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FCP260N65S3

Onsemi

FCP260N65S3 by Onsemi

FCP260N65S3 by Onsemi is a N-CHANNEL Power FET with 650V DS Breakdown Voltage, ideal for SWITCHING applications. It features a Max Pulsed Drain Current of 30A and an Avalanche Energy Rating of 57mJ. Operating in ENHANCEMENT MODE, it has a Max Power Dissipation of 90W and can handle up to 12A Drain Current.

Median Price

$3.800

Lifecycle Status

Suppliers In-Stock

6

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 456 parts In-Stock

1+ parts

$1.470

100+ parts

$1.390

1k+ parts

$1.250

10k+ parts

-

456

$1.470

$1.390

$1.250

-

DigiKey

USA . 774 parts In-Stock

1+ parts

$3.800

100+ parts

$1.744

1k+ parts

$1.324

10k+ parts

$1.263

774

$3.800

$1.744

$1.324

$1.263

Mouser Electronics

USA . 706 parts In-Stock

1+ parts

$3.800

100+ parts

$1.740

1k+ parts

$1.450

10k+ parts

-

706

$3.800

$1.740

$1.450

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Chip1Stop

Japan . 20 parts In-Stock

1+ parts

$9.490

100+ parts

-

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20

$9.490

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Distributors (In-Stock)

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Digiode

USA . 436 parts In-Stock

1+ parts

$1.396

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436

$1.396

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Vyrian

USA . 2,022 parts In-Stock

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2,022

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Distributors (Availability)

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Corphita

USA . 215 parts In-Stock

1+ parts

$1.323

100+ parts

-

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215

$1.323

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Corohmni

South Africa . 351 parts In-Stock

1+ parts

$1.470

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-

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351

$1.470

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Component Stockers USA

USA . 16 parts In-Stock

1+ parts

$3.430

100+ parts

-

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16

$3.430

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Microchip USA

USA . 11,769 parts In-Stock

1+ parts

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11,769

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Kulean Microsystems

USA . 7,724 parts In-Stock

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7,724

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Kepictronics

USA . 5,000 parts In-Stock

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Perfect Parts

USA . 3,886 parts In-Stock

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3,886

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TANS Electronics

Latvia . 2,385 parts In-Stock

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2,385

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Problanco Electronics

Mexico . 1,708 parts In-Stock

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1,708

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Northwest PG Solutions

USA . 651 parts In-Stock

1+ parts

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$4.127

10k+ parts

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651

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$4.127

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SupplyDigital Components

Austria . 198 parts In-Stock

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UHIMA Technologies

Türkiye . 163 parts In-Stock

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163

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Native Components

USA . 123 parts In-Stock

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$4.085

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123

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$4.085

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GreenTree Electronics

Israel . 120 parts In-Stock

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120

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Authorized Procurement Solutions

USA . 20 parts In-Stock

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20

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Overview

Discover the power of the FCP260N65S3 by Onsemi, a top-quality Power FET designed to enhance your switching applications. With a robust design and built-in diode configuration, this N-Channel transistor offers unparalleled performance and reliability. From its high breakdown voltage to its low on-resistance, this transistor is perfect for various industrial and automotive applications. Trust in Onsemi's expertise and invest in the FCP260N65S3 for efficient and effective power management solutions that will elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body provides durability and protection for the internal components, making this product reliable for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs typically have lower ON-state resistance and higher switching speeds, making them ideal for efficient power management in electronic devices.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and offers protection against reverse polarity, enhancing the overall performance and reliability of the product.

Transistor Application: SWITCHING

Designed for switching applications, this FET offers fast turn-on and turn-off times, making it suitable for power control and efficient energy management in various systems.

Minimum DS Breakdown Voltage: 650 V

The high breakdown voltage allows the FET to handle high voltage loads, making it suitable for applications where voltage spikes or surges may occur.

Terminal Form: THROUGH-HOLE

The through-hole terminals provide a secure physical connection to the circuit board, ensuring reliable performance and ease of assembly.

Operating Mode: ENHANCEMENT MODE

Enhancement mode FETs require a positive voltage to turn on, offering better control and flexibility in power management applications.

Maximum Pulsed Drain Current (IDM): 30 A

The high pulsed drain current rating allows the FET to handle short-term current spikes, making it suitable for applications with dynamic power requirements.

Avalanche Energy Rating (EAS): 57 mJ

The high avalanche energy rating indicates the FET's ability to withstand high energy transients, providing protection against electrical overstress events.

Maximum Power Dissipation (Abs): 90 W

With a high power dissipation rating, this FET can handle significant power levels without overheating, ensuring reliable operation in demanding environments.

Field Effect Transistor Technology: METAL-OXIDE SEMICONDUCTOR

Metal-oxide semiconductor technology offers high efficiency and reliability, making this FET suitable for power switching and control applications.

Maximum Operating Temperature: 150 °C

The high maximum operating temperature allows the FET to operate in high-temperature environments without degradation, ensuring continued performance in challenging conditions.

Transistor Element Material: SILICON

Silicon-based FETs offer excellent electrical properties and reliability, making them a preferred choice for a wide range of power management applications.

Maximum Drain-Source On Resistance: 0.26 ohm

The low ON-resistance of the FET results in reduced power losses and improved efficiency in power switching applications, making it a cost-effective and energy-efficient choice.

Technical Specifications

Power Field Effect Transistors (FET) FCP260N65S3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

57 mJ

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (Abs) (ID):

12 A

Maximum Drain Current (ID):

12 A

Maximum Drain-Source On Resistance:

.26 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

30 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCP260N65S3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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