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FCB11N60TM

Onsemi

FCB11N60TM by Onsemi

FCB11N60TM by Onsemi is a N-CHANNEL FET with 600V DS Breakdown Voltage, 33A IDM, and 0.38 ohm RDS(on). Ideal for SWITCHING applications due to its 125W power dissipation, ENHANCEMENT MODE operation, and built-in DIODE. Suitable for high-power electronics requiring efficient switching capabilities.

Median Price

$3.350

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

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RS (Exports)

UK . 2,221 parts In-Stock

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$1.810

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$1.280

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$1.240

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Arrow

USA . 733 parts In-Stock

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$3.350

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$1.928

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$1.684

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733

$3.350

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Mouser Electronics

USA . 828 parts In-Stock

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$4.390

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$2.060

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$1.780

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828

$4.390

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$1.780

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Chip1Stop

Japan . 770 parts In-Stock

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$4.390

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$2.030

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$1.680

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$1.580

770

$4.390

$2.030

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$1.580

DigiKey

USA . 998 parts In-Stock

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$4.400

100+ parts

$2.054

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$1.610

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$1.543

998

$4.400

$2.054

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$1.543

Rochester

USA . 281,396 parts In-Stock

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$1.530

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$1.370

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$1.290

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Verical

USA . 277,967 parts In-Stock

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$1.613

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Distributors (In-Stock)

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Digiode

USA . 1,537 parts In-Stock

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$1.624

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Nova Conductors

Japan . 21 parts In-Stock

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$1.722

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Vyrian

USA . 120,328 parts In-Stock

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Flip Electronics

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Diverse Electronics

Canada . 402 parts In-Stock

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Chip Stock

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Bristol Electronics

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Lantek

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Continental Prestige Electronics

USA . 286,043 parts In-Stock

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$1.410

100+ parts

$1.260

1k+ parts

$1.070

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286,043

$1.410

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$1.070

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Ampacity Inc.

Singapore . 119,864 parts In-Stock

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$1.450

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Corphita

USA . 2,200 parts In-Stock

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$1.539

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$1.539

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Corohmni

South Africa . 351 parts In-Stock

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$1.654

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351

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Aranea Global

USA . 500 parts In-Stock

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$1.688

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$1.620

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500

$1.688

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$1.620

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Argo Parts USA

USA . 4,083 parts In-Stock

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$1.722

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Component Stockers USA

USA . 383,768 parts In-Stock

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$1.760

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$1.650

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$1.500

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$1.500

383,768

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$1.500

Microchip USA

USA . 6,983 parts In-Stock

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$14.116

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Metaverse IC Inc.

Canada . 58,368 parts In-Stock

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QUARKTWIN TECHNOLOGY LTD

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Lixinc

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A-Z Elektronik GmbH

Germany . 9,947 parts In-Stock

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TANS Electronics

Latvia . 6,928 parts In-Stock

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Perfect Parts

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Glotronic Ltd.

UK . 3,900 parts In-Stock

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Kulean Microsystems

USA . 3,592 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,131 parts In-Stock

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SupplyDigital Components

Austria . 3,024 parts In-Stock

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Supply Digital

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UHIMA Technologies

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Eastek

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Problanco Electronics

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iodParts Technologies Inc.

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GreenTree Electronics

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Overview

Upgrade your power systems with the FCB11N60TM from Onsemi, a high-quality N-CHANNEL Power Field Effect Transistor (FET) that offers unparalleled performance and reliability. With a maximum operating temperature of 150°C and an impressive 600V minimum DS breakdown voltage, this transistor is perfect for switching applications where efficiency is key. Its single configuration with built-in diode makes installation a breeze, while the small outline package allows for easy integration into your designs. Trust Onsemi's expertise in semiconductor technology and enhance your systems with the FCB11N60TM today!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the product lightweight and durable, ideal for various applications.

Polarity or Channel Type: N-CHANNEL

N-channel FETs generally have lower ON resistance and higher switching speeds compared to P-channel FETs, making them efficient in many electronic circuits.

Configuration: SINGLE WITH BUILT-IN DIODE

The built-in diode allows for efficient freewheeling and protection against voltage spikes in switching applications.

Transistor Application: SWITCHING

Designed specifically for switching applications, providing fast and efficient switching characteristics.

Surface Mount: YES

Suitable for surface mount applications, making it easy to integrate into compact electronic designs.

Minimum DS Breakdown Voltage: 600 V

With a high breakdown voltage, this FET is suitable for high voltage applications, providing robust performance.

Maximum Pulsed Drain Current (IDM): 33 A

Capable of handling high pulsed currents, making it suitable for applications where temporary high current spikes occur.

Maximum Power Dissipation (Abs): 125 W

With high power dissipation capabilities, this FET can handle high power loads without overheating.

Maximum Operating Temperature: 150 °C

Can operate at high temperatures without performance degradation, suitable for industrial and automotive applications.

Technical Specifications

Power Field Effect Transistors (FET) FCB11N60TM attributes and parameters. Explore more Power Field Effect Transistors (FET) devices from Onsemi

Specs

Avalanche Energy Rating (EAS):

340 mJ

Case Connection:

DRAIN

Minimum DS Breakdown Voltage:

600 V

Maximum Drain Current (Abs) (ID):

11 A

Maximum Drain Current (ID):

11 A

Maximum Drain-Source On Resistance:

.38 ohm

Field Effect Transistor Technology:

METAL-OXIDE SEMICONDUCTOR

JEDEC-95 Code:

TO-263

JESD-30 Code:

R-PSSO-G2

JESD-609 Code:

e3

Moisture Sensitivity Level (MSL):

1

No. of Elements:

1

No. of Terminals:

2

Operating Mode:

ENHANCEMENT MODE

Maximum Operating Temperature:

150 Cel

Package Body Material:

PLASTIC/EPOXY

Package Shape:

RECTANGULAR

Package Style (Meter):

SMALL OUTLINE

Peak Reflow Temperature (C):

245

Polarity or Channel Type:

Maximum Power Dissipation (Abs):

Maximum Pulsed Drain Current (IDM):

33 A

Qualification:

Not Qualified

Sub-Category:

FET General Purpose Power

Surface Mount:

YES

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Position:

SINGLE

Maximum Time At Peak Reflow Temperature (s):

30

Transistor Application:

SWITCHING

Transistor Element Material:

SILICON

Trade Compliance

FCB11N60TM Transistors trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

Manufacturer Highlights

Onsemi

Established in 1999, Onsemi is a leading global provider of power and image-sensing technologies. They are dedicated to building a better future for the automotive, industrial, cloud, medical, and IoT markets. Onsemi's core technologies include analog, digital, and mixed-signal products that offer innovative solutions for advanced automotive systems; highly reliable power management products for industrial applications; low-cost imaging solutions for medical equipment and consumer electronics; and robust communication architectures for the Internet of Things (IoT).

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Management team

President, CEO

Hassane El-Khoury

Executive VP, CFO, Treasurer

Thad Trent

Senior VP

Ross F. Jatou

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

Aizu Fab

Fabrication

Fab Initiation

1995

Japan

Aizu Wakamatsu

Wafer Capacity

52,000

1995

52,000

Si/EPI Fab

Fabrication

Fab Initiation

2018

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

10,000

2018

10,000

Expansion Phase 1 for SiC / EPI

Fabrication

Fab Initiation

2019

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

14,500

2019

14,500

Expansion Phase 2 for SiC / EPI

Fabrication

Fab Initiation

2024

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

2024

SiC Fab

Fabrication

Fab Initiation

2022

USA

Hudson

Wafer Capacity

2022

Bucheon

Fabrication

Fab Initiation

2013

South Korea

Bucheon

Wafer Capacity

61,000

2013

61,000

ISMF - Malaysia

Fabrication

Fab Initiation

1990

Malaysia

Seremban

Wafer Capacity

95,000

1990

95,000

Roznov Device Fab

Fabrication

Fab Initiation

1987

Czech Republic

Rožnov pod Radhoštěm

Wafer Capacity

80,000

1987

80,000

Fab 10

Fabrication

Fab Initiation

2002

USA

East Fishkill

Wafer Capacity

15,000

2002

15,000

Burlington

Fabrication

Fab Initiation

1986

Canada

Burlington

Wafer Capacity

1986

Gresham

Fabrication

Fab Initiation

1998

USA

Gresham

Wafer Capacity

45,000

1998

45,000

Bucheon 150mm

Fabrication

Fab Initiation

2000

South Korea

Bucheon

Wafer Capacity

50,000

2000

50,000

Rochester

Fabrication

Fab Initiation

1983

USA

Rochester

Wafer Capacity

10,000

1983

10,000

Nampa

Fabrication

Fab Initiation

1995

USA

Nampa

Wafer Capacity

1995

Pennsylvania

Fabrication

Fab Initiation

1997

USA

Mountain Top

Wafer Capacity

36,000

1997

36,000

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