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FCP9N60N-F102

Onsemi

FCP9N60N-F102 by Onsemi

FCP9N60N-F102 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage and 27A IDM. Ideal for SWITCHING applications, it features a built-in diode, 135mJ EAS rating, and 0.385 ohm RDS(on).

Median Price

$1.506

Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (Authorized)

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DigiKey

USA . 800 parts In-Stock

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$1.200

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Farnell

UK . 800 parts In-Stock

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$1.813

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Flip Electronics (Authorized)

USA . 800 parts In-Stock

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800

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Vyrian

USA . 3,017 parts In-Stock

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Digiode

USA . 1,247 parts In-Stock

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USA . 800 parts In-Stock

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DigiKey Marketplace

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Corohmni

South Africa . 300 parts In-Stock

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$0.853

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$0.853

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Advanced Electronics

New Zealand . 100 parts In-Stock

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$1.117

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$1.016

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$0.916

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Microchip USA

USA . 311 parts In-Stock

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$8.970

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QUARKTWIN TECHNOLOGY LTD

USA . 15,858 parts In-Stock

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TANS Electronics

Latvia . 4,919 parts In-Stock

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Problanco Electronics

Mexico . 3,924 parts In-Stock

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Kulean Microsystems

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Corphita

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SupplyDigital Components

Austria . 1,472 parts In-Stock

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Continental Prestige Electronics

USA . 800 parts In-Stock

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Kepictronics

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Native Components

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UHIMA Technologies

Türkiye . 471 parts In-Stock

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Northwest PG Solutions

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Overview

Enhance the power and efficiency of your electronic devices with the FCP9N60N-F102 by Onsemi. Crafted with precision and quality, this N-CHANNEL Power Field Effect Transistor (FET) offers superior performance in switching applications. With a robust build and a maximum operating temperature of 150 °C, this transistor guarantees reliable operation even under extreme conditions. Trust Onsemi's expertise in semiconductor technology to deliver cutting-edge solutions for your power management needs. Upgrade your devices today and experience the value and benefits that the FCP9N60N-F102 brings to your projects.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Ensures durability and reliability in various operating conditions.

Polarity or Channel Type: N-CHANNEL

Provides efficient switching capabilities for electronic circuits.

Transistor Application: SWITCHING

Designed for high-speed switching applications.

Minimum DS Breakdown Voltage: 600 V

Capable of handling high voltages making it suitable for power applications.

Terminal Form: THROUGH-HOLE

Facilitates easy and secure through-hole mounting.

Maximum Drain-Source On Resistance: 0.385 ohm

Low on-resistance leading to reduced power loss and improved efficiency.

Technical Specifications

Power Field Effect Transistors (FET) FCP9N60N-F102 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

135 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

9 A

Maximum Drain Current (ID):

9 A

Maximum Drain-Source On Resistance:

.385 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

27 A

Surface Mount:

NO

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

114.2 ns

Maximum Turn On Time (ton):

62.8 ns

Trade Compliance

FCP9N60N-F102 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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