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FCB199N65S3

Onsemi

FCB199N65S3 by Onsemi

FCB199N65S3 by Onsemi is a N-CHANNEL FET with 650V DS Breakdown Voltage and 35A IDM. Ideal for SWITCHING applications, it features 0.199 ohm Drain-Source Resistance and 76mJ EAS rating. Suitable for ENHANCEMENT MODE operation in various electronic systems.

Median Price

$4.170

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Chip1Stop

Japan . 800 parts In-Stock

1+ parts

$4.170

100+ parts

$2.200

1k+ parts

$1.900

10k+ parts

$1.650

800

$4.170

$2.200

$1.900

$1.650

Mouser Electronics

USA . 5,878 parts In-Stock

1+ parts

$4.820

100+ parts

$2.280

1k+ parts

$2.020

10k+ parts

-

5,878

$4.820

$2.280

$2.020

-

DigiKey

USA . 578 parts In-Stock

1+ parts

$5.160

100+ parts

$2.430

1k+ parts

$1.789

10k+ parts

$1.743

578

$5.160

$2.430

$1.789

$1.743

Verical

USA . 6,400 parts In-Stock

1+ parts

-

100+ parts

-

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$1.754

10k+ parts

-

6,400

-

-

$1.754

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Rochester

USA . 399 parts In-Stock

1+ parts

-

100+ parts

$1.740

1k+ parts

$1.560

10k+ parts

$1.460

399

-

$1.740

$1.560

$1.460

Distributors (In-Stock)

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Digiode

USA . 2,338 parts In-Stock

1+ parts

$1.843

100+ parts

-

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2,338

$1.843

-

-

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Vyrian

USA . 492 parts In-Stock

1+ parts

$1.940

100+ parts

-

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492

$1.940

-

-

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Flip Electronics

USA . 6,400 parts In-Stock

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-

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6,400

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Chip Stock

USA . 1,125 parts In-Stock

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1,125

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-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 605 parts In-Stock

1+ parts

$1.746

100+ parts

-

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605

$1.746

-

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Corohmni

South Africa . 291 parts In-Stock

1+ parts

$2.030

100+ parts

-

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291

$2.030

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Microchip USA

USA . 6,732 parts In-Stock

1+ parts

$15.949

100+ parts

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6,732

$15.949

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SupplyDigital Components

Austria . 7,231 parts In-Stock

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7,231

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Kulean Microsystems

USA . 4,460 parts In-Stock

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4,460

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Perfect Parts

USA . 3,189 parts In-Stock

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3,189

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TANS Electronics

Latvia . 2,490 parts In-Stock

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2,490

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Northwest PG Solutions

USA . 1,961 parts In-Stock

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1,961

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Problanco Electronics

Mexico . 1,676 parts In-Stock

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1,676

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UHIMA Technologies

Türkiye . 807 parts In-Stock

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807

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Native Components

USA . 539 parts In-Stock

1+ parts

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539

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ChipstoGo Electronic ltd

UK . 146 parts In-Stock

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146

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Overview

Experience the power of innovation with the FCB199N65S3 by Onsemi. Designed with cutting-edge technology and precision engineering, this N-CHANNEL Power Field Effect Transistor offers unparalleled performance in switching applications. With a minimum DS Breakdown Voltage of 650V and a maximum Drain Current of 14A, this transistor delivers reliability and efficiency like never before. Whether you're looking to enhance your electronic devices or optimize power management systems, the FCB199N65S3 is the perfect solution for all your needs. Trust Onsemi for quality, trust FCB199N65S3 for excellence.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides good electrical insulation, durability, and protection for the internal components of the transistor.

Polarity or Channel Type: N-CHANNEL

N-channel Power FETs typically have lower ON-resistance and higher efficiency compared to P-channel FETs, making them a preferred choice for switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, this transistor offers high-speed performance and efficient power management capabilities.

Minimum DS Breakdown Voltage: 650 V

With a high breakdown voltage, this transistor can handle larger voltage differences across its terminals, making it suitable for high power applications.

Operating Mode: ENHANCEMENT MODE

Enhancement mode transistors are normally-off devices, providing better control over power flow and reducing the risk of accidental activation.

Maximum Pulsed Drain Current (IDM): 35 A

Capable of handling high pulsed current loads, this transistor is suitable for applications that require short bursts of power.

Avalanche Energy Rating (EAS): 76 mJ

With a high avalanche energy rating, this transistor can safely handle energy spikes and transient overloads without getting damaged.

Maximum Drain Current (ID): 14 A

Capable of handling continuous current flow up to 14 A, this transistor is suitable for medium to high power applications.

Maximum Drain-Source On Resistance: 0.199 ohm

Low on-resistance leads to lower power dissipation and higher efficiency, making this transistor ideal for high-performance applications.

Peak Reflow Temperature °C: 245

High peak reflow temperature allows for reliable soldering during assembly, ensuring consistent performance in various operating conditions.

Technical Specifications

Power Field Effect Transistors (FET) FCB199N65S3 attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

76 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

650 V

Maximum Drain Current (ID):

14 A

Maximum Drain-Source On Resistance:

.199 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263AB

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Minimum Operating Temperature:

-55 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Pulsed Drain Current (IDM):

35 A

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCB199N65S3 Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8541.29.00.95

SB

8541.29.00.80

PCN

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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