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FCP20N60

Onsemi

FCP20N60 by Onsemi

FCP20N60 by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage, ideal for SWITCHING applications. It features 20A Max Drain Current, 0.19 ohm Max RDS(on), and 60A IDM. Operating in ENHANCEMENT MODE, it has a max temp of 150°C and comes in a PLASTIC/EPOXY package style.

Median Price

$6.100

Lifecycle Status

Suppliers In-Stock

21

In-Stock Inventory

1k+

Distributors (Authorized)

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Arrow

USA . 3,700 parts In-Stock

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$2.532

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$2.532

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Mouser Electronics

USA . 860 parts In-Stock

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$5.560

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$3.020

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$2.810

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860

$5.560

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$2.810

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Newark

USA . 139 parts In-Stock

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$6.100

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$3.960

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$3.850

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139

$6.100

$3.960

$3.850

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DigiKey

USA . 1,690 parts In-Stock

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$6.220

100+ parts

$3.015

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$2.454

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1,690

$6.220

$3.015

$2.454

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Chip1Stop

Japan . 4,044 parts In-Stock

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$16.200

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$7.280

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$4.690

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4,044

$16.200

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Verical

USA . 3,700 parts In-Stock

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3,700

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Distributors (In-Stock)

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Nova Conductors

Japan . 100 parts In-Stock

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$2.835

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100

$2.835

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Digiode

USA . 1,638 parts In-Stock

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$3.581

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TME

Poland . 29 parts In-Stock

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$4.740

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$3.470

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Vyrian

USA . 2,398 parts In-Stock

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Flip Electronics

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NAC Semi

USA . 900 parts In-Stock

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$12.500

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$11.540

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Cyclops Electronics Ltd

UK . 148 parts In-Stock

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Sensible Micro Corp

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Pegasus Components GmbH

Germany . 49 parts In-Stock

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Ack Elektronik San.Tic.Ltd.Sti

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Component Electronics Inc.

Canada . 20 parts In-Stock

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Prism Electronics

USA . 16 parts In-Stock

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ComSIT Distribution GmbH

Germany . 13 parts In-Stock

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LWI Electronics Inc

India . 10 parts In-Stock

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Sunrise Surplus Inc.

USA . 8 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,850 parts In-Stock

1+ parts

$1.494

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3,850

$1.494

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Ampacity Inc.

Singapore . 1,979 parts In-Stock

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$2.110

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1,979

$2.110

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Corohmni

South Africa . 123 parts In-Stock

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$2.778

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123

$2.778

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Argo Parts USA

USA . 4,710 parts In-Stock

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$2.835

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4,710

$2.835

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Continental Prestige Electronics

USA . 1,995 parts In-Stock

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$2.835

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$2.778

1,995

$2.835

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$2.778

Netroflash

USA . 1,000 parts In-Stock

1+ parts

$2.835

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$2.778

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1,000

$2.835

$2.778

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Corphita

USA . 1,917 parts In-Stock

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$3.392

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$3.392

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Semicontronic

India . 1,642 parts In-Stock

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$4.580

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$4.466

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$4.443

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1,642

$4.580

$4.466

$4.443

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Microchip USA

USA . 7,272 parts In-Stock

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$15.428

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7,272

$15.428

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Metaverse IC Inc.

Canada . 80,000 parts In-Stock

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Perfect Parts

USA . 49,428 parts In-Stock

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A-Z Elektronik GmbH

Germany . 10,889 parts In-Stock

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Problanco Electronics

Mexico . 7,679 parts In-Stock

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Kulean Microsystems

USA . 6,549 parts In-Stock

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Lixinc

USA . 6,108 parts In-Stock

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Kepictronics

USA . 5,800 parts In-Stock

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GreenTree Electronics

Israel . 4,644 parts In-Stock

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TANS Electronics

Latvia . 4,572 parts In-Stock

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Authorized Procurement Solutions

USA . 4,544 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,759 parts In-Stock

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3,759

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SupplyDigital Components

Austria . 3,525 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

USA . 3,414 parts In-Stock

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Formix International (Excess)

India . 2,556 parts In-Stock

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S.R.D Solutions

India . 2,000 parts In-Stock

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Advanced Electronics

New Zealand . 750 parts In-Stock

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750

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Robosynatics

Brazil . 500 parts In-Stock

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$33.100

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$33.100

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$33.100

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$33.100

$33.100

$33.100

Lucentia Tech

USA . 500 parts In-Stock

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$33.100

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$33.100

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$33.100

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$33.100

$33.100

Supply Digital

USA . 373 parts In-Stock

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Eastek

USA . 250 parts In-Stock

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Andel Nordic

Denmark . 204 parts In-Stock

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UHIMA Technologies

Türkiye . 116 parts In-Stock

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Overview

Unleash the power of innovation with the FCP20N60 by Onsemi. Crafted with precision and expertise, this Power Field Effect Transistor (FET) is designed to elevate your electrical applications to new heights. With a single configuration and built-in diode, this N-channel transistor is perfect for switching tasks. Whether you're looking to enhance performance or increase efficiency, the FCP20N60 offers a breakthrough solution that delivers on quality, reliability, and value. Upgrade your projects today with the cutting-edge technology of Onsemi's FCP20N60.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy as the package body material makes the transistor lightweight and durable, ideal for various applications.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage of 600V, this transistor can handle high voltage applications effectively and safely.

Maximum Pulsed Drain Current (IDM): 60 A

The high pulsed drain current rating of 60A allows for efficient switching capabilities and handling of peak currents.

Avalanche Energy Rating (EAS): 690 mJ

The high avalanche energy rating of 690 mJ ensures reliable performance under transient conditions and protects the transistor from damage.

Maximum Operating Temperature: 150 °C

With a maximum operating temperature of 150°C, this transistor can operate in high-temperature environments without compromising performance.

Technical Specifications

Power Field Effect Transistors (FET) FCP20N60 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

690 mJ

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

20 A

Maximum Drain-Source On Resistance:

.19 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-220AB

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

60 A

Qualification:

Not Qualified

Surface Mount:

NO

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCP20N60 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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