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FCH070N60E

Onsemi

FCH070N60E by Onsemi

FCH070N60E by Onsemi is a N-CHANNEL Power FET with 600V DS Breakdown Voltage and 156A IDM. Ideal for SWITCHING applications, it features a single configuration with built-in diode, 0.07 ohm Drain-Source Resistance, and 1128mJ Avalanche Energy Rating.

Median Price

$5.176

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

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Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mouser Electronics

USA . 889 parts In-Stock

1+ parts

$9.050

100+ parts

-

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$4.680

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889

$9.050

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$4.680

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DigiKey

USA . 443 parts In-Stock

1+ parts

$9.050

100+ parts

$5.311

1k+ parts

$4.037

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443

$9.050

$5.311

$4.037

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Arrow

USA . 3,840 parts In-Stock

1+ parts

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$5.176

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$4.103

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3,840

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$5.176

$4.103

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Verical

USA . 3,840 parts In-Stock

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$5.176

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$4.103

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3,840

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$5.176

$4.103

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Rochester

USA . 274 parts In-Stock

1+ parts

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$4.040

1k+ parts

$3.610

10k+ parts

$3.400

274

-

$4.040

$3.610

$3.400

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,094 parts In-Stock

1+ parts

$4.056

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3,094

$4.056

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Nova Conductors

Japan . 24 parts In-Stock

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$6.127

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24

$6.127

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Chip Stock

USA . 47,000 parts In-Stock

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Flip Electronics

USA . 450 parts In-Stock

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450

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Vyrian

USA . 151 parts In-Stock

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151

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Distributors (Availability)

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Ampacity Inc.

Singapore . 32 parts In-Stock

1+ parts

$3.630

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32

$3.630

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Corphita

USA . 2,805 parts In-Stock

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$3.843

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2,805

$3.843

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Corohmni

South Africa . 150 parts In-Stock

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$4.270

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150

$4.270

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Continental Prestige Electronics

USA . 1,264 parts In-Stock

1+ parts

$6.005

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$5.885

1,264

$6.005

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$5.885

AZTECH Wire

Italy . 213 parts In-Stock

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$9.280

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213

$9.280

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Microchip USA

USA . 7,484 parts In-Stock

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$29.344

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Lixinc

USA . 15,188 parts In-Stock

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TANS Electronics

Latvia . 6,469 parts In-Stock

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RC Electronics

USA . 5,270 parts In-Stock

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$4.690

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$4.280

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$4.150

5,270

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$4.690

$4.280

$4.150

Problanco Electronics

Mexico . 4,905 parts In-Stock

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Kulean Microsystems

USA . 4,214 parts In-Stock

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SupplyDigital Components

Austria . 2,377 parts In-Stock

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Supply Digital

USA . 2,311 parts In-Stock

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Netroflash

USA . 2,000 parts In-Stock

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$6.005

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$5.821

10k+ parts

$5.699

2,000

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$6.005

$5.821

$5.699

Argo Parts USA

USA . 1,727 parts In-Stock

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Perfect Parts

USA . 1,590 parts In-Stock

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Authorized Procurement Solutions

USA . 290 parts In-Stock

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GreenTree Electronics

Israel . 90 parts In-Stock

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UHIMA Technologies

Türkiye . 73 parts In-Stock

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Overview

Discover the unparalleled performance of the FCH070N60E power field effect transistor by Onsemi. With a reputation for superior quality and reliability, Onsemi delivers cutting-edge technology in every product. Ideal for switching applications, this N-channel transistor offers a single configuration with a built-in diode, ensuring seamless operation. From enhanced mode operation to a maximum breakthrough voltage of 600V, this transistor provides unmatched value and efficiency. Elevate your projects with the FCH070N60E and experience the innovation and excellence that Onsemi is known for.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures durability and protection for the transistor, making it a reliable option for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel transistors typically have lower on-state resistance and higher current carrying capability, making them efficient for switching applications.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode simplifies circuit design and can help protect against reverse current flow, making the transistor versatile and user-friendly.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers fast switching speeds and efficient performance in high-power scenarios.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this transistor can handle higher voltages without breakdown, ensuring reliable operation in demanding conditions.

Maximum Pulsed Drain Current (IDM): 156 A

High pulsed drain current rating allows the transistor to handle short spikes of high current, making it suitable for applications with varying load conditions.

Maximum Power Dissipation (Abs): 481 W

The high power dissipation rating ensures the transistor can handle high power loads without overheating, making it suitable for high-power applications.

Maximum Operating Temperature: 150 °C

With a high operating temperature range, this transistor can perform reliably in a wide range of environmental conditions.

Maximum Turn Off Time (toff): 320 ns

Fast turn-off time ensures efficient operation and reduces switching losses, making this transistor ideal for high-speed switching applications.

Maximum Drain-Source On Resistance: 0.07 ohm

Low on-resistance results in reduced power losses and improved efficiency, making this transistor a great choice for high-current applications.

Technical Specifications

Power Field Effect Transistors (FET) FCH070N60E attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

1128 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (ID):

52 A

Maximum Drain-Source On Resistance:

.07 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

Maximum Feedback Capacitance (Crss):

20 pF

JEDEC-95 Code:

TO-247

JESD-30 Code:

R-PSFM-T3

JESD-609 Code:

e3

No. of Elements:

1

No. of Terminals:

3

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

FLANGE MOUNT

Peak Reflow Temperature (C):

NOT SPECIFIED

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

156 A

Surface Mount:

NO

Terminal Finish:

Matte Tin (Sn) - annealed

Terminal Form:

THROUGH-HOLE

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Maximum Turn Off Time (toff):

320 ns

Maximum Turn On Time (ton):

134 ns

Trade Compliance

FCH070N60E Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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