation rating, this transistor can handle high power loads without overheating.

Maximum Drain Current (ID): 15 A

The high drain current rating allows for handling of large current flows, making it suitable for power applications.

Maximum Drain-Source On Resistance: 0.26 ohm

Low on-resistance results in lower power loss, higher efficiency, and better performance in switching applications.

Technical Specifications

Power Field Effect Transistors (FET) FCPF260N60E-F154 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

292.5 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

15 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

130 pF

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

45 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

224 ns

Maximum Turn On Time (ton):

82 ns

Trade Compliance

FCPF260N60E-F154 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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