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FCP900N65S3Z

Onsemi

FCP900N65S3Z by Onsemi

FCP900N65S3Z by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage. Ideal for SWITCHING applications, it has a Max Drain Current of 4.5A and Max Power Dissipation of 40W. Operating in ENHANCEMENT MODE, this transistor features a 0.9 ohm Drain-Source On Resistance and can handle up to 11.3A Pulsed Drain Current (IDM).

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 2,349 parts In-Stock

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2,349

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Digiode

USA . 390 parts In-Stock

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390

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Native Components

USA . 493 parts In-Stock

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$0.262

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$0.252

493

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$0.252

Northwest PG Solutions

USA . 574 parts In-Stock

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$0.289

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$0.255

574

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SupplyDigital Components

Austria . 7,678 parts In-Stock

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Kulean Microsystems

USA . 6,700 parts In-Stock

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Problanco Electronics

Mexico . 2,620 parts In-Stock

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TANS Electronics

Latvia . 2,521 parts In-Stock

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Corphita

USA . 902 parts In-Stock

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UHIMA Technologies

Türkiye . 811 parts In-Stock

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Corohmni

South Africa . 449 parts In-Stock

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Overview

Enhance your power switching applications with the FCP900N65S3Z by Onsemi. Manufactured with quality and precision in mind, this N-CHANNEL Power Field Effect Transistor offers a built-in diode for seamless operation. From industrial machinery to automotive systems, this transistor provides reliable performance and efficient power management. Experience the value of enhanced mode operation, high breakdown voltage, and low on resistance. Trust Onsemi for cutting-edge technology that delivers superior results. Elevate your projects with the FCP900N65S3Z.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and resistance to external elements, ensuring a longer lifespan for the product.

Polarity or Channel Type: N-CHANNEL

Offers better efficiency and performance in switching applications compared to P-channel transistors.

Configuration: SINGLE WITH BUILT-IN DIODE

Simplifies circuit design and can handle reverse voltage spikes, enhancing overall reliability.

Transistor Application: SWITCHING

Optimized for efficient switching operations, making it ideal for various electronic applications.

Minimum DS Breakdown Voltage: 650 V

Can handle high voltage applications, ensuring reliability and safety in demanding environments.

Maximum Pulsed Drain Current (IDM): 11.3 A

Capable of handling high current spikes, making it suitable for applications requiring peak performance.

Maximum Power Dissipation (Abs): 40 W

Can dissipate heat effectively, preventing overheating and ensuring stable operation under high power conditions.

Maximum Operating Temperature: 150 °C

Can operate in high-temperature environments, providing flexibility for various industrial applications.

Technical Specifications

Power Field Effect Transistors (FET) FCP900N65S3Z attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

4.5 A

Maximum Drain Current (ID):

4.5 A

Maximum Drain-Source On Resistance:

.9 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

11.3 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn)

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCP900N65S3Z Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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