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FCPF190N65S3L1

Onsemi

FCPF190N65S3L1 by Onsemi

FCPF190N65S3L1 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. It has 35A IDM, 76mJ EAS, and 0.19 ohm RDS(ON). Ideal for SWITCHING applications in ENHANCEMENT MODE, it operates b/w -55 to 150 °C. Suitable for high-power circuits requiring efficient switching capabilities.

Median Price

$1.222

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 326,740 parts In-Stock

1+ parts

-

100+ parts

$1.200

1k+ parts

$0.996

10k+ parts

$0.888

326,740

-

$1.200

$0.996

$0.888

Verical

USA . 305,590 parts In-Stock

1+ parts

-

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$1.245

10k+ parts

$1.110

305,590

-

-

$1.245

$1.110

Flip Electronics (Authorized)

USA . 134 parts In-Stock

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134

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Digiode

USA . 254 parts In-Stock

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$0.934

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$0.934

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Vyrian

USA . 5,911 parts In-Stock

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Bristol Electronics

USA . 1,700 parts In-Stock

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$1.219

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$0.682

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$0.643

1,700

-

$1.219

$0.682

$0.643

Dan-Mar Components

USA . 1,700 parts In-Stock

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1,700

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ACDS - Activité Composants Distribution Service

France . 850 parts In-Stock

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850

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Flip Electronics

USA . 134 parts In-Stock

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134

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Distributors (Availability)

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Corphita

USA . 1,654 parts In-Stock

1+ parts

$0.885

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$0.885

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Corohmni

South Africa . 291 parts In-Stock

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$0.983

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$0.983

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Microchip USA

USA . 7,838 parts In-Stock

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$12.935

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$12.935

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AZTECH Wire

Italy . 934 parts In-Stock

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$18.500

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$18.500

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Native Components

USA . 88 parts In-Stock

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$21.115

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$21.115

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Northwest PG Solutions

USA . 1,684 parts In-Stock

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$23.226

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$20.904

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$23.226

$20.904

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Continental Prestige Electronics

USA . 324,421 parts In-Stock

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$1.030

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Kepictronics

USA . 71,720 parts In-Stock

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SupplyDigital Components

Austria . 6,992 parts In-Stock

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Problanco Electronics

Mexico . 5,645 parts In-Stock

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Kulean Microsystems

USA . 5,416 parts In-Stock

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TANS Electronics

Latvia . 3,646 parts In-Stock

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Perfect Parts

USA . 2,173 parts In-Stock

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UHIMA Technologies

Türkiye . 577 parts In-Stock

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577

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Overview

Discover the power and efficiency of the FCPF190N65S3L1 by Onsemi, a top-quality Power Field Effect Transistor that offers unrivaled performance in switching applications. With a built-in diode and N-channel configuration, this transistor ensures seamless operation and reliable power control. Whether you're in the automotive, industrial, or consumer electronics industry, this transistor delivers exceptional value and benefits to optimize your systems. Trust Onsemi's expertise and innovation to take your projects to the next level with the FCPF190N65S3L1.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring a longer lifespan for the product.

Minimum DS Breakdown Voltage: 650 V

Capable of handling high voltage applications, making it suitable for a wide range of industrial uses.

Maximum Pulsed Drain Current (IDM): 35 A

Can handle high currents during short bursts, making it suitable for applications requiring quick switching capabilities.

Maximum Power Dissipation (Abs): 33 W

Can dissipate heat effectively, preventing overheating and ensuring optimal performance under high power conditions.

Maximum Operating Temperature: 150 °C

Can withstand high temperatures, making it suitable for use in environments with elevated heat levels.

Technical Specifications

Power Field Effect Transistors (FET) FCPF190N65S3L1 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

76 mJ

Case Connection:

ISOLATED

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

14 A

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

35 A

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCPF190N65S3L1 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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